JPH0426240B2 - - Google Patents
Info
- Publication number
- JPH0426240B2 JPH0426240B2 JP11121283A JP11121283A JPH0426240B2 JP H0426240 B2 JPH0426240 B2 JP H0426240B2 JP 11121283 A JP11121283 A JP 11121283A JP 11121283 A JP11121283 A JP 11121283A JP H0426240 B2 JPH0426240 B2 JP H0426240B2
- Authority
- JP
- Japan
- Prior art keywords
- powdered
- resin material
- circuit board
- resin
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 41
- 239000011347 resin Substances 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 15
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 150000004982 aromatic amines Chemical class 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 2
- -1 phosphonium compound Chemical class 0.000 claims description 2
- 238000001723 curing Methods 0.000 description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000001879 gelation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58111212A JPS603188A (ja) | 1983-06-20 | 1983-06-20 | 混成集積回路板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58111212A JPS603188A (ja) | 1983-06-20 | 1983-06-20 | 混成集積回路板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS603188A JPS603188A (ja) | 1985-01-09 |
| JPH0426240B2 true JPH0426240B2 (enrdf_load_stackoverflow) | 1992-05-06 |
Family
ID=14555362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58111212A Granted JPS603188A (ja) | 1983-06-20 | 1983-06-20 | 混成集積回路板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS603188A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6606468B2 (en) | 2001-01-30 | 2003-08-12 | Ricoh Company, Ltd. | Toner scatter preventing device and image forming apparatus using the same |
| JP5074882B2 (ja) * | 2006-10-24 | 2012-11-14 | 三井金属鉱業株式会社 | 多層プリント配線板の製造方法及びその製造方法で得られた多層プリント配線板 |
| JP6302264B2 (ja) | 2013-08-28 | 2018-03-28 | 三菱重工業株式会社 | 冷却装置および原子力設備 |
-
1983
- 1983-06-20 JP JP58111212A patent/JPS603188A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS603188A (ja) | 1985-01-09 |
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