JPH0365020B2 - - Google Patents

Info

Publication number
JPH0365020B2
JPH0365020B2 JP60212854A JP21285485A JPH0365020B2 JP H0365020 B2 JPH0365020 B2 JP H0365020B2 JP 60212854 A JP60212854 A JP 60212854A JP 21285485 A JP21285485 A JP 21285485A JP H0365020 B2 JPH0365020 B2 JP H0365020B2
Authority
JP
Japan
Prior art keywords
side electrode
diode
pellet
resin
same shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60212854A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6272147A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60212854A priority Critical patent/JPS6272147A/ja
Publication of JPS6272147A publication Critical patent/JPS6272147A/ja
Publication of JPH0365020B2 publication Critical patent/JPH0365020B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10W72/30—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/40139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous strap daisy chain
    • H10W72/07336—
    • H10W72/076—
    • H10W72/07636—
    • H10W72/07651—
    • H10W72/07653—
    • H10W72/60—
    • H10W72/631—
    • H10W90/736—
    • H10W90/763—
    • H10W90/766—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60212854A 1985-09-26 1985-09-26 樹脂封止型半導体装置 Granted JPS6272147A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60212854A JPS6272147A (ja) 1985-09-26 1985-09-26 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60212854A JPS6272147A (ja) 1985-09-26 1985-09-26 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS6272147A JPS6272147A (ja) 1987-04-02
JPH0365020B2 true JPH0365020B2 (cg-RX-API-DMAC10.html) 1991-10-09

Family

ID=16629414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60212854A Granted JPS6272147A (ja) 1985-09-26 1985-09-26 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS6272147A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2992873B2 (ja) * 1995-12-26 1999-12-20 サンケン電気株式会社 半導体装置
US5917245A (en) * 1995-12-26 1999-06-29 Mitsubishi Electric Corp. Semiconductor device with brazing mount
JP4491244B2 (ja) 2004-01-07 2010-06-30 三菱電機株式会社 電力半導体装置

Also Published As

Publication number Publication date
JPS6272147A (ja) 1987-04-02

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term