JPH0334920Y2 - - Google Patents
Info
- Publication number
- JPH0334920Y2 JPH0334920Y2 JP10030986U JP10030986U JPH0334920Y2 JP H0334920 Y2 JPH0334920 Y2 JP H0334920Y2 JP 10030986 U JP10030986 U JP 10030986U JP 10030986 U JP10030986 U JP 10030986U JP H0334920 Y2 JPH0334920 Y2 JP H0334920Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- land portion
- lead frame
- bonded
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 238000000465 moulding Methods 0.000 claims description 2
- 238000005336 cracking Methods 0.000 description 5
- 230000001351 cycling effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10030986U JPH0334920Y2 (US20110009641A1-20110113-C00116.png) | 1986-06-30 | 1986-06-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10030986U JPH0334920Y2 (US20110009641A1-20110113-C00116.png) | 1986-06-30 | 1986-06-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS636751U JPS636751U (US20110009641A1-20110113-C00116.png) | 1988-01-18 |
JPH0334920Y2 true JPH0334920Y2 (US20110009641A1-20110113-C00116.png) | 1991-07-24 |
Family
ID=30970013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10030986U Expired JPH0334920Y2 (US20110009641A1-20110113-C00116.png) | 1986-06-30 | 1986-06-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0334920Y2 (US20110009641A1-20110113-C00116.png) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58441B2 (ja) * | 1978-07-08 | 1983-01-06 | 工業技術院長 | キトサンの製造方法 |
JPS58440B2 (ja) * | 1971-11-20 | 1983-01-06 | フエルナオ・アウグスト・デ・アラウ−ホ・ヴイセンテ | 17,21−ジヒドロキシ−20−ケトプレグナン類の製造方法 |
JPS61136249A (ja) * | 1984-12-06 | 1986-06-24 | Nec Kansai Ltd | ハイブリツドic |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5461556U (US20110009641A1-20110113-C00116.png) * | 1977-10-07 | 1979-04-28 | ||
JPS58441U (ja) * | 1981-06-25 | 1983-01-05 | 富士通株式会社 | プラスチツクパツケ−ジ |
JPS58440U (ja) * | 1981-06-25 | 1983-01-05 | 富士通株式会社 | プラスチツクパツケ−ジ |
-
1986
- 1986-06-30 JP JP10030986U patent/JPH0334920Y2/ja not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58440B2 (ja) * | 1971-11-20 | 1983-01-06 | フエルナオ・アウグスト・デ・アラウ−ホ・ヴイセンテ | 17,21−ジヒドロキシ−20−ケトプレグナン類の製造方法 |
JPS58441B2 (ja) * | 1978-07-08 | 1983-01-06 | 工業技術院長 | キトサンの製造方法 |
JPS61136249A (ja) * | 1984-12-06 | 1986-06-24 | Nec Kansai Ltd | ハイブリツドic |
Also Published As
Publication number | Publication date |
---|---|
JPS636751U (US20110009641A1-20110113-C00116.png) | 1988-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5841183A (en) | Chip resistor having insulating body with a continuous resistance layer and semiconductor device | |
JPH0334920Y2 (US20110009641A1-20110113-C00116.png) | ||
JP2829567B2 (ja) | チップマウント型led | |
KR970024043A (ko) | 금속성 전자 부품 패키지 장치(metallic electronic component package device) | |
JP2712967B2 (ja) | 半導体装置 | |
JP3284604B2 (ja) | 放熱板付樹脂封止半導体装置の製造方法 | |
JPS61136249A (ja) | ハイブリツドic | |
JPS6143857B2 (US20110009641A1-20110113-C00116.png) | ||
JP7478554B2 (ja) | 面実装型抵抗器 | |
JP2728996B2 (ja) | 多端子接続構造 | |
JPH03276788A (ja) | 集積回路搭載用セラミックス基板 | |
JPS624860B2 (US20110009641A1-20110113-C00116.png) | ||
JPH1126897A (ja) | 基板実装構造 | |
JPS609147A (ja) | 混合集積回路 | |
JPS60200545A (ja) | 実装基板 | |
JP2711116B2 (ja) | 磁気抵抗素子 | |
JP2751365B2 (ja) | 半導体装置 | |
JPH08250836A (ja) | 印刷配線板の追加部品実装構造 | |
JPH081977B2 (ja) | 基板の接続構造 | |
JPS61269343A (ja) | セラミツクパツケ−ジ | |
JPH0252402B2 (US20110009641A1-20110113-C00116.png) | ||
JPH08167762A (ja) | 厚膜混成集積回路 | |
JP2923285B1 (ja) | 金属箔抵抗器 | |
JPH039341Y2 (US20110009641A1-20110113-C00116.png) | ||
JPS61193401A (ja) | チツプ形正特性サ−ミスタ |