JPH0353067B2 - - Google Patents

Info

Publication number
JPH0353067B2
JPH0353067B2 JP58099922A JP9992283A JPH0353067B2 JP H0353067 B2 JPH0353067 B2 JP H0353067B2 JP 58099922 A JP58099922 A JP 58099922A JP 9992283 A JP9992283 A JP 9992283A JP H0353067 B2 JPH0353067 B2 JP H0353067B2
Authority
JP
Japan
Prior art keywords
carrier
connecting rod
carrier body
guide rail
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58099922A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59225885A (ja
Inventor
Yatsuharu Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOKOTA KIKAI KK
Original Assignee
YOKOTA KIKAI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOKOTA KIKAI KK filed Critical YOKOTA KIKAI KK
Priority to JP9992283A priority Critical patent/JPS59225885A/ja
Publication of JPS59225885A publication Critical patent/JPS59225885A/ja
Publication of JPH0353067B2 publication Critical patent/JPH0353067B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0669Solder baths with dipping means
    • B23K3/0676Conveyors therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chain Conveyers (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP9992283A 1983-06-05 1983-06-05 自動半田付け方法及び装置 Granted JPS59225885A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9992283A JPS59225885A (ja) 1983-06-05 1983-06-05 自動半田付け方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9992283A JPS59225885A (ja) 1983-06-05 1983-06-05 自動半田付け方法及び装置

Publications (2)

Publication Number Publication Date
JPS59225885A JPS59225885A (ja) 1984-12-18
JPH0353067B2 true JPH0353067B2 (enrdf_load_stackoverflow) 1991-08-13

Family

ID=14260259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9992283A Granted JPS59225885A (ja) 1983-06-05 1983-06-05 自動半田付け方法及び装置

Country Status (1)

Country Link
JP (1) JPS59225885A (enrdf_load_stackoverflow)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5187279A (ja) * 1975-01-25 1976-07-30 Nitto Seiko Kk Isosochi
JPS5456169A (en) * 1977-10-13 1979-05-04 Kondo Kenji Method of soldering print substrate
JPS5853173Y2 (ja) * 1979-04-09 1983-12-03 クラリオン株式会社 自動半田付装置における搬送機構
JPS5860594A (ja) * 1981-10-06 1983-04-11 近藤 権士 はんだ付け装置用プリント基板搬送装置

Also Published As

Publication number Publication date
JPS59225885A (ja) 1984-12-18

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