JPH0351097B2 - - Google Patents

Info

Publication number
JPH0351097B2
JPH0351097B2 JP58141879A JP14187983A JPH0351097B2 JP H0351097 B2 JPH0351097 B2 JP H0351097B2 JP 58141879 A JP58141879 A JP 58141879A JP 14187983 A JP14187983 A JP 14187983A JP H0351097 B2 JPH0351097 B2 JP H0351097B2
Authority
JP
Japan
Prior art keywords
chip
connection
chips
bonding
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58141879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6034023A (ja
Inventor
Masabumi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP14187983A priority Critical patent/JPS6034023A/ja
Publication of JPS6034023A publication Critical patent/JPS6034023A/ja
Publication of JPH0351097B2 publication Critical patent/JPH0351097B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0655—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP14187983A 1983-08-04 1983-08-04 半導体チップの基板への実装方法 Granted JPS6034023A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14187983A JPS6034023A (ja) 1983-08-04 1983-08-04 半導体チップの基板への実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14187983A JPS6034023A (ja) 1983-08-04 1983-08-04 半導体チップの基板への実装方法

Publications (2)

Publication Number Publication Date
JPS6034023A JPS6034023A (ja) 1985-02-21
JPH0351097B2 true JPH0351097B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-08-05

Family

ID=15302283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14187983A Granted JPS6034023A (ja) 1983-08-04 1983-08-04 半導体チップの基板への実装方法

Country Status (1)

Country Link
JP (1) JPS6034023A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5600363A (en) * 1988-12-28 1997-02-04 Kyocera Corporation Image forming apparatus having driving means at each end of array and power feeding substrate outside head housing

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS582037A (ja) * 1981-06-29 1983-01-07 Oki Electric Ind Co Ltd Ｉｃ等の実装方法
JPS5862076A (ja) * 1981-10-12 1983-04-13 Oki Electric Ind Co Ltd サ−マルヘツドの二層配線部の製造方法

Also Published As

Publication number Publication date
JPS6034023A (ja) 1985-02-21

Similar Documents

Publication Publication Date Title
US5612570A (en) Chip stack and method of making same
US5508565A (en) Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package
US4843191A (en) Interconnection technique using dielectric layers
JP2568748B2 (ja) 半導体装置
JP3549714B2 (ja) 半導体装置
JPS6318654A (ja) 電子装置
JPH0351097B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
US5510654A (en) Semiconductor device and method of fabricating same
JP3692353B2 (ja) 半導体装置のアッセンブリ方法
JPH04199563A (ja) 半導体集積回路用パッケージ
JP2694880B2 (ja) Ｉｃカード
JPS6226317B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH06350025A (ja) 半導体装置
JPS62142660A (ja) 感熱記録用ヘツドのワイヤボンデイング接続方法
JPH01132150A (ja) 半導体チップのキャリア基板
JPH07283274A (ja) 半導体装置及び接合シート
JPH06112402A (ja) 半導体装置
JPH023259A (ja) マスタスライス型半導体装置の製造方法
JPS58184735A (ja) 集積回路チツプ
JPS6034024A (ja) 半導体チップの基板への実装方法
JP2826518B2 (ja) 半導体装置
JP4229086B2 (ja) 半導体装置
JPS60255458A (ja) サーマルヘッドとその製造方法
JPH05129520A (ja) 半導体集積回路装置及びその製造方法
JPH02275650A (ja) 半導体素子の実装構造