JPH0368067B2 - - Google Patents

Info

Publication number
JPH0368067B2
JPH0368067B2 JP59186074A JP18607484A JPH0368067B2 JP H0368067 B2 JPH0368067 B2 JP H0368067B2 JP 59186074 A JP59186074 A JP 59186074A JP 18607484 A JP18607484 A JP 18607484A JP H0368067 B2 JPH0368067 B2 JP H0368067B2
Authority
JP
Japan
Prior art keywords
resin
silica
weight
silica particles
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59186074A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6164755A (ja
Inventor
Michio Ito
Yasuaki Shinohara
Yoshiaki Kurata
Sumikazu Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP18607484A priority Critical patent/JPS6164755A/ja
Publication of JPS6164755A publication Critical patent/JPS6164755A/ja
Publication of JPH0368067B2 publication Critical patent/JPH0368067B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
JP18607484A 1984-09-05 1984-09-05 バリが発生しない封止材用シリカ充填樹脂組成物 Granted JPS6164755A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18607484A JPS6164755A (ja) 1984-09-05 1984-09-05 バリが発生しない封止材用シリカ充填樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18607484A JPS6164755A (ja) 1984-09-05 1984-09-05 バリが発生しない封止材用シリカ充填樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6164755A JPS6164755A (ja) 1986-04-03
JPH0368067B2 true JPH0368067B2 (enrdf_load_stackoverflow) 1991-10-25

Family

ID=16181926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18607484A Granted JPS6164755A (ja) 1984-09-05 1984-09-05 バリが発生しない封止材用シリカ充填樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6164755A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2574364B2 (ja) * 1988-02-09 1997-01-22 日東電工株式会社 半導体装置
JPH0672202B2 (ja) * 1988-10-06 1994-09-14 東レ株式会社 半導体封止用エポキシ樹脂組成物
JPH02158637A (ja) * 1988-12-09 1990-06-19 Nippon Chem Ind Co Ltd シリカフィラーおよびこれを用いた封止用樹脂組成物
JP2925088B2 (ja) * 1989-03-20 1999-07-26 日本化学工業株式会社 微細溶融球状シリカ及びこれを用いた封止用樹脂組成物
JP3827391B2 (ja) * 1997-03-04 2006-09-27 昭和高分子株式会社 封止用樹脂組成物
JP3907773B2 (ja) * 1997-03-25 2007-04-18 昭和高分子株式会社 低熱膨張性硬化体のための樹脂組成物およびその複合体
JP5038007B2 (ja) * 2007-04-17 2012-10-03 電気化学工業株式会社 組成物、それを用いた金属ベース回路基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138740A (ja) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物

Also Published As

Publication number Publication date
JPS6164755A (ja) 1986-04-03

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