JPH04254477A - ガラス−窒化アルミニウム複合材料 - Google Patents

ガラス−窒化アルミニウム複合材料

Info

Publication number
JPH04254477A
JPH04254477A JP3033345A JP3334591A JPH04254477A JP H04254477 A JPH04254477 A JP H04254477A JP 3033345 A JP3033345 A JP 3033345A JP 3334591 A JP3334591 A JP 3334591A JP H04254477 A JPH04254477 A JP H04254477A
Authority
JP
Japan
Prior art keywords
glass
aluminum nitride
composite material
nitride composite
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3033345A
Other languages
English (en)
Inventor
Akira Yamakawa
晃 山川
Koichi Sogabe
浩一 曽我部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP3033345A priority Critical patent/JPH04254477A/ja
Priority to US07/820,550 priority patent/US5214005A/en
Priority to CA002060239A priority patent/CA2060239C/en
Priority to DE69204319T priority patent/DE69204319T2/de
Priority to EP92101704A priority patent/EP0499865B1/en
Publication of JPH04254477A publication Critical patent/JPH04254477A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/71—Ceramic products containing macroscopic reinforcing agents
    • C04B35/78—Ceramic products containing macroscopic reinforcing agents containing non-metallic materials
    • C04B35/80—Fibres, filaments, whiskers, platelets, or the like
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/04—Particles; Flakes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/06—Whiskers ss
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/36—Glass starting materials for making ceramics, e.g. silica glass
    • C04B2235/365—Borosilicate glass
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/38—Non-oxide ceramic constituents or additives
    • C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
    • C04B2235/3865—Aluminium nitrides
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/38—Non-oxide ceramic constituents or additives
    • C04B2235/3895—Non-oxides with a defined oxygen content, e.g. SiOC, TiON
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/52—Constituents or additives characterised by their shapes
    • C04B2235/5208—Fibers
    • C04B2235/5216—Inorganic
    • C04B2235/524—Non-oxidic, e.g. borides, carbides, silicides or nitrides
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/52—Constituents or additives characterised by their shapes
    • C04B2235/5208—Fibers
    • C04B2235/526—Fibers characterised by the length of the fibers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/52—Constituents or additives characterised by their shapes
    • C04B2235/5208—Fibers
    • C04B2235/5264—Fibers characterised by the diameter of the fibers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/52—Constituents or additives characterised by their shapes
    • C04B2235/5276—Whiskers, spindles, needles or pins
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54—Particle size related information
    • C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54—Particle size related information
    • C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/602—Making the green bodies or pre-forms by moulding
    • C04B2235/6025—Tape casting, e.g. with a doctor blade
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Products (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は、高熱伝導性のガラス−
窒化アルミニウム複合体に関するもので、特に半導体パ
ッケージ用材料として好適な特性をもつものである。
【０００２】
【従来の技術】エレクトロニクス素子の高速化、高集積
化が急速に進展しており、そのため素子を搭載する絶縁
基板、パッケージ材料に対する要求が高度化している。 特に発熱密度の増大に対する高熱伝導性、高速化に対す
る低誘電率、導体抵抗の低下が必要とされる。高熱伝導
性材料については、ＢｅＯ、ＳｉＣに加えて、ＡｌＮ材
料の開発が進展している。一方、低誘電率化、導体抵抗
の低下については、高熱伝導性材料では対応できず、ガ
ラス−セラミック複合材料の開発に力が注がれている、
しかるに、ガラス−セラミックス複合材料は熱伝導率が
低く、又、機械強度も低いため、満足のいく特性が得ら
れない。そのため、さらにガラスと高熱伝導性粉末を複
合化し、要求に応えることが検討されている。例えば、
特開昭６３−２１００４３号公報には、ガラスと窒化ア
ルミニウム粉との複合体が開示され、誘電率５〜７、熱
伝導率２０ｗ／ｍｋの熱伝導性が得られている。又、特
開平２−２２１１６２公報、特開平２−１９６０７３号
公報には、さらに窒化アルミニウムの酸素量の規定等で
若干の熱伝導率向上が達成された。
【０００３】
【発明が解決しようとする課題】上記従来知られている
ガラス−窒化アルミニウム系複合体は、熱伝導率向上の
点で未だ不充分であるばかりでなく、基板強度の点でも
不満足で、従来の低温焼成基板の性能を向上させた程度
に止まり、さらに高度な要求特性を満足せしめるには至
っていない。本発明では、特に低誘電率で高熱伝導のガ
ラス複合体において、熱伝導性をさらに向上させ、その
上強度の高い材料を提供するものである。
【０００４】
【課題を解決するための手段】本発明は、酸素含有量　
２％未満で平均粒径　１．０μｍ　以上の窒化アルミニ
ウム粒にガラス粉末を加えて成形焼結してなり、熱伝導
率が３０ｗ／ｍｋ以上であることを特徴とするガラス−
窒化アルミニウム複合材料である。上記のガラス粉とし
ては、ＳｉＯ２：３０〜６０％、Ａｌ２Ｏ３：１０〜３
０％、Ｂ２Ｏ３：１０〜３０％、ＭＯ（ただしＭ＝Ｍｇ
、Ｃａ、あるいはＳｒ）：３０％以下の組成よりなるも
のが好適である。又、ＡＩＮウイスカーを添加すると強
度が向上する。
【０００５】
【作用】本発明におけるＡｌＮ粒は酸素含有量が　２％
未満であることが必要である。酸素含有量が　２％以上
となると複合体の熱伝導率が十分でなく、ＡｌＮを複合
する効果が小さくなる。又、平均粒径は　１．０μｍ以
上とする必要があるが、　１．０μｍ未満では、マトリ
ックスガラスからの拡散元素によって熱伝導率の低下が
著しいため、粒は一定以上に大きい原料を用いることが
必要であることが判明した。酸素量は少ない程好ましく
、特に　０．４％以下とすることが良好な熱伝導率を得
る上で好適である。又、ＡｌＮの粒径の上限は１０．０
μｍ　が好ましい。１０．０μｍを越えると焼結後の表
面精度の確保ができない。 さらに、複合体の強度を上昇させるため、ＡｌＮウイス
カーを複合することが可能であり、例えば短径　０．３
μｍ　で長さ５μｍ　程度のものを５体積％程度添加す
ることが有効である。ガラスマトリックスを形成する上
記の組成のガラス粉は、公知のホウケイ酸系ガラスで、
これは焼結温度、誘電率等の観点から好ましい。上記範
囲内で組成を調節することによって、焼結温度を調整し
、又、Ａｇ、Ａｕ、Ｃｕ等の低電気抵抗のペーストを用
い、同時に焼成して導電回路を形成することが可能であ
る。又、誘電率の調整も行うことが可能である。
【０００６】
【実施例】実施例１ 表１に示す特性のＡｌＮとガラス粉末（組成、ＳｉＯ２
：５０％、Ａｌ２Ｏ３：１５％、Ｂ２　　Ｏ３：２０％
、ＣａＯ：１５％）とを表１に示す配合割合になるよう
に有機バインダー等とボールミルにて混合し、スラリー
状とした後、テープ状に成形した。得られた成形体を窒
素気流中　９００℃で焼成した。得られたガラス−窒化
アルミニウム複合体の特性は表２に示すとおりの高い熱
伝導性を示した。なお、複合体の焼成時に内部配線し、
積層したのち焼成すること、さらに焼結体の表面にＡｕ
、Ａｇ、Ｃｕ等の金属ペーストの焼付けも可能であり、
電気配線板として有用であることがわかった。
【０００７】
【表１】
【０００８】
【表２】 実施例２ 実施例１のＮｏ．３と同様の製法で、さらにスラリーに
ＡｌＮウイスカー（長径１０μｍ　、短径　０．４μｍ
　、透明）をガラス、セラミックス成分に対し、５重量
％添加してなる焼結体を製造した。得られた焼結体の強
度は４０ｋｇ／ｍｍ２で、しかも体積固有抵抗、熱伝導
率、比誘電率は劣化がなかった。
【０００９】
【発明の効果】本発明によれば、高熱伝導性を有し、か
つ低誘電率であり、その上強度の高い材料が得られ、半
導体パッケージ用材料として好適なものである。

Claims (3)

    【特許請求の範囲】
  1. 【請求項１】　　酸素含有量　２％未満で平均粒径　１
    ．０μｍ　以上の窒化アルミニウム粒にガラス粉末を加
    えて成形焼結してなり、熱伝導率が３０ｗ／ｍｋ以上で
    あることを特徴とするガラス−窒化アルミニウム複合材
    料。
  2. 【請求項２】　　ガラス粉の組成がＳｉＯ２：３０〜６
    ０％（重量％以下同じ）、Ａｌ２Ｏ３：１０〜３０％、
    Ｂ２Ｏ３：１０〜３０％、ＭＯ（ただしＭ＝Ｍｇ、Ｃａ
    、あるいはＳｒ）：３０％以下であり、ＡｌＮは全体の
    ５０〜９５ｗｔ／％である請求項１記載のガラス−窒化
    アルミニウム複合材料。
  3. 【請求項３】　　ＡｌＮウイスカーを添加してなる請求
    項１又は請求項２記載のガラス−窒化アルミニウム複合
    材料。
JP3033345A 1991-02-04 1991-02-04 ガラス−窒化アルミニウム複合材料 Pending JPH04254477A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP3033345A JPH04254477A (ja) 1991-02-04 1991-02-04 ガラス−窒化アルミニウム複合材料
US07/820,550 US5214005A (en) 1991-02-04 1992-01-14 Glass-aluminum nitride composite material
CA002060239A CA2060239C (en) 1991-02-04 1992-01-29 Glass-aluminum nitride composite material
DE69204319T DE69204319T2 (de) 1991-02-04 1992-02-03 Glas-Aluminiumnitrid Verbundwerkstoff.
EP92101704A EP0499865B1 (en) 1991-02-04 1992-02-03 Glass-aluminum nitride composite material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3033345A JPH04254477A (ja) 1991-02-04 1991-02-04 ガラス−窒化アルミニウム複合材料

Publications (1)

Publication Number Publication Date
JPH04254477A true JPH04254477A (ja) 1992-09-09

Family

ID=12383981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3033345A Pending JPH04254477A (ja) 1991-02-04 1991-02-04 ガラス−窒化アルミニウム複合材料

Country Status (5)

Country Link
US (1) US5214005A (ja)
EP (1) EP0499865B1 (ja)
JP (1) JPH04254477A (ja)
CA (1) CA2060239C (ja)
DE (1) DE69204319T2 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002226272A (ja) * 2001-01-30 2002-08-14 Kyocera Corp ガラスセラミックスおよびその製造方法並びにこれを用いた配線基板
US6630417B2 (en) 2000-05-30 2003-10-07 Kyocera Corporation Porcelain composition, porcelain and method of producing the same, and wiring board and method of producing the same
EP2620418A1 (en) 2012-01-26 2013-07-31 NGK Insulators, Ltd. Glass-ceramic composite material
WO2014038230A1 (ja) 2012-09-10 2014-03-13 日本碍子株式会社 ガラス－セラミックス複合材料
WO2014155758A1 (ja) 2013-03-26 2014-10-02 日本碍子株式会社 ガラス－セラミックス複合材料
US9212087B2 (en) 2013-03-26 2015-12-15 Ngk Insulators, Ltd. Glass-ceramics composite material
JP2019073414A (ja) * 2017-10-16 2019-05-16 イビデン株式会社 繊維強化ＡｌＮ複合材、放熱基板、繊維強化ＡｌＮ複合材の製造方法
JP2019178054A (ja) * 2018-03-30 2019-10-17 Tdk株式会社 コア材及び放熱基板

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4323143C1 (de) * 1993-07-10 1994-12-01 Schott Glaswerke Verwendung eines Glases als bariumfreies Dentalglas mit guter Röntgenabsorption
AU8126894A (en) * 1993-10-29 1995-05-22 Advanced Refractory Technologies, Inc. Thermally-conductive di-electric composite materials, and methods of forming same
JPH07149539A (ja) * 1993-11-25 1995-06-13 Sumitomo Electric Ind Ltd ガラス−セラミックス複合体およびその製造方法
US5541145A (en) * 1993-12-22 1996-07-30 The Carborundum Company/Ibm Corporation Low temperature sintering route for aluminum nitride ceramics
US5424261A (en) * 1993-12-22 1995-06-13 The Carborundum Company Low temperature sintering route for aluminum nitride ceramics
EP0747332B1 (en) * 1994-12-01 2001-09-12 Kabushiki Kaisha Toshiba Aluminum nitride sinter and process for producing the same
US5688450A (en) * 1994-12-21 1997-11-18 Hughes Aircraft Company Method of making an electronic package structure utilizing aluminum nitride/aluminum composite material
US5693305A (en) * 1995-10-19 1997-12-02 Advanced Refractory Technologies, Inc. Method for synthesizing aluminum nitride whiskers
US5691059A (en) * 1995-11-21 1997-11-25 Minnesota Mining And Manfacturing Company Glass and glass-ceramic bubbles having an aluminum nitride coating
DE10234364B4 (de) 2002-07-27 2007-12-27 Robert Bosch Gmbh Glas-Keramik-Verbundwerkstoff, dessen Verwendung als keramische Folie, Schichtverbund oder Mikrohybrid und Verfahren zu dessen Herstellung
JP2008132573A (ja) * 2006-11-29 2008-06-12 Mitsubishi Materials Corp Ｃｍｐコンディショナ
US20080171647A1 (en) * 2007-01-17 2008-07-17 Wei-Chang Lee Low temperature cofired ceramic materials
EP1964818A3 (en) * 2007-02-28 2008-09-10 Corning Incorporated Method for making microfluidic devices
US20100178214A1 (en) * 2007-05-18 2010-07-15 Paulo Gaspar Jorge Marques Glass Microfluidic Devices and Methods of Manufacture Thereof
FR3003081A1 (fr) * 2013-03-07 2014-09-12 Saint Gobain Rech Support de monte en vitroceramique pour led
US10759712B2 (en) * 2017-11-09 2020-09-01 Canon Kabushiki Kaisha Powder for additive modeling, structure, semiconductor production device component, and semiconductor production device
CN111499389A (zh) * 2020-05-11 2020-08-07 陕西长石电子材料股份有限公司 金属基陶瓷覆铜板用陶瓷粉制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3645839A (en) * 1969-01-10 1972-02-29 Owens Illinois Inc Glass sealing compositions containing aluminum titanate
SU739035A1 (ru) * 1978-10-03 1980-06-05 Рижский Ордена Трудового Красного Знамени Политехнический Институт Керамический материал
US4455384A (en) * 1982-12-08 1984-06-19 The United States Of America As Represented By The United States Department Of Energy Chemically durable nitrogen containing phosphate glasses useful for sealing to metals
US4882212A (en) * 1986-10-30 1989-11-21 Olin Corporation Electronic packaging of components incorporating a ceramic-glass-metal composite
JPS63210043A (ja) * 1987-02-24 1988-08-31 Shinko Electric Ind Co Ltd 高熱伝導性ガラス−セラミツク複合体
JPS63222043A (ja) * 1987-03-09 1988-09-14 Taiyo Yuden Co Ltd 低温焼結型磁器
US4985176A (en) * 1987-12-04 1991-01-15 Murata Manufacturing Co., Ltd. Resistive paste
US5017434A (en) * 1988-01-27 1991-05-21 Enloe Jack H Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite
JPH02221162A (ja) * 1989-02-22 1990-09-04 Sumitomo Chem Co Ltd 窒化アルミニウム質焼成体の製法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6630417B2 (en) 2000-05-30 2003-10-07 Kyocera Corporation Porcelain composition, porcelain and method of producing the same, and wiring board and method of producing the same
JP4688302B2 (ja) * 2001-01-30 2011-05-25 京セラ株式会社 ガラスセラミックスおよびその製造方法並びにこれを用いた配線基板
JP2002226272A (ja) * 2001-01-30 2002-08-14 Kyocera Corp ガラスセラミックスおよびその製造方法並びにこれを用いた配線基板
EP2620418A1 (en) 2012-01-26 2013-07-31 NGK Insulators, Ltd. Glass-ceramic composite material
JP2013151399A (ja) * 2012-01-26 2013-08-08 Ngk Insulators Ltd ガラス−セラミックス複合材料
US8912106B2 (en) 2012-01-26 2014-12-16 Ngk Insulators, Ltd. Glass-ceramic composite material
JP5857121B2 (ja) * 2012-09-10 2016-02-10 日本碍子株式会社 ガラス−セラミックス複合材料
WO2014038230A1 (ja) 2012-09-10 2014-03-13 日本碍子株式会社 ガラス－セラミックス複合材料
US9212085B2 (en) 2012-09-10 2015-12-15 Ngk Insulators, Ltd. Glass-ceramics composite material
WO2014155758A1 (ja) 2013-03-26 2014-10-02 日本碍子株式会社 ガラス－セラミックス複合材料
US9212087B2 (en) 2013-03-26 2015-12-15 Ngk Insulators, Ltd. Glass-ceramics composite material
JP2019073414A (ja) * 2017-10-16 2019-05-16 イビデン株式会社 繊維強化ＡｌＮ複合材、放熱基板、繊維強化ＡｌＮ複合材の製造方法
JP2019178054A (ja) * 2018-03-30 2019-10-17 Tdk株式会社 コア材及び放熱基板

Also Published As

Publication number Publication date
EP0499865A1 (en) 1992-08-26
CA2060239C (en) 1996-07-16
DE69204319T2 (de) 1996-05-02
CA2060239A1 (en) 1992-08-05
DE69204319D1 (de) 1995-10-05
EP0499865B1 (en) 1995-08-30
US5214005A (en) 1993-05-25

Similar Documents

Publication Publication Date Title
JPH04254477A (ja) ガラス−窒化アルミニウム複合材料
US5925443A (en) Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
JPH07149588A (ja) 高熱伝導性窒化けい素メタライズ基板，その製造方法および窒化けい素モジュール
JP2900711B2 (ja) 半導体装置実装用低温焼結型磁器の製造方法
JPH0532455A (ja) 低温焼結性低誘電率無機組成物
JPH0881267A (ja) 窒化アルミニウム焼結体、その製造方法と窒化アルミニウム回路基板、その製造方法
JP2712031B2 (ja) 回路基板用組成物及びそれを使用した電子部品
JP2563809B2 (ja) 半導体用窒化アルミニウム基板
JPH02221162A (ja) 窒化アルミニウム質焼成体の製法
JPH03141153A (ja) 低温焼結性低誘電率無機組成物
JPH02196066A (ja) 窒化アルミニウム質焼成体の製造方法
JP2686446B2 (ja) 低温焼成セラミック焼結体
JP2918642B2 (ja) 導電ペースト
JP3284937B2 (ja) 低温焼成セラミックス基板
JPH04114931A (ja) ガラスセラミック焼結体の製法
JP2004161562A (ja) 回路基板用セラミックス材料
JP2949294B2 (ja) 窒化アルミニウム質基板及びその製造方法
JP3420415B2 (ja) 高熱伝導性複合材料
JPH02212363A (ja) 窒化アルミニウム質焼成体の製造法
JP2616060B2 (ja) 放熱性のすぐれた半導体装置用基板素材
JPS63115393A (ja) 高熱伝導性回路基板
JPH06227858A (ja) セラミックス基板
JPH04285085A (ja) 厚膜セラミックス基板
JPS63215560A (ja) セラミツク基板の製造方法
JPH04125952A (ja) セラミックパッケージ