TWI495527B - 用於導線鍵合機的自動導線進給系統 - Google Patents

用於導線鍵合機的自動導線進給系統 Download PDF

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TWI495527B
TWI495527B TW099134652A TW99134652A TWI495527B TW I495527 B TWI495527 B TW I495527B TW 099134652 A TW099134652 A TW 099134652A TW 99134652 A TW99134652 A TW 99134652A TW I495527 B TWI495527 B TW I495527B
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wire
bonding
pneumatic device
clamp
bonding tool
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TW201132439A (en
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Yue Zhang
Keng Yew Song
Xiao Liang Chen
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Asm Tech Singapore Pte Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004Wire welding
    • B23K20/005Capillary welding
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  • Wire Bonding (AREA)

Description

用於導線鍵合機的自動導線進給系統
本發明涉及導線鍵合機,尤其是涉及用於導線鍵合機的導線進給系統。
在半導體裝配和封裝過程中,自動導線鍵合機被用於在襯底和晶粒上的電氣接觸墊(contact pads)之間或者在不同的晶粒上的電氣接觸墊之間形成電氣導線連接。導線從包含有鍵合導線,通常為金線或銅線的繞線盤(wire spool)處被進給到鍵合工具,如焊針(capillary)以在鍵合工具處執行導線鍵合。
沿著繞線盤和焊針之間的導線進給路徑,導線經過不同的設備,其可能包括氣動設備(pneumatic device)和導線夾具以用於在導線鍵合過程中控制導線的進給。圖1所示為傳統的導線鍵合機的導線進給路徑的側視示意圖。鍵合導線100,如金線或銅線,從繞線盤(圖中未示)被進給進入氣動設備102,該氣動設備用於向上或向下施加垂直的真空吸力以促使鍵合導線100在這些方向上的移動。導線引導器(wire guider)104離開氣動設備102一段距離設置,其具有小的孔洞以便於鍵合導線100沿著進給路徑裝入(threading)和引導。導線夾具106設置在導線引導器104下方,以在鍵合導線100的移動將被限制時夾持在鍵合導線100上。然後鍵合導線100穿越通過設置在換能器角體(transducer horn)110一端的焊針108。在焊針108的底端部完成導線鍵合。
這種傳統的導線鍵合機結構的缺點是:當鍵合導線被安排來進行導線鍵合時,導線裝入(threading)必須手動進行。由於鍵合導線和其必須裝入通過的設備的小型尺寸,所以需要熟練技師來完成手動導線裝入,儘管如此,該工序本身是一個浪費時間的工序。
而且,在導線鍵合過程中由於各種各樣的原因,如尾部鍵合提前中斷(premature termination)引起的短絲尾(short tail)、導致球形鍵合錯誤形成的缺球(missing ball)和其他原因,導線斷裂可能發生。每次當存在導線斷裂時,導線鍵合機需要停下來,而鍵合導線必須再次手動重新裝入,藉 此導致不必要的長時間的停車時間和導致生產率方面的損失。
因此,本發明的目的在於提供一種用於自動地裝入導線鍵合機的導線的系統和方法,例如在出現導線斷裂的情形下,以便有助於解放有價值的熟練工人進行其他的任務,和有助於減少機器停車時間。
於是,本發明一方面提供一種用於將導線進給到導線鍵合機的鍵合工具的方法,該方法包含有以下步驟:將導線設置於氣動設備中;使用氣動設備促使導線通過導線夾具的夾持位置和導線引導器的孔洞進給,該導線夾具相鄰於氣動設備設置,該導線引導器位於該導線夾具和鍵合工具之間並相鄰於導線夾具設置;以及使用氣動設備促使導線通過鍵合工具進給。
本發明第二方面提供一種在導線鍵合期間當斷裂導線被檢測到以及該導線和鍵合工具分離時將導線進給到導線鍵合機的鍵合工具的方法,該方法包含有以下步驟:在將導線設置於氣動設備中的同時,使用導線夾具夾持導線;將來自導線供應源的一段導線朝向氣動設備進給;開啟導線夾具以釋放導線;使用氣動設備促使導線通過導線引導器的孔洞進給,該導線引導器位於該氣動設備和鍵合工具之間並相鄰於鍵合工具設置;以及使用氣動設備促使導線通過鍵合工具進給。
本發明第三方面提供一種用於將導線進給到導線鍵合機的鍵合工具的裝置,該裝置包含有:氣動設備,其用於促使導線通過氣動設備的出口朝向鍵合工具進給;導線夾具,其相鄰於氣動設備的出口設置;以及具有孔洞的導線引導器,其位於該導線夾具和鍵合工具之間並相鄰於導線夾具設置,以在導線被進給到鍵合工具以前通過該孔洞裝入導線。
參閱後附的描述本發明實施例的附圖,隨後來詳細描述本發明是很方便的。附圖和相關的描述不能理解成是對本發明的限制,本發明的特點限定在申請專利範圍中。
圖2所示為根據本發明第一較佳實施例所述的導線鍵合機的導線進給 路徑的側視示意圖。第二導線夾具12沿著一段鍵合導線10的導線進給路徑設置在導線源,如繞線盤(圖中未示)和氣動設備14之間。鍵合導線10如金線或銅線,從繞線盤供給並被饋送進入氣動設備14中。氣動設備14用來提供縱向力以促使鍵合導線10向上移動拉拽鍵合導線10,或者向下移動而進給鍵合導線10通過氣動設備14的出口朝向鍵合工具。
緊接著在氣動設備14的下方並鄰接於氣動設備14的出口設置的是第一導線夾具16,其沿著導線進給路徑設置。第一導線夾具16被操作來在夾持點處夾持在鍵合導線10上以在導線鍵合過程中限制鍵合導線的移動。當氣動設備14被啟動時,真空吸力被施加在鍵合導線10上以在朝向鍵合工具的方向上驅使和進給導線通過第一導線夾具16的夾持點。
第一導線夾具16應該距氣動設備14盡可能的近。距離越大,鍵合導線10被進給到第一導線夾具16的界限之外的風險越大,這然後可能導致導線彎曲和導線裝入故障。因此,在第一導線夾具16於上位和下位之間轉動的位置,還有在第一導線夾具16向上擺動時第一導線夾具16的上位,氣動設備14的出口和第一導線夾具16之間的距離較合適地應該在0.5mm和10mm之間。
導線引導器18相鄰於第一導線夾具16設置在第一導線夾具16和鍵合工具之間。導線引導器18可以裝配在第一導線夾具16的座體上,其具有小的孔洞以便於鍵合導線10沿著導線進給路徑裝入和引導通過該孔洞到達鍵合工具。然後,鍵合導線10被進給到達鍵合工具,如設置在換能器角體22一端的焊針20。換能器角體22可以是超聲波換能器的一部分。從焊針20的下方端部伸出的鍵合導線10被使用來在焊針20端部位置處完成導線鍵合。
而且,在第二導線夾具12的幫助下,當通過使用第二導線夾具12夾持鍵合導線10的方式限制鍵合導線10移動的同時,通過朝向導線引導器18向上擺動和焊針20一起的換能器角體22,鍵合導線10也能朝向焊針20進給。這個動作強迫鍵合導線10進給到焊針20,並可以替代在氣動設備14處提供向下的氣動力。向下擺動換能器角體22和焊針20的這個進給動作的另一個優點是:通過確保鍵合導線到焊針20端部的充分進給,它有助於消除或降低出現短尾絲或缺球的風險。
圖3所示為根據本發明第二較佳實施例所述的導線鍵合機的導線進給路徑的側視示意圖。第二較佳實施例除了沒有第二導線夾具12之外,類似於第一較佳實施例。所以,沒有包含第二導線夾具12的第二較佳實施例將不被詳細地討論。
對於在開始導線鍵合以前鍵合導線10的進給而言,鍵合導線10首先被操作者手動插入氣動設備14以在氣動設備14中設置鍵合導線10。其後,氣動設備14被啟動以在鍵合導線10上施加向下的真空吸力。該向下的真空吸力將會自動地推動鍵合導線10穿越第一導線夾具16、導線引導器18和焊針20直到鍵合導線10凸伸穿過焊針20的端部。此時導線鍵合機為完成導線鍵合準備就緒。
圖4所示是根據本發明較佳實施例所述的導線鍵合過程中自動導線進給工序的闡述示意圖。在圖4(a)中,導線鍵合過程中出現了斷裂導線24。鍵合導線10中的彈力引起斷裂導線24回縮,並和焊針20分離。所以,一旦在鍵合過程中鍵合系統檢測到了斷裂導線,那麼在鍵合導線10位於氣動設備14中的同時,第二導線夾具12立即被閉合以夾持鍵合導線10,以致於阻止鍵合導線10任何更多的回縮。為此目的第一導線夾具16也應該閉合。如果如同第二較佳實施例沒有第二導線夾具12,那麼只有第一導線夾具16將會閉合在鍵合導線10上以阻止它的移動。
在圖4(b)中,在氣動設備14中,向下的真空吸力被自動地啟動在鍵合導線10上,以便於促使鍵合導線10向下進入導線引導器18朝向焊針20。同時,第二導線夾具12和第一導線夾具16被開啟來釋放鍵合導線10,以從繞線盤朝向氣動設備14進給一段鍵合導線10而饋送鍵合導線10到達焊針20。此外,在開啟第二導線夾具12和第一導線夾具16以前,繞線盤應該饋送一段特定長度的鍵合導線10到達氣動設備14作為緩衝,以阻止鍵合導線10由於鍵合導線10中的張力而回縮並飛離氣動設備14。在通過氣動設備14恰當應用這個向下的力的情形下,鍵合導線10在從焊針20的端部凸伸以前通過導線引導器18的孔洞和焊針20被饋送,以便於在沒有任何操作員關於斷裂導線介入的情形下導線鍵合可以繼續。
圖5所示為鍵合導線的期望尾絲長度可如何自動地獲得。首先將鍵合工 具20設置在導電表面26的上方,該導電表面如引線框、印刷電路板上的印刷銅墊或者在導線鍵合過程中的待鍵合材料上夾持的視窗夾具。從鍵合工具20的較低端部到導電表面26的距離被設定為鍵合導線10的期望尾絲長度。當促使鍵合導線10饋送通過鍵合工具20時,第一導線夾具16迅速開啟和閉合,以控制鍵合導線10的饋送速率。
同時,鍵合粘著檢測(bond stick detection)以短時間間隔連續地完成,以及時確定鍵合導線10接觸導電表面26時的精確位置。鍵合機器中鍵合粘著檢測是普遍的特徵,其涉及導線鍵合過程中的一種工序,在此鍵合裝置檢查電流是否正流經鍵合導線10。如果是,這表明通過鍵合導線10形成了閉合的電路。當閉合的電路被檢測到表明了鍵合導線10和導電表面26是相接觸的時候,更多地進給鍵合導線10到鍵合工具20被停止,以便於自動地獲得合適的尾絲長度。
值得欣賞的是,根據本發明較佳實施例所述的自動導線進給系統減少了在導線鍵合系統中進行裝入鍵合導線的人工干預。這解放了熟練工人以完成其他任務,同時也通過縮短裝入鍵合導線所需的時間來提高生產率。而且,在氣動設備14上方的第二導線夾具12的幫助下,由於減少了用於通過將鍵合導線10更加可靠地進給到焊針20形成第二次鍵合的時滯,導線鍵合工序得以提速。
此處描述的本發明在所具體描述的內容基礎上很容易產生變化、修正和/或補充,可以理解的是所有這些變化、修正和/或補充都包括在本發明的上述描述的精神和範圍內。
10‧‧‧鍵合導線
12‧‧‧第二導線夾具
14‧‧‧氣動設備
16‧‧‧第一導線夾具
18‧‧‧導線引導器
20‧‧‧焊針
22‧‧‧換能器角體
24‧‧‧斷裂導線
100‧‧‧鍵合導線
102‧‧‧氣動設備
104‧‧‧導線引導器
106‧‧‧導線夾具
108‧‧‧焊針
110‧‧‧換能器角體
根據本發明所述的系統和方法的較佳實施例的示例現將參考附圖加以詳細描述,其中:圖1所示為傳統的導線鍵合機的導線進給路徑的側視示意圖。
圖2所示為根據本發明第一較佳實施例所述的導線鍵合機的導線進給路徑的側視示意圖。
圖3所示為根據本發明第二較佳實施例所述的導線鍵合機的導線進給 路徑的側視示意圖。
圖4所示是根據本發明較佳實施例所述的導線鍵合過程中自動導線進給工序的闡述示意圖。
圖5所示為鍵合導線的一段期望尾絲長度可如何自動地獲得。
10‧‧‧鍵合導線
12‧‧‧第二導線夾具
14‧‧‧氣動設備
16‧‧‧第一導線夾具
18‧‧‧導線引導器
20‧‧‧焊針
22‧‧‧換能器角體

Claims (5)

  1. 一種用於在導線鍵合機完成導線鍵合前裝入導線之一端通過導線鍵合機的鍵合工具的方法,該方法包含有以下步驟:將該導線之一端設置於氣動設備中;及施加由該氣動設備產生之力以連續地裝入該導線之一端通過:該氣動設備,相鄰於氣動設備設置的一第一導線夾具的一夾持位置,相鄰於該第一導線夾具設置的一導線引導器的一孔洞,以及相鄰於該導線引導器設置的該鍵合工具,藉以,該方法進一步包括:當使用一第二導線夾具夾持導線的同時,通過在朝向導線引導器的方向上擺動鍵合工具的方式將導線進給到鍵合工具。
  2. 如申請專利範圍第1項所述的方法,其中,該導線引導器安裝在第一導線夾具的座體上。
  3. 如申請專利範圍第1項所述的方法,該方法還包含有以下在前的步驟:將導線手動地插入氣動設備中以將導線設置於氣動設備中;和使用氣動設備促使導線進給的步驟更具體包括以下步驟:啟動氣動設備以在朝向鍵合工具的方向上於導線上施加力。
  4. 如申請專利範圍第1項所述的方法,該方法還包含有:在導線供應源和氣動設備之間設置有第二導線夾具。
  5. 如申請專利範圍第1項所述的方法,該方法還包含有以下的步驟:在導電表面上方如此設置鍵合工具以使鍵合工具和導電表面之間的距離等於期望的尾絲長度,且當導線和導電表面之間的接觸被檢測到時停止將導線進給到鍵合工具,以便於自動獲得期望的尾絲長度。
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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG189657A1 (en) * 2011-10-25 2013-05-31 Asm Tech Singapore Pte Ltd Automatic wire tail adjustment system for wire bonders
WO2014077232A1 (ja) * 2012-11-16 2014-05-22 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法
US9620477B2 (en) * 2013-01-25 2017-04-11 Asm Technology Singapore Pte Ltd Wire bonder and method of calibrating a wire bonder
US9165842B2 (en) * 2014-01-15 2015-10-20 Kulicke And Soffa Industries, Inc. Short tail recovery techniques in wire bonding operations
TWI566875B (zh) * 2014-02-24 2017-01-21 新川股份有限公司 線張力器
US9461013B2 (en) * 2014-11-21 2016-10-04 Asm Technology Singapore Pte Ltd Wire spool system for a wire bonding apparatus
CN105895543B (zh) * 2014-12-01 2019-09-13 恩智浦美国有限公司 接合引线进给系统及其方法
US10679962B2 (en) * 2016-02-09 2020-06-09 Texas Instruments Incorporated Capillary jig for wire bonding and method of installing a capillary
US11420287B2 (en) 2019-09-29 2022-08-23 Ningbo Shangjin Automation Technology Co., Ltd. Wire clamping system for fully automatic wire bonding machine
US11842978B1 (en) * 2022-07-15 2023-12-12 Asmpt Singapore Pte. Ltd. Wire bonding system including a wire biasing tool

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4928871A (en) * 1988-02-23 1990-05-29 Emhart Deutschland Gmbh Apparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding head
US6098868A (en) * 1997-05-23 2000-08-08 Masushita Electric Industrial Co., Ltd. Bump forming method and bump bonder
US20090091006A1 (en) * 2007-10-04 2009-04-09 Rex Warren Pirkle Dual Capillary IC Wirebonding

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4172544A (en) * 1977-05-17 1979-10-30 Sola Basic Industries, Inc. Wire tensioning and feeding device
US5402927A (en) * 1994-06-09 1995-04-04 Kulicke And Soffa Investments, Inc. Adjustable wire tensioning apparatus
JPH0945721A (ja) * 1995-08-03 1997-02-14 Kaijo Corp ワイヤ案内装置及びワイヤ案内方法並びに該装置を具備したワイヤボンディング装置
JPH09252005A (ja) * 1996-03-15 1997-09-22 Shinkawa Ltd バンプ形成方法
US6273321B1 (en) * 1996-12-19 2001-08-14 Texas Instruments Incorporated Wire bonding with capillary realignment
JP3455126B2 (ja) * 1999-03-02 2003-10-14 株式会社新川 ワイヤボンデイング方法
JP3566156B2 (ja) * 1999-12-02 2004-09-15 株式会社新川 ピン状ワイヤ等の形成方法
JP2002083837A (ja) * 2000-09-07 2002-03-22 Shinkawa Ltd ワイヤボンディング装置
US6641025B2 (en) * 2001-08-30 2003-11-04 Micron Technology, Inc. Threading tool and method for bond wire capillary tubes
US20090308904A1 (en) * 2006-11-09 2009-12-17 Kulicke And Soffa Industries, Inc. Wire feed system and method of operating the same
US7954689B2 (en) * 2007-05-04 2011-06-07 Asm Technology Singapore Pte Ltd Vacuum wire tensioner for wire bonder

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4928871A (en) * 1988-02-23 1990-05-29 Emhart Deutschland Gmbh Apparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding head
US6098868A (en) * 1997-05-23 2000-08-08 Masushita Electric Industrial Co., Ltd. Bump forming method and bump bonder
US20090091006A1 (en) * 2007-10-04 2009-04-09 Rex Warren Pirkle Dual Capillary IC Wirebonding

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