JPH04183872A - 超高純度強誘電体薄膜 - Google Patents
超高純度強誘電体薄膜Info
- Publication number
- JPH04183872A JPH04183872A JP2310890A JP31089090A JPH04183872A JP H04183872 A JPH04183872 A JP H04183872A JP 2310890 A JP2310890 A JP 2310890A JP 31089090 A JP31089090 A JP 31089090A JP H04183872 A JPH04183872 A JP H04183872A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- lead
- contg
- ultra
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 25
- 239000012535 impurity Substances 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052776 Thorium Inorganic materials 0.000 claims abstract description 6
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 6
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 13
- 229910052770 Uranium Inorganic materials 0.000 claims description 5
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 abstract description 24
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 7
- 229910052726 zirconium Inorganic materials 0.000 abstract description 5
- 230000007423 decrease Effects 0.000 abstract description 4
- 229910052745 lead Inorganic materials 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 abstract description 2
- 229910052719 titanium Inorganic materials 0.000 abstract description 2
- 238000001354 calcination Methods 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 150000002902 organometallic compounds Chemical class 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052783 alkali metal Inorganic materials 0.000 description 3
- 150000001340 alkali metals Chemical class 0.000 description 3
- 238000004821 distillation Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- 238000000859 sublimation Methods 0.000 description 3
- 230000008022 sublimation Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005621 ferroelectricity Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
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- C23C14/088—Oxides of the type ABO3 with A representing alkali, alkaline earth metal or Pb and B representing a refractory or rare earth metal
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/409—Oxides of the type ABO3 with A representing alkali, alkaline earth metal or lead and B representing a refractory metal, nickel, scandium or a lanthanide
-
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
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- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
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- C30B7/00—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions
- C30B7/005—Epitaxial layer growth
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- H01L21/02107—Forming insulating materials on a substrate
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Abstract
め要約のデータは記録されません。
Description
さらに詳しくは、赤外線センサー、圧電フィルター、振
動子、レーザーの変調素子、光シヤツター、キャパシタ
膜、不揮発性のメモリー等に適用される超高純度強誘電
体薄膜に関する。
どのような成膜法でも最終的に熱処理を行い結晶性を」
二げることか必要である。しかし結晶性を上げていくと
、同時に結晶粒の成長が起こり粒界を通してのリーク電
流が問題となってくる。
向」ニするうえで限界があった。
電性を上げるためには、熱処理により結晶性を上げるこ
とが必要であるが、その際、結晶粒界の成長が伴い膜中
の不純物の多くが粒界に析出してくる。この不純物領域
が粒界を通してのリーク電流を増大させる。そこでこの
不純物領域を取り除くこと↓こよってリーク電流を大幅
に減少させることが可能と考えられる。しかしながら、
薄膜の構成成分であるPb、La、 Ti、 Zr等の
高純度化が難かしく、特にO,lppm以下にまで不純
物温度を下げることは非常に困難であった。囚に、従来
、pb含有強誘電体薄膜に関し、高純度化により特性改
善した旨の報告は見当らない。
き研究した結果、それぞれの金属成分を金属有機化合物
の形で蒸留、昇華、再結晶を繰り返し、あるいはこれら
を組み合わせることによって非常に高純度の金属成分原
料を得ることができ、これらを原料としてチタン酸鉛、
チタン酸ジルコン酸鉛あるいはランタン含有チタン酸ジ
ルコン酸鉛等のpb含有強誘電体薄膜を作製したところ
、結晶化の際に不純物が粒界に析出するのを防止し、非
常に優れた特性を有する強誘電体薄膜を得ることができ
る知見を得た。
わされる鉛含有強誘電体からなり、該誘電体に含まれる
不純物として、1、j、Na、にの合謂含イ」址か0、
]ppm以下、U、1’hの合N1含有量がI Op
P +)以下であって、金属不純物の総合有量が Ip
PIII以下であることを特徴とする強誘電体薄膜が提
供される。
、チタン酸ジルコン酸鉛(一般式においてx=o、Yは
0<Y<1>またはランタン含有チタン酸ジルコン酸鉛
(一般式においてX、Yが0<X、Y<1.)等が提供
される。
機化合物の形で蒸留、昇華、再結晶を繰返し、あるいは
これらを組合せて精製することにより高純度化したもの
を用い、これらを有機溶媒に所定の組成比となるように
溶解して被膜形成塗布液を調製し、該塗布液を基板に塗
布し、乾燥、焼成することによって得られる。
物粉末を用いスパッタリング法によっても」二記強誘電
体薄膜を得ることができる。
Kの合計含有量がO,lppm以下、U、’rh(7)
合M1含有量が]0ppb以下であり、かつ金属不純物
の総合有量がIPI1m以ドである。
するとリーク電流を発生させ易くなるので、これらLi
、 Na、にの合計含有量を0.lppm以下とする。
RA Mのキャパシター膜として用いた場合にα線によ
るソフトエラーを生ずる原因となるので、その合fl含
有量を]0ppb以下とする。更に第1図に示すように
、強誘電体薄膜の金属不純物総量がlppm以下のとき
、リーク電流密度(A−cm−”)は大幅に低下するの
で、−1−記1.j、 Na、 KおよびtJ、Thを
含めた金属不純物総量をlppm以下とする。
示す。また膜の部位による特性変化が極めて少ない安定
な膜が得られ、エレクトロニクスの分野等において広く
用いることができる。
したPb、 Zr、1°j。の金属有機化合物を有機溶
媒にPb:Zr:Tj= ] :0.52:0.48の
組成比となるように溶解し、”bZro+ 52 Ti
oH,1803換算で1(ht%濃度となるように重量
調整を行い、 PZT被膜形成用塗布液を作製した。溶
液から得られる酸化物中の不純Lj度は、Na、に、L
、jのアルカリ金属はいずれも10pPb以下であり、
U、’fhは検出限界以下であった。
膜厚約3000人としたのち、70 (1’Cで2時間
空気中で焼成を行った。この膜」−にPt電極を形成し
電気的特性を測定したところ以下の通りであった。
、 Tjの金属有機化合物を有機溶媒にPb : Tj
、= 1 :1の組成比となるように溶解し、PbTi
0.換算で10wt%濃度となるように重量調整を行い
PZT被膜形成用塗布液を作製した。溶液から得られる
酸化物中の不純物濃度は、Na、 K 、[jのアルカ
リ金属はいずれも1oppb以下であり、U、Thは検
出限界以下であった。この溶液をスピンコード法でpt
基板上に塗布し膜厚約3000人としたのち、700℃
で時間空気中で焼成を行った。この膜上にpt電極を形
成し電気的特性を測定したところ以下の通りであった。
、 Zr、 Tjの金属有機化合物を有機溶媒にPb
: La :Zr:1’j =0.91:0.09:0
.64:0.34の組成比となるように溶解し、PbO
、、□La、 +[19(ZrO+GS TiO*35
)0 +9’+ 7 %03換算で10すt%濃度と
なるように重量調整を行いPZT被膜形成用塗布液を作
製した。溶液から得られる酸化物中の不純物濃度は、N
a、に、Liのアルカリ金属はいずれも10ppb以下
であり、U、Thは検出限界以下であった。この溶液を
スピンコード法でpt基板上に塗布し膜厚約3000人
としたのち、700℃で2時間空気中で焼成を行った。
ろ以下の通りであった。
l〕bO,Zro、’N、0゜粉末を得た。それを1)
b:Zr:1’i= ]:0.52:0.48の組成比
となるように混合し、=7− 焼結させてスパッタリング用ターゲットを作製した。こ
れの不純物濃度も実施例1と同様であった。
上に膜厚約3000人の薄膜を形成したのち、700℃
で2時間空気中で焼成を行った。この膜上にpt電極を
形成し電気的特性を測定したところ以下の通りであった
。
iの金属有機化合物を直接用い、CVO法によりpbr
j03簿膜をpt基板」二に膜厚約3000人となるよ
うに形成したのち、700℃で2時間空気中で焼成を行
った。因みに使用した金属有機化合物から得られる酸化
物中の不純物濃度は、Na、K 、 Liのアルカリ金
属はいずれも10ppb以下であり、U、Thは検出限
界以下であった。この膜上にpt電極を形成し電気的特
性を測定したところ以下の通りであった。
施例1と同等PZT被膜形成塗布液(A液)を作製した
。
し、何種類かの不純物含有量の異なる被膜形成液を作製
して、実施例1と同じI条件で成膜した。これらの膜に
ついて同様にしてリーク電流を測定した。この結果を図
に示す。図から明らかのように不純物含有量がlppm
付近でリーク電流減少の変曲点となっている。
リーク電流との関係を示すグラフである。
Claims (2)
- (1)一般式 Pb_1_−_XLa_X(Zr_YTi_1_−_Y
)_1_−_X_/_4O_3(式中X、Yは0.1ま
たは1より小さい少数)で表わされる鉛含有強誘電体か
らなり、該誘電体に含まれる不純物として、Li、Na
、Kの合計含有量が0.1ppm以下、U、Thの合計
含有量が10ppb以下であって、金属不純物の総含有
量が1ppm以下であることを特徴とする強誘電体薄膜
。 - (2)鉛含有強誘電体がチタン酸鉛(一般式においてX
=Y=0)、チタン酸ジルコン酸鉛(一般式においてX
=0、Yは0<Y<1)またはランタン含有チタン酸ジ
ルコン酸鉛(一般式においてX、Yが0<X、Y<1)
である請求項1記載の強誘電体薄膜。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2310890A JP2891304B2 (ja) | 1990-11-16 | 1990-11-16 | 超高純度強誘電体薄膜 |
DE69116106T DE69116106T2 (de) | 1990-11-16 | 1991-11-08 | Dünne ferroelektrische Schicht von höchster Reinheit |
EP91119082A EP0485907B1 (en) | 1990-11-16 | 1991-11-08 | Ultrahigh-purity ferroelectric thin film |
US07/791,998 US5244742A (en) | 1990-11-16 | 1991-11-14 | Ultrahigh-purity ferroelectric thin film |
KR1019910020427A KR100220345B1 (ko) | 1990-11-16 | 1991-11-16 | 초고순도 강유전체박막 및 그 제조방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2310890A JP2891304B2 (ja) | 1990-11-16 | 1990-11-16 | 超高純度強誘電体薄膜 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6860494A Division JPH0754134A (ja) | 1994-04-06 | 1994-04-06 | 超高純度誘電体薄膜形成用ターゲット材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04183872A true JPH04183872A (ja) | 1992-06-30 |
JP2891304B2 JP2891304B2 (ja) | 1999-05-17 |
Family
ID=18010616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2310890A Expired - Lifetime JP2891304B2 (ja) | 1990-11-16 | 1990-11-16 | 超高純度強誘電体薄膜 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5244742A (ja) |
EP (1) | EP0485907B1 (ja) |
JP (1) | JP2891304B2 (ja) |
KR (1) | KR100220345B1 (ja) |
DE (1) | DE69116106T2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006265651A (ja) * | 2005-03-24 | 2006-10-05 | Fuji Photo Film Co Ltd | 複合ペロブスカイト型化合物の膜及びその成膜方法、並びに、それを用いた液体吐出ヘッドの製造方法 |
JP2020025069A (ja) * | 2018-03-19 | 2020-02-13 | 株式会社リコー | 酸化物形成用塗布液、酸化物膜の製造方法、及び電界効果型トランジスタの製造方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5723361A (en) * | 1991-12-13 | 1998-03-03 | Symetrix Corporation | Thin films of ABO3 with excess A-site and B-site modifiers and method of fabricating integrated circuits with same |
JPH0773732A (ja) * | 1993-06-23 | 1995-03-17 | Sharp Corp | 誘電体薄膜素子及びその製造方法 |
KR0147245B1 (ko) * | 1993-12-01 | 1998-09-15 | 모리시타 요이찌 | 강유전체박막 및 그 제조방법 |
JP3007795B2 (ja) * | 1994-06-16 | 2000-02-07 | シャープ株式会社 | 複合金属酸化物誘電体薄膜の製造方法 |
WO1996001493A1 (en) * | 1994-07-05 | 1996-01-18 | Symetrix Corporation | Thin film of abo3 with excess a-site and b-site modifiers and method of fabricating integrated circuits with same |
US5897912A (en) * | 1997-09-03 | 1999-04-27 | Ferro Corporation | Method of making conductive electrodes for use in multilayer ceramic capacitors or inductors using organometallic ink |
US6203608B1 (en) * | 1998-04-15 | 2001-03-20 | Ramtron International Corporation | Ferroelectric thin films and solutions: compositions |
DE19908213B4 (de) * | 1998-07-27 | 2005-03-10 | Mitsubishi Heavy Ind Ltd | Basisrohr für eine Brennstoffzelle |
US6623865B1 (en) | 2000-03-04 | 2003-09-23 | Energenius, Inc. | Lead zirconate titanate dielectric thin film composites on metallic foils |
JP2004107181A (ja) * | 2002-09-20 | 2004-04-08 | Canon Inc | 圧電体素子形成用組成物、圧電体膜の製造方法、圧電体素子及びインクジェット記録ヘッド |
US20040175585A1 (en) * | 2003-03-05 | 2004-09-09 | Qin Zou | Barium strontium titanate containing multilayer structures on metal foils |
KR102242304B1 (ko) * | 2015-03-26 | 2021-04-19 | 미쓰비시 마테리알 가부시키가이샤 | 강유전체막 및 그 제조 방법 |
JP6597430B2 (ja) * | 2015-03-26 | 2019-10-30 | 三菱マテリアル株式会社 | 強誘電体膜及びその製造方法 |
EP3544047A3 (en) * | 2018-03-19 | 2019-11-20 | Ricoh Company, Ltd. | Coating liquid for forming oxide, method for producing oxide film, and method for producing field-effect transistor |
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JPS5941930A (ja) * | 1982-08-31 | 1984-03-08 | Mitsubishi Electric Corp | 高周波ノイズ除去回路 |
JPS6353264A (ja) * | 1986-08-25 | 1988-03-07 | Sumitomo Electric Ind Ltd | 強誘電体薄膜の製造方法 |
JPS63117961A (ja) * | 1986-11-07 | 1988-05-21 | 三菱マテリアル株式会社 | 磁器組成物の製造方法 |
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US3303133A (en) * | 1964-02-06 | 1967-02-07 | Honeywell Inc | Process for producing dense ceramic of lead zirconate-titanate |
US3816750A (en) * | 1971-06-04 | 1974-06-11 | Honeywell Inc | Pyroelectric detector |
US3917780A (en) * | 1973-08-09 | 1975-11-04 | Us Air Force | Preparation of lead lanthanum zirconate titanate bodies |
US3997690A (en) * | 1975-05-27 | 1976-12-14 | Honeywell Inc. | Method of adjusting refractive index of PLZT optical coating on optical element |
US4963390A (en) * | 1988-10-05 | 1990-10-16 | The Aerospace Corporation | Metallo-organic solution deposition (MOSD) of transparent, crystalline ferroelectric films |
-
1990
- 1990-11-16 JP JP2310890A patent/JP2891304B2/ja not_active Expired - Lifetime
-
1991
- 1991-11-08 EP EP91119082A patent/EP0485907B1/en not_active Expired - Lifetime
- 1991-11-08 DE DE69116106T patent/DE69116106T2/de not_active Expired - Lifetime
- 1991-11-14 US US07/791,998 patent/US5244742A/en not_active Expired - Lifetime
- 1991-11-16 KR KR1019910020427A patent/KR100220345B1/ko not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS4838313A (ja) * | 1971-09-18 | 1973-06-06 | ||
JPS5941930A (ja) * | 1982-08-31 | 1984-03-08 | Mitsubishi Electric Corp | 高周波ノイズ除去回路 |
JPS6353264A (ja) * | 1986-08-25 | 1988-03-07 | Sumitomo Electric Ind Ltd | 強誘電体薄膜の製造方法 |
JPS63117961A (ja) * | 1986-11-07 | 1988-05-21 | 三菱マテリアル株式会社 | 磁器組成物の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006265651A (ja) * | 2005-03-24 | 2006-10-05 | Fuji Photo Film Co Ltd | 複合ペロブスカイト型化合物の膜及びその成膜方法、並びに、それを用いた液体吐出ヘッドの製造方法 |
JP2020025069A (ja) * | 2018-03-19 | 2020-02-13 | 株式会社リコー | 酸化物形成用塗布液、酸化物膜の製造方法、及び電界効果型トランジスタの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2891304B2 (ja) | 1999-05-17 |
KR100220345B1 (ko) | 1999-09-15 |
EP0485907A1 (en) | 1992-05-20 |
US5244742A (en) | 1993-09-14 |
DE69116106D1 (de) | 1996-02-15 |
KR920009705A (ko) | 1992-06-25 |
DE69116106T2 (de) | 1996-05-15 |
EP0485907B1 (en) | 1996-01-03 |
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