JPH0563111B2 - - Google Patents
Info
- Publication number
- JPH0563111B2 JPH0563111B2 JP23919887A JP23919887A JPH0563111B2 JP H0563111 B2 JPH0563111 B2 JP H0563111B2 JP 23919887 A JP23919887 A JP 23919887A JP 23919887 A JP23919887 A JP 23919887A JP H0563111 B2 JPH0563111 B2 JP H0563111B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- circuit
- board
- base film
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 36
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 238000000465 moulding Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 230000004927 fusion Effects 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 206010040844 Skin exfoliation Diseases 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229920006269 PPS film Polymers 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920013655 poly(bisphenol-A sulfone) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23919887A JPS6481392A (en) | 1987-09-24 | 1987-09-24 | Injection molding of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23919887A JPS6481392A (en) | 1987-09-24 | 1987-09-24 | Injection molding of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6481392A JPS6481392A (en) | 1989-03-27 |
| JPH0563111B2 true JPH0563111B2 (de) | 1993-09-09 |
Family
ID=17041185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23919887A Granted JPS6481392A (en) | 1987-09-24 | 1987-09-24 | Injection molding of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6481392A (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07105583B2 (ja) * | 1990-11-30 | 1995-11-13 | 日東紡績株式会社 | プリント配線体 |
| US6197145B1 (en) * | 1998-08-17 | 2001-03-06 | Ford Motor Company | Method of laminating a flexible circuit to a substrate |
-
1987
- 1987-09-24 JP JP23919887A patent/JPS6481392A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6481392A (en) | 1989-03-27 |
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