JPH0370397B2 - - Google Patents
Info
- Publication number
- JPH0370397B2 JPH0370397B2 JP22378982A JP22378982A JPH0370397B2 JP H0370397 B2 JPH0370397 B2 JP H0370397B2 JP 22378982 A JP22378982 A JP 22378982A JP 22378982 A JP22378982 A JP 22378982A JP H0370397 B2 JPH0370397 B2 JP H0370397B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- multilayer printed
- fluid
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012530 fluid Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000009826 distribution Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 238000009461 vacuum packaging Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22378982A JPS59114894A (ja) | 1982-12-22 | 1982-12-22 | 多層プリント配線板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22378982A JPS59114894A (ja) | 1982-12-22 | 1982-12-22 | 多層プリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59114894A JPS59114894A (ja) | 1984-07-03 |
JPH0370397B2 true JPH0370397B2 (fr) | 1991-11-07 |
Family
ID=16803732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22378982A Granted JPS59114894A (ja) | 1982-12-22 | 1982-12-22 | 多層プリント配線板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59114894A (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61159719A (ja) * | 1984-12-29 | 1986-07-19 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
JPS61159718A (ja) * | 1984-12-29 | 1986-07-19 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
JPH01208103A (ja) * | 1988-02-16 | 1989-08-22 | Murata Mfg Co Ltd | 積層セラミックブロックの成形方法 |
JPH085052B2 (ja) * | 1992-08-11 | 1996-01-24 | 日本特殊陶業株式会社 | セラミックス積層体の製造方法 |
-
1982
- 1982-12-22 JP JP22378982A patent/JPS59114894A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59114894A (ja) | 1984-07-03 |
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