JPH0433156B2 - - Google Patents
Info
- Publication number
- JPH0433156B2 JPH0433156B2 JP59030525A JP3052584A JPH0433156B2 JP H0433156 B2 JPH0433156 B2 JP H0433156B2 JP 59030525 A JP59030525 A JP 59030525A JP 3052584 A JP3052584 A JP 3052584A JP H0433156 B2 JPH0433156 B2 JP H0433156B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- solder
- wiring conductor
- forming
- solder layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 229920001721 polyimide Polymers 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 39
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000013020 steam cleaning Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3052584A JPS60175485A (ja) | 1984-02-20 | 1984-02-20 | はんだ層形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3052584A JPS60175485A (ja) | 1984-02-20 | 1984-02-20 | はんだ層形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60175485A JPS60175485A (ja) | 1985-09-09 |
| JPH0433156B2 true JPH0433156B2 (xx) | 1992-06-02 |
Family
ID=12306221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3052584A Granted JPS60175485A (ja) | 1984-02-20 | 1984-02-20 | はんだ層形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60175485A (xx) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0682707B2 (ja) * | 1988-10-21 | 1994-10-19 | 日本電気株式会社 | 半導体装置 |
| JP4748889B2 (ja) * | 2000-12-26 | 2011-08-17 | イビデン株式会社 | 多層プリント配線板の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5787195A (en) * | 1980-11-20 | 1982-05-31 | Kenwood Corp | Printed circuit |
-
1984
- 1984-02-20 JP JP3052584A patent/JPS60175485A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5787195A (en) * | 1980-11-20 | 1982-05-31 | Kenwood Corp | Printed circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60175485A (ja) | 1985-09-09 |
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