JPH0411349Y2 - - Google Patents
Info
- Publication number
- JPH0411349Y2 JPH0411349Y2 JP1985186442U JP18644285U JPH0411349Y2 JP H0411349 Y2 JPH0411349 Y2 JP H0411349Y2 JP 1985186442 U JP1985186442 U JP 1985186442U JP 18644285 U JP18644285 U JP 18644285U JP H0411349 Y2 JPH0411349 Y2 JP H0411349Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- lead
- lead terminals
- terminal
- terminal holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multi-Conductor Connections (AREA)
- Structure Of Receivers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985186442U JPH0411349Y2 (instruction) | 1985-12-03 | 1985-12-03 | |
| US07/267,658 US4841414A (en) | 1985-12-03 | 1988-11-03 | High frequency apparatus chassis and circuit board construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985186442U JPH0411349Y2 (instruction) | 1985-12-03 | 1985-12-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6294569U JPS6294569U (instruction) | 1987-06-16 |
| JPH0411349Y2 true JPH0411349Y2 (instruction) | 1992-03-19 |
Family
ID=16188519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985186442U Expired JPH0411349Y2 (instruction) | 1985-12-03 | 1985-12-03 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4841414A (instruction) |
| JP (1) | JPH0411349Y2 (instruction) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI84216C (fi) * | 1989-02-03 | 1991-10-25 | Nokia Mobira Oy | Foerfarande foer tillverkning av en stomme foer en radiotelefon samt enligt foerfarandet tillverkad stomme. |
| US5357404A (en) * | 1991-11-18 | 1994-10-18 | The Whitaker Corporation | EMI shield, and assembly using same |
| US5241453A (en) * | 1991-11-18 | 1993-08-31 | The Whitaker Corporation | EMI shielding device |
| US5302923A (en) * | 1992-07-16 | 1994-04-12 | Hewlett-Packard Company | Interconnection plate having high frequency transmission line through paths |
| US5354951A (en) * | 1993-03-15 | 1994-10-11 | Leader Tech, Inc. | Circuit board component shielding enclosure and assembly |
| JPH07105759B2 (ja) * | 1993-03-30 | 1995-11-13 | 山一電機株式会社 | 光電変換器 |
| GB2297654B (en) * | 1995-02-03 | 1998-09-09 | Cliff Electron Components Ltd | A circuit board assembly and a method of manufacturing such an assembly |
| US5566053A (en) * | 1995-10-11 | 1996-10-15 | Chou; Jonie | Electric receptacle assembly |
| US5841637A (en) * | 1996-03-25 | 1998-11-24 | Intellikey Corporation | ESD-protective housing for electronically operated lock |
| DE19618481C1 (de) * | 1996-05-08 | 1997-08-14 | Telefunken Microelectron | Elektronikmodul mit Steckkontakten und leitender Abdeckkappe |
| JP2850860B2 (ja) * | 1996-06-24 | 1999-01-27 | 住友金属工業株式会社 | 電子部品の製造方法 |
| DE19636181A1 (de) * | 1996-09-06 | 1998-03-12 | Philips Patentverwaltung | HF-Modul, z. B. Tuner |
| EP0909120B1 (de) * | 1997-10-11 | 2005-06-08 | Conti Temic microelectronic GmbH | Gehäuse zur Aufnahme elektronischer Bauelemente |
| US6194655B1 (en) | 1999-03-01 | 2001-02-27 | Leader Tech, Inc. | Circuit board component shielding enclosure and assembly having opposing covers interfitted with upper and lower portions of enclosure |
| JP4061005B2 (ja) * | 1999-03-31 | 2008-03-12 | シャープ株式会社 | 発光ダイオードおよびその製造方法並びに発光ダイオードの電気配線基板への搭載方法 |
| US6404309B1 (en) * | 2000-06-09 | 2002-06-11 | Thomson Licensing, S.A. | Tuner with non-edge RF input pin/lead |
| JP4747409B2 (ja) * | 2000-11-09 | 2011-08-17 | ソニー株式会社 | 受信装置 |
| US6524120B2 (en) * | 2001-03-22 | 2003-02-25 | Mobicom Corp. | Article comprising EMI shielding |
| KR100411255B1 (ko) * | 2001-06-11 | 2003-12-18 | 삼성전기주식회사 | 케이블 모뎀 튜너 모듈의 히트싱크 |
| JP2006505931A (ja) * | 2002-11-08 | 2006-02-16 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 高周波装置 |
| JP4107160B2 (ja) * | 2003-05-23 | 2008-06-25 | 株式会社村田製作所 | 複合電子部品 |
| JP2008153541A (ja) * | 2006-12-19 | 2008-07-03 | Toshiba Corp | 基板取付構造 |
| JP2009021798A (ja) * | 2007-07-11 | 2009-01-29 | Mitsumi Electric Co Ltd | チューナ装置 |
| JP2009158548A (ja) * | 2007-12-25 | 2009-07-16 | Toshiba Corp | シールドケース、配線基板、及び電子部品モジュール |
| TWI418175B (zh) * | 2009-12-24 | 2013-12-01 | Delta Electronics Inc | 網路通訊零件 |
| TWI525782B (zh) * | 2011-01-05 | 2016-03-11 | 矽品精密工業股份有限公司 | 半導體封裝件及其製法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3721746A (en) * | 1971-10-01 | 1973-03-20 | Motorola Inc | Shielding techniques for r.f. circuitry |
| US4063788A (en) * | 1976-06-21 | 1977-12-20 | Motorola, Inc. | Chassis captivation arrangement for vibration attenuation |
| JPS5467288U (instruction) * | 1977-10-21 | 1979-05-12 | ||
| GB2029645B (en) * | 1978-08-07 | 1982-07-14 | Mitsumi Electric Co Ltd | High-frequency circuit device |
| US4306205A (en) * | 1978-10-31 | 1981-12-15 | Murata Manufacturing Co., Ltd. | High frequency apparatus |
| JPS5910827Y2 (ja) * | 1978-12-28 | 1984-04-04 | 株式会社村田製作所 | 電子チユ−ナの仮固定構造 |
| JPS5887896A (ja) * | 1981-11-20 | 1983-05-25 | アルプス電気株式会社 | 高周波回路機器の組立構造 |
-
1985
- 1985-12-03 JP JP1985186442U patent/JPH0411349Y2/ja not_active Expired
-
1988
- 1988-11-03 US US07/267,658 patent/US4841414A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US4841414A (en) | 1989-06-20 |
| JPS6294569U (instruction) | 1987-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0411349Y2 (instruction) | ||
| US7791901B2 (en) | Stand-off mounting apparatus for discrete electrical components | |
| JPH11288751A (ja) | プリント配線基板への端子の取付構造 | |
| JP2863981B2 (ja) | ラグ端子およびその取り付け方法 | |
| JPH02134890A (ja) | 回路素子実装基板 | |
| JPS60254785A (ja) | 電子素子用のスペーサ | |
| JPS5926619Y2 (ja) | 電子部品の接続構造 | |
| JPH0737360Y2 (ja) | 集積回路部品 | |
| JPS6130745B2 (instruction) | ||
| JPH0344431B2 (instruction) | ||
| JPH073577Y2 (ja) | 混成集積回路装置 | |
| JPH0677620A (ja) | 電子部品実装構造 | |
| JPH0364876A (ja) | 電子部品のリード端子取付方法 | |
| JP2537787B2 (ja) | 電源装置 | |
| JPH04262376A (ja) | 混成集積回路装置 | |
| JPH06140274A (ja) | 複合電子部品 | |
| JP3024284B2 (ja) | 集積回路用端子 | |
| JPS62282456A (ja) | ハイブリッドicの製造方法 | |
| JPH05290908A (ja) | プリント基板に対する端子板の接続構造 | |
| JPS62193030A (ja) | ヒユ−ズ球取付装置 | |
| JPS59217389A (ja) | 電子部品の接続方法 | |
| JPH075261U (ja) | 交換用plccコネクター | |
| JPH04249078A (ja) | 印刷配線板の接続端子装置 | |
| JPH0964533A (ja) | 混成集積回路装置 | |
| JPH04309255A (ja) | 半導体装置 |