JPH0368554B2 - - Google Patents
Info
- Publication number
- JPH0368554B2 JPH0368554B2 JP61262529A JP26252986A JPH0368554B2 JP H0368554 B2 JPH0368554 B2 JP H0368554B2 JP 61262529 A JP61262529 A JP 61262529A JP 26252986 A JP26252986 A JP 26252986A JP H0368554 B2 JPH0368554 B2 JP H0368554B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- printed circuit
- cavity
- mold
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 238000001746 injection moulding Methods 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- -1 UITEM Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26252986A JPS63164294A (ja) | 1986-11-04 | 1986-11-04 | プリント回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26252986A JPS63164294A (ja) | 1986-11-04 | 1986-11-04 | プリント回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63164294A JPS63164294A (ja) | 1988-07-07 |
| JPH0368554B2 true JPH0368554B2 (de) | 1991-10-28 |
Family
ID=17377062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26252986A Granted JPS63164294A (ja) | 1986-11-04 | 1986-11-04 | プリント回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63164294A (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4944087A (en) * | 1988-10-05 | 1990-07-31 | Rogers Corporation | Method of making a curved plastic body with circuit pattern |
| JPH10163660A (ja) * | 1996-11-29 | 1998-06-19 | Hitachi Ltd | 空冷電子機器装置 |
| JP3552559B2 (ja) * | 1998-03-11 | 2004-08-11 | 株式会社デンソー | 発熱体冷却装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61102093A (ja) * | 1984-10-25 | 1986-05-20 | シャープ株式会社 | プリント基板の製造方法 |
-
1986
- 1986-11-04 JP JP26252986A patent/JPS63164294A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61102093A (ja) * | 1984-10-25 | 1986-05-20 | シャープ株式会社 | プリント基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63164294A (ja) | 1988-07-07 |
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