JPH0418697B2 - - Google Patents

Info

Publication number
JPH0418697B2
JPH0418697B2 JP60267250A JP26725085A JPH0418697B2 JP H0418697 B2 JPH0418697 B2 JP H0418697B2 JP 60267250 A JP60267250 A JP 60267250A JP 26725085 A JP26725085 A JP 26725085A JP H0418697 B2 JPH0418697 B2 JP H0418697B2
Authority
JP
Japan
Prior art keywords
wire
bonding
ball
workpiece
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60267250A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62128130A (ja
Inventor
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP60267250A priority Critical patent/JPS62128130A/ja
Publication of JPS62128130A publication Critical patent/JPS62128130A/ja
Publication of JPH0418697B2 publication Critical patent/JPH0418697B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP60267250A 1985-11-29 1985-11-29 ワイヤボンデイング方法 Granted JPS62128130A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60267250A JPS62128130A (ja) 1985-11-29 1985-11-29 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60267250A JPS62128130A (ja) 1985-11-29 1985-11-29 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS62128130A JPS62128130A (ja) 1987-06-10
JPH0418697B2 true JPH0418697B2 (enExample) 1992-03-27

Family

ID=17442217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60267250A Granted JPS62128130A (ja) 1985-11-29 1985-11-29 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS62128130A (enExample)

Also Published As

Publication number Publication date
JPS62128130A (ja) 1987-06-10

Similar Documents

Publication Publication Date Title
JPS61125062A (ja) ピン取付け方法およびピン取付け装置
GB1363042A (en) Tailless wedge bonding of gold wire to palladium-silver cermets
JPH02278740A (ja) 半導体装置のパッケージング方法
JPH0418697B2 (enExample)
JPS6052585B2 (ja) ワイヤボンディング法
JPS62136835A (ja) 半導体装置の製造方法
JPS61105850A (ja) ワイヤボンデイング方法
JPH07263477A (ja) 被覆ボンディング細線接合用キャピラリー
JPH0430546A (ja) 被覆線の超音波ワイヤボンディング方法及び被覆線の超音波ワイヤボンディング用外部リード
JP3202193B2 (ja) ワイヤボンディング方法
JPS603134A (ja) ワイヤボンデイング方法
JPS6254500A (ja) ワイヤ接続方法
JPH1154541A (ja) ワイヤボンディング方法及びワイヤボンディング装置
JPS6316632A (ja) 半導体装置の製造方法
JPH02194540A (ja) ワイヤボンデイング方法
JPS63215368A (ja) 半田供給方法
JPS61140142A (ja) ボンデイング方法
JPH05283461A (ja) ワイヤボンディング方法
JPS58182843A (ja) ワイヤボンデイング方法
JPS62126643A (ja) ワイヤボンデイング方法
JPS61237441A (ja) ワイヤボンデイング方法
JPH03142940A (ja) ワイヤボンディング方法
JPS58122742A (ja) ワイヤボンデイング方法
JPS62136836A (ja) 半導体装置の製造方法
JPH0547821A (ja) ワイヤボンデイング方法