JPH0371743B2 - - Google Patents
Info
- Publication number
- JPH0371743B2 JPH0371743B2 JP62277143A JP27714387A JPH0371743B2 JP H0371743 B2 JPH0371743 B2 JP H0371743B2 JP 62277143 A JP62277143 A JP 62277143A JP 27714387 A JP27714387 A JP 27714387A JP H0371743 B2 JPH0371743 B2 JP H0371743B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lands
- lead terminals
- substrates
- recesses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 31
- 230000000630 rising effect Effects 0.000 claims description 11
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- 230000005611 electricity Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000010030 laminating Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62277143A JPH01120781A (ja) | 1987-10-31 | 1987-10-31 | 多層配線基板モジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62277143A JPH01120781A (ja) | 1987-10-31 | 1987-10-31 | 多層配線基板モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01120781A JPH01120781A (ja) | 1989-05-12 |
| JPH0371743B2 true JPH0371743B2 (en, 2012) | 1991-11-14 |
Family
ID=17579398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62277143A Granted JPH01120781A (ja) | 1987-10-31 | 1987-10-31 | 多層配線基板モジュール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01120781A (en, 2012) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05312142A (ja) * | 1992-05-12 | 1993-11-22 | Kazunori Mikami | マグネットエンジン |
| DE102007021740A1 (de) * | 2007-05-09 | 2008-11-13 | Continental Automotive Gmbh | Leiterplatte mit integriertem Pressfit-Pin |
| CN106559954A (zh) * | 2016-10-31 | 2017-04-05 | 努比亚技术有限公司 | 多层电路板 |
-
1987
- 1987-10-31 JP JP62277143A patent/JPH01120781A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01120781A (ja) | 1989-05-12 |
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