JPH0424858B2 - - Google Patents

Info

Publication number
JPH0424858B2
JPH0424858B2 JP60163396A JP16339685A JPH0424858B2 JP H0424858 B2 JPH0424858 B2 JP H0424858B2 JP 60163396 A JP60163396 A JP 60163396A JP 16339685 A JP16339685 A JP 16339685A JP H0424858 B2 JPH0424858 B2 JP H0424858B2
Authority
JP
Japan
Prior art keywords
lsi
base material
film carrier
film base
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60163396A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6223124A (ja
Inventor
Koki Taniguchi
Nobuhiko Myazaki
Nobutaka Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP60163396A priority Critical patent/JPS6223124A/ja
Publication of JPS6223124A publication Critical patent/JPS6223124A/ja
Publication of JPH0424858B2 publication Critical patent/JPH0424858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Wire Bonding (AREA)
JP60163396A 1985-07-23 1985-07-23 フィルムキャリアｌｓｉ Granted JPS6223124A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60163396A JPS6223124A (ja) 1985-07-23 1985-07-23 フィルムキャリアｌｓｉ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60163396A JPS6223124A (ja) 1985-07-23 1985-07-23 フィルムキャリアｌｓｉ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP6170682A Division JP2509804B2 (ja) 1994-07-22 1994-07-22 表示装置

Publications (2)

Publication Number Publication Date
JPS6223124A JPS6223124A (ja) 1987-01-31
JPH0424858B2 true JPH0424858B2 (enExample) 1992-04-28

Family

ID=15773092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60163396A Granted JPS6223124A (ja) 1985-07-23 1985-07-23 フィルムキャリアｌｓｉ

Country Status (1)

Country Link
JP (1) JPS6223124A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0712972Y2 (ja) * 1987-02-13 1995-03-29 セイコーエプソン株式会社 液晶装置
JPH0915355A (ja) * 1995-07-03 1997-01-17 Toshiba Home Technol Corp タイマ付き装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54124675A (en) * 1978-03-22 1979-09-27 Matsushita Electric Ind Co Ltd Semiconductor device and its mounting method
JPS5753951A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Assembling method of semiconductor device
JPS58188684U (ja) * 1982-06-10 1983-12-15 セイコーエプソン株式会社 電子表示装置
JPS59119477A (ja) * 1982-12-27 1984-07-10 Omron Tateisi Electronics Co 取引処理装置
JPS59159553A (ja) * 1983-03-01 1984-09-10 Matsushita Electric Ind Co Ltd フイルムキヤリヤ
JPS59210419A (ja) * 1983-05-13 1984-11-29 Seiko Epson Corp 液晶表示体装置
JPS616832A (ja) * 1984-06-20 1986-01-13 Matsushita Electric Ind Co Ltd 実装体

Also Published As

Publication number Publication date
JPS6223124A (ja) 1987-01-31

Similar Documents

Publication Publication Date Title
JP2527766B2 (ja) 液晶表示装置
US4655551A (en) Liquid crystal display with chip projecting above and below flexible film
US4640581A (en) Flexible printed circuit board for a display device
GB2122013A (en) Connecting structure for display device
US4842373A (en) Connecting structure for connecting a liquid crystal display and a flexible flat cable
JPH0424858B2 (enExample)
JP3442978B2 (ja) テープキャリアパッケージ半導体装置及びそれを用いた液晶パネル表示装置
JP3509573B2 (ja) フレキシブル基板用テープ材、フレキシブル基板の製造方法、半導体装置の製造方法及び液晶装置の製造方法
JP3321660B2 (ja) 端子片付き基板構造
JP2509804B2 (ja) 表示装置
JPH04317345A (ja) テープリードのボンディング方法
JPH01293592A (ja) コネクタ
JPH04217228A (ja) 液晶表示装置
JP2002171040A (ja) フレキシブル配線基板の電極端子構造
JPS59102213A (ja) 液晶表示装置の製造法
JPH01208851A (ja) 電子部品の実装構造
JPH0582200A (ja) ヒートシールコネコタ
KR100251350B1 (ko) 액정 표시 모듈 및 그 제조방법(Liquid crystal display module and method for manufacturing the same)
JPH0718137Y2 (ja) ヒートシールコネクターの取付構造
JPH0815717A (ja) 液晶表示装置
JPH03110519A (ja) 液晶表示装置の製造方法
JPS6294970A (ja) フイルムキヤリアｌｓｉ
JP2573823B2 (ja) 液晶表示装置
KR0127689Y1 (ko) 표시 패널의 전기적 접속장치
JPH06204630A (ja) プリント基板を搭載した機器

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term