JPH0342504B2 - - Google Patents

Info

Publication number
JPH0342504B2
JPH0342504B2 JP58071749A JP7174983A JPH0342504B2 JP H0342504 B2 JPH0342504 B2 JP H0342504B2 JP 58071749 A JP58071749 A JP 58071749A JP 7174983 A JP7174983 A JP 7174983A JP H0342504 B2 JPH0342504 B2 JP H0342504B2
Authority
JP
Japan
Prior art keywords
suction
suction tool
chip
plunger
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58071749A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59197143A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP58071749A priority Critical patent/JPS59197143A/ja
Publication of JPS59197143A publication Critical patent/JPS59197143A/ja
Publication of JPH0342504B2 publication Critical patent/JPH0342504B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H10P72/78—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP58071749A 1983-04-22 1983-04-22 部品マウント装置 Granted JPS59197143A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58071749A JPS59197143A (ja) 1983-04-22 1983-04-22 部品マウント装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58071749A JPS59197143A (ja) 1983-04-22 1983-04-22 部品マウント装置

Publications (2)

Publication Number Publication Date
JPS59197143A JPS59197143A (ja) 1984-11-08
JPH0342504B2 true JPH0342504B2 (show.php) 1991-06-27

Family

ID=13469486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58071749A Granted JPS59197143A (ja) 1983-04-22 1983-04-22 部品マウント装置

Country Status (1)

Country Link
JP (1) JPS59197143A (show.php)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62192646U (show.php) * 1986-05-29 1987-12-08
JPH0983193A (ja) * 1995-09-13 1997-03-28 Matsushita Electric Ind Co Ltd 電子部品実装機の部品吸着ヘッド
JP2001260065A (ja) * 2000-03-17 2001-09-25 Advantest Corp 部品保持装置
JP4616793B2 (ja) * 2006-05-17 2011-01-19 株式会社新川 多段加圧コレット
WO2009056468A1 (en) * 2007-10-31 2009-05-07 Oerlikon Assembly Equipment Ag, Steinhausen Pick-up tool and method for grasping and mounting small dies
KR101071247B1 (ko) 2008-12-30 2011-10-10 엘아이지에이디피 주식회사 리프트 핀 모듈 및 이를 구비하는 기판 합착기

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4428387Y1 (show.php) * 1966-10-19 1969-11-25
JPS492868U (show.php) * 1972-04-17 1974-01-11

Also Published As

Publication number Publication date
JPS59197143A (ja) 1984-11-08

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