JPH0377662B2 - - Google Patents

Info

Publication number
JPH0377662B2
JPH0377662B2 JP323582A JP323582A JPH0377662B2 JP H0377662 B2 JPH0377662 B2 JP H0377662B2 JP 323582 A JP323582 A JP 323582A JP 323582 A JP323582 A JP 323582A JP H0377662 B2 JPH0377662 B2 JP H0377662B2
Authority
JP
Japan
Prior art keywords
bonding
wire
wedge
bond
fine wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP323582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS589332A (ja
Inventor
Josefu Eresu Richaado
Erii Reizon
Uirensukii Dan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KURIKE ANDO SOFUA IND Inc
Original Assignee
KURIKE ANDO SOFUA IND Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KURIKE ANDO SOFUA IND Inc filed Critical KURIKE ANDO SOFUA IND Inc
Publication of JPS589332A publication Critical patent/JPS589332A/ja
Publication of JPH0377662B2 publication Critical patent/JPH0377662B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H10W72/07141—
    • H10W72/07168—
    • H10W72/07502—
    • H10W72/07533—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP57003235A 1981-01-12 1982-01-12 一定のボンディング・ワイヤ後部長さを形成する方法 Granted JPS589332A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/224,099 US4422568A (en) 1981-01-12 1981-01-12 Method of making constant bonding wire tail lengths
US224099 2002-08-19

Publications (2)

Publication Number Publication Date
JPS589332A JPS589332A (ja) 1983-01-19
JPH0377662B2 true JPH0377662B2 (cg-RX-API-DMAC10.html) 1991-12-11

Family

ID=22839276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57003235A Granted JPS589332A (ja) 1981-01-12 1982-01-12 一定のボンディング・ワイヤ後部長さを形成する方法

Country Status (2)

Country Link
US (1) US4422568A (cg-RX-API-DMAC10.html)
JP (1) JPS589332A (cg-RX-API-DMAC10.html)

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DE3343738C2 (de) * 1983-12-02 1985-09-26 Deubzer-Eltec GmbH, 8000 München Verfahren und Vorrichtung zum Bonden eines dünnen, elektrisch leitenden Drahtes an elektrische Kontaktflächen von elektrischen oder elektronischen Bauteilen
DE3672530D1 (de) * 1985-05-31 1990-08-16 Dynapert Delvotec Sa Verbindungskopf.
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
US4944446A (en) * 1989-11-02 1990-07-31 Micron Technology, Inc. Automatic preform dispenser
US5251266A (en) * 1990-08-27 1993-10-05 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices using a split mirror assembly
US5627913A (en) * 1990-08-27 1997-05-06 Sierra Research And Technology, Inc. Placement system using a split imaging system coaxially coupled to a component pickup means
US5235407A (en) * 1990-08-27 1993-08-10 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices
US5317803A (en) * 1991-05-30 1994-06-07 Sierra Research And Technology, Inc. Method of soldering an integrated circuit
JP2558976B2 (ja) * 1991-11-08 1996-11-27 松下電器産業株式会社 電子部品の電極とリードとの接合方法
JPH05226407A (ja) * 1991-11-12 1993-09-03 Nec Corp 半導体装置の製造方法及び製造装置
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
JP3120267B2 (ja) * 1994-11-25 2000-12-25 株式会社新川 シングルポイントボンディング方法
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
JP3522123B2 (ja) * 1998-09-30 2004-04-26 株式会社新川 ワイヤボンディング方法
JP2001189340A (ja) * 1999-12-28 2001-07-10 Shinkawa Ltd ワイヤボンデイング方法及びその装置
US6808102B1 (en) * 2000-08-28 2004-10-26 Asm Assembly Automation Ltd. Wire-bonding apparatus with improved XY-table orientation
US7320423B2 (en) * 2002-11-19 2008-01-22 Kulicke And Soffa Industries, Inc. High speed linear and rotary split-axis wire bonder
DE10315639A1 (de) * 2003-04-04 2004-11-04 Hesse & Knipps Gmbh Verfahren und Vorrichtung zur Prüfung einer Drahtbondverbindung
US7320424B2 (en) * 2004-05-05 2008-01-22 Kulicke And Soffa Industries, Inc. Linear split axis wire bonder
CN101052493A (zh) * 2004-09-22 2007-10-10 库利克和索夫工业公司 用于引线接合机接合头的运动控制装置
KR101313391B1 (ko) * 2004-11-03 2013-10-01 테세라, 인코포레이티드 적층형 패키징
US8058101B2 (en) 2005-12-23 2011-11-15 Tessera, Inc. Microelectronic packages and methods therefor
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
US9159708B2 (en) 2010-07-19 2015-10-13 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
KR101075241B1 (ko) 2010-11-15 2011-11-01 테세라, 인코포레이티드 유전체 부재에 단자를 구비하는 마이크로전자 패키지
US20120146206A1 (en) 2010-12-13 2012-06-14 Tessera Research Llc Pin attachment
US8618659B2 (en) 2011-05-03 2013-12-31 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
JP5734236B2 (ja) 2011-05-17 2015-06-17 株式会社新川 ワイヤボンディング装置及びボンディング方法
US8404520B1 (en) 2011-10-17 2013-03-26 Invensas Corporation Package-on-package assembly with wire bond vias
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US8372741B1 (en) 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US8919632B2 (en) * 2012-11-09 2014-12-30 Asm Technology Singapore Pte. Ltd. Method of detecting wire bonding failures
US8975738B2 (en) 2012-11-12 2015-03-10 Invensas Corporation Structure for microelectronic packaging with terminals on dielectric mass
WO2014077232A1 (ja) 2012-11-16 2014-05-22 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法
JP5426000B2 (ja) 2012-11-16 2014-02-26 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法
JP5700482B2 (ja) 2012-11-16 2015-04-15 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9136254B2 (en) 2013-02-01 2015-09-15 Invensas Corporation Microelectronic package having wire bond vias and stiffening layer
US9023691B2 (en) 2013-07-15 2015-05-05 Invensas Corporation Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
US8883563B1 (en) 2013-07-15 2014-11-11 Invensas Corporation Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
US9034696B2 (en) 2013-07-15 2015-05-19 Invensas Corporation Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US9685365B2 (en) * 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US9082753B2 (en) 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US9087815B2 (en) 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US9263394B2 (en) 2013-11-22 2016-02-16 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
TWI543284B (zh) * 2014-02-10 2016-07-21 新川股份有限公司 半導體裝置的製造方法以及打線裝置
US9214454B2 (en) 2014-03-31 2015-12-15 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
JP2016062962A (ja) * 2014-09-16 2016-04-25 株式会社東芝 ワイヤボンディング装置、及び半導体装置
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US10043779B2 (en) 2015-11-17 2018-08-07 Invensas Corporation Packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
CN112640068B (zh) 2019-03-08 2024-06-25 株式会社新川 打线接合装置
CN110899888A (zh) * 2019-12-04 2020-03-24 成都精蓉创科技有限公司 一种可全自动穿丝的劈刀及其加工工艺
CN115621141A (zh) * 2022-10-13 2023-01-17 重庆平创半导体研究院有限责任公司 一种铝线键合方法

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US3444612A (en) * 1967-04-10 1969-05-20 Engineered Machine Builders Co Wire bonding method
US3460238A (en) * 1967-04-20 1969-08-12 Motorola Inc Wire severing in wire bonding machines
US3623649A (en) * 1969-06-09 1971-11-30 Gen Motors Corp Wedge bonding tool for the attachment of semiconductor leads
US3643321A (en) * 1970-06-17 1972-02-22 Kulicke & Soffa Ind Inc Method and apparatus for tailless wire bonding
US3747198A (en) * 1971-08-19 1973-07-24 Gen Electric Tailless wedge bonding of gold wire to palladium-silver cermets
US4266710A (en) * 1978-11-22 1981-05-12 Kulicke And Soffa Industries Inc. Wire bonding apparatus
US4239144A (en) * 1978-11-22 1980-12-16 Kulicke & Soffa Industries, Inc. Apparatus for wire bonding

Also Published As

Publication number Publication date
JPS589332A (ja) 1983-01-19
US4422568A (en) 1983-12-27

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