JPH0353779B2 - - Google Patents

Info

Publication number
JPH0353779B2
JPH0353779B2 JP60248654A JP24865485A JPH0353779B2 JP H0353779 B2 JPH0353779 B2 JP H0353779B2 JP 60248654 A JP60248654 A JP 60248654A JP 24865485 A JP24865485 A JP 24865485A JP H0353779 B2 JPH0353779 B2 JP H0353779B2
Authority
JP
Japan
Prior art keywords
adhesive
lid
substrate
present
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60248654A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62108545A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60248654A priority Critical patent/JPS62108545A/ja
Publication of JPS62108545A publication Critical patent/JPS62108545A/ja
Publication of JPH0353779B2 publication Critical patent/JPH0353779B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Packages (AREA)
  • Casings For Electric Apparatus (AREA)
JP60248654A 1985-11-06 1985-11-06 プリント基板型パッケ−ジ Granted JPS62108545A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60248654A JPS62108545A (ja) 1985-11-06 1985-11-06 プリント基板型パッケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60248654A JPS62108545A (ja) 1985-11-06 1985-11-06 プリント基板型パッケ−ジ

Publications (2)

Publication Number Publication Date
JPS62108545A JPS62108545A (ja) 1987-05-19
JPH0353779B2 true JPH0353779B2 (cg-RX-API-DMAC7.html) 1991-08-16

Family

ID=17181339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60248654A Granted JPS62108545A (ja) 1985-11-06 1985-11-06 プリント基板型パッケ−ジ

Country Status (1)

Country Link
JP (1) JPS62108545A (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2539677Y2 (ja) * 1990-04-27 1997-06-25 三菱重工業株式会社 Ｆｒｐ製容器
JPH079381Y2 (ja) * 1990-10-18 1995-03-06 株式会社三社電機製作所 半導体装置
JP2828055B2 (ja) * 1996-08-19 1998-11-25 日本電気株式会社 フリップチップの製造方法

Also Published As

Publication number Publication date
JPS62108545A (ja) 1987-05-19

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees