JPH0363220B2 - - Google Patents
Info
- Publication number
- JPH0363220B2 JPH0363220B2 JP56146547A JP14654781A JPH0363220B2 JP H0363220 B2 JPH0363220 B2 JP H0363220B2 JP 56146547 A JP56146547 A JP 56146547A JP 14654781 A JP14654781 A JP 14654781A JP H0363220 B2 JPH0363220 B2 JP H0363220B2
- Authority
- JP
- Japan
- Prior art keywords
- groove
- film
- substrate
- insulating material
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W10/00—
-
- H10W10/01—
-
- H10W10/0145—
-
- H10W10/0148—
-
- H10W10/17—
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- H10W20/021—
Landscapes
- Local Oxidation Of Silicon (AREA)
- Element Separation (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56146547A JPS5848437A (ja) | 1981-09-17 | 1981-09-17 | 半導体装置の製造方法 |
| US06/418,802 US4491486A (en) | 1981-09-17 | 1982-09-16 | Method for manufacturing a semiconductor device |
| EP82108596A EP0091984B1 (en) | 1981-09-17 | 1982-09-17 | Integrated circuit devices comprising dielectric isolation regions and methods for making such devices |
| DE8282108596T DE3280101D1 (de) | 1981-09-17 | 1982-09-17 | Integrierte schaltungsanordnungen mit dielektrischen isolationsmassen und verfahren zur herstellung dieser anordnungen. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56146547A JPS5848437A (ja) | 1981-09-17 | 1981-09-17 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5848437A JPS5848437A (ja) | 1983-03-22 |
| JPH0363220B2 true JPH0363220B2 (cg-RX-API-DMAC10.html) | 1991-09-30 |
Family
ID=15410120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56146547A Granted JPS5848437A (ja) | 1981-09-17 | 1981-09-17 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5848437A (cg-RX-API-DMAC10.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59181641A (ja) * | 1983-03-31 | 1984-10-16 | Fujitsu Ltd | 半導体装置 |
| KR0151267B1 (ko) * | 1995-05-23 | 1998-12-01 | 문정환 | 반도체장치의 제조방법 |
| KR100236097B1 (ko) * | 1996-10-30 | 1999-12-15 | 김영환 | 반도체 장치의 격리막 형성방법 |
| JP2005303253A (ja) * | 2004-03-18 | 2005-10-27 | Fuji Electric Device Technology Co Ltd | 半導体装置の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50147878A (cg-RX-API-DMAC10.html) * | 1974-05-17 | 1975-11-27 | ||
| JPS5643171U (cg-RX-API-DMAC10.html) * | 1979-09-10 | 1981-04-20 |
-
1981
- 1981-09-17 JP JP56146547A patent/JPS5848437A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5848437A (ja) | 1983-03-22 |
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