DE3672530D1 - Verbindungskopf. - Google Patents
Verbindungskopf.Info
- Publication number
- DE3672530D1 DE3672530D1 DE8686107270T DE3672530T DE3672530D1 DE 3672530 D1 DE3672530 D1 DE 3672530D1 DE 8686107270 T DE8686107270 T DE 8686107270T DE 3672530 T DE3672530 T DE 3672530T DE 3672530 D1 DE3672530 D1 DE 3672530D1
- Authority
- DE
- Germany
- Prior art keywords
- connecting head
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01061—Promethium [Pm]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8686107270T DE3672530D1 (de) | 1985-05-31 | 1986-05-28 | Verbindungskopf. |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19853519594 DE3519594A1 (de) | 1985-05-31 | 1985-05-31 | Bondkopf |
GB868612001A GB8612001D0 (en) | 1986-05-16 | 1986-05-16 | Wire bonding machine |
DE8686107270T DE3672530D1 (de) | 1985-05-31 | 1986-05-28 | Verbindungskopf. |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3672530D1 true DE3672530D1 (de) | 1990-08-16 |
Family
ID=25832742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686107270T Expired - Fee Related DE3672530D1 (de) | 1985-05-31 | 1986-05-28 | Verbindungskopf. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4781319A (de) |
EP (1) | EP0203597B1 (de) |
DE (1) | DE3672530D1 (de) |
SG (1) | SG49491G (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3912580C2 (de) * | 1989-04-17 | 1997-08-21 | F&K Delvotec Bondtechnik Gmbh | Bondstempel |
US5288007A (en) * | 1991-10-04 | 1994-02-22 | International Business Machine Corporation | Apparatus and methods for making simultaneous electrical connections |
JP2527399B2 (ja) * | 1992-09-29 | 1996-08-21 | 完テクノソニックス株式会社 | ワイヤ―・ボンダ―・システム |
DE4326478C2 (de) * | 1993-07-13 | 2000-02-17 | F&K Delvotec Bondtechnik Gmbh | Bondkopf für Ultraschall-Bonden |
US5452838A (en) * | 1993-07-13 | 1995-09-26 | F & K Delvotec Bondtechnik Gmbh | Bonding head for an ultrasonic bonding machine |
DE4335468A1 (de) * | 1993-10-18 | 1995-04-20 | F&K Delvotec Bondtechnik Gmbh | Vorrichtung und Verfahren zum Drahtbonden |
EP0864392B1 (de) * | 1997-03-13 | 2001-08-16 | F & K Delvotec Bondtechnik GmbH | Bondkopf |
US6206275B1 (en) | 1999-10-13 | 2001-03-27 | F & K Delvotec Bondtechnik Gmbh | Deep access, close proximity, fine pitch bonding of large wire |
EP1375048B1 (de) * | 2002-06-18 | 2008-05-21 | F&K Delvotec Bondtechnik GmbH | Bondeinrichtung und Drahtbonder |
US7407079B2 (en) * | 2003-10-23 | 2008-08-05 | Orthodyne Electronics Corporation | Automated filament attachment system for vacuum fluorescent display |
CN101179183B (zh) * | 2006-11-08 | 2010-05-26 | 鸿富锦精密工业(深圳)有限公司 | 线夹 |
US8091762B1 (en) * | 2010-12-08 | 2012-01-10 | Asm Assembly Automation Ltd | Wedge bonding method incorporating remote pattern recognition system |
US20120241506A1 (en) * | 2011-03-24 | 2012-09-27 | Fci Americas Technology Llc | Concave Solder Tip |
US8540136B1 (en) * | 2012-09-06 | 2013-09-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for stud bump formation and apparatus for performing the same |
US9366879B1 (en) | 2014-12-02 | 2016-06-14 | Hutchinson Technology Incorporated | Camera lens suspension with polymer bearings |
US9454016B1 (en) | 2015-03-06 | 2016-09-27 | Hutchinson Technology Incorporated | Camera lens suspension with integrated electrical leads |
WO2016161075A1 (en) * | 2015-04-02 | 2016-10-06 | Hutchinson Technology Incorporated | Wire feeding and attaching system for camera lens suspensions |
US10670878B2 (en) | 2016-05-19 | 2020-06-02 | Hutchinson Technology Incorporated | Camera lens suspensions |
US11409070B2 (en) | 2016-06-09 | 2022-08-09 | Hutchinson Technology Incorporated | Shape memory alloy wire attachment structures with adhesive for a suspension assembly |
US11420287B2 (en) * | 2019-09-29 | 2022-08-23 | Ningbo Shangjin Automation Technology Co., Ltd. | Wire clamping system for fully automatic wire bonding machine |
CN114226941B (zh) * | 2021-12-08 | 2023-05-12 | 中国电子科技集团公司第十三研究所 | 手持式射频微波组件点焊工装 |
CN114247975B (zh) * | 2021-12-13 | 2024-01-30 | 中国电子科技集团公司第十三研究所 | 自动点焊送线装置及引线点焊方法 |
DE102022001054A1 (de) * | 2022-03-25 | 2023-09-28 | Hesse Gmbh | Ultraschallbondvorrichtung und Drahtführungsmodul hierfür |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3342972A (en) * | 1964-01-22 | 1967-09-19 | Aerojet General Co | Welding electrode assembly |
US3593906A (en) * | 1969-02-20 | 1971-07-20 | Ibm | Conductor handling and bonding system |
US3643321A (en) * | 1970-06-17 | 1972-02-22 | Kulicke & Soffa Ind Inc | Method and apparatus for tailless wire bonding |
US3734386A (en) * | 1971-06-30 | 1973-05-22 | Ibm | Wiring apparatus with wire path forming means |
DE2528806C2 (de) * | 1975-06-27 | 1983-09-15 | Texas Instruments Deutschland Gmbh, 8050 Freising | Schweißvorrichtung |
CH592365A5 (de) * | 1975-12-23 | 1977-10-31 | Esec Sales Sa | |
CH619334A5 (de) * | 1977-09-07 | 1980-09-15 | Esec Sales Sa | |
US4202482A (en) * | 1978-11-22 | 1980-05-13 | Kulicke & Soffa Industries, Inc. | Solenoid actuated wire feed and tearing apparatus |
JPS5698900A (en) * | 1980-01-07 | 1981-08-08 | Hitachi Ltd | Device for automatically wiring printed circuit board |
US4422568A (en) * | 1981-01-12 | 1983-12-27 | Kulicke And Soffa Industries, Inc. | Method of making constant bonding wire tail lengths |
US4418858A (en) * | 1981-01-23 | 1983-12-06 | Miller C Fredrick | Deep bonding methods and apparatus |
JPS58137221A (ja) * | 1982-02-10 | 1983-08-15 | Hitachi Ltd | ワイヤボンデイング装置 |
US4550871A (en) * | 1982-08-24 | 1985-11-05 | Asm Assembly Automation Ltd. | Four-motion wire bonder |
US4576322A (en) * | 1984-09-14 | 1986-03-18 | Burroughs Corporation | Machine for ultrasonically bonding wires to cavity-down integrated circuit packages |
-
1986
- 1986-05-28 DE DE8686107270T patent/DE3672530D1/de not_active Expired - Fee Related
- 1986-05-28 EP EP86107270A patent/EP0203597B1/de not_active Expired - Lifetime
- 1986-05-30 US US06/869,091 patent/US4781319A/en not_active Expired - Lifetime
-
1991
- 1991-06-25 SG SG494/91A patent/SG49491G/en unknown
Also Published As
Publication number | Publication date |
---|---|
SG49491G (en) | 1991-08-23 |
EP0203597A2 (de) | 1986-12-03 |
US4781319A (en) | 1988-11-01 |
EP0203597B1 (de) | 1990-07-11 |
EP0203597A3 (en) | 1988-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: EMHART INC., NEWARK, DEL., US |
|
8328 | Change in the person/name/address of the agent |
Free format text: PAGENBERG, J., DR.JUR. FROHWITTER, B., DIPL.-ING., RECHTSANWAELTE GEISSLER, B., DIPL.-PHYS.DR.JUR., PAT.- U. RECHTSANW. BARDEHLE, H., DIPL.-ING. DOST, W., DIPL.-CHEM. DR.RER.NAT. ALTENBURG, U., DIPL.-PHYS., PAT.-ANWAELTE, 8000 MUENCHEN |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: F & K DELVOTEC BONDTECHNIK GMBH, 82041 OBERHACHING |
|
8339 | Ceased/non-payment of the annual fee |