JPH0334854B2 - - Google Patents

Info

Publication number
JPH0334854B2
JPH0334854B2 JP59259573A JP25957384A JPH0334854B2 JP H0334854 B2 JPH0334854 B2 JP H0334854B2 JP 59259573 A JP59259573 A JP 59259573A JP 25957384 A JP25957384 A JP 25957384A JP H0334854 B2 JPH0334854 B2 JP H0334854B2
Authority
JP
Japan
Prior art keywords
lead
support lead
die pad
semiconductor element
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59259573A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61137334A (ja
Inventor
Koichi Nakagawa
Kazunari Michii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59259573A priority Critical patent/JPS61137334A/ja
Publication of JPS61137334A publication Critical patent/JPS61137334A/ja
Publication of JPH0334854B2 publication Critical patent/JPH0334854B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5449—
    • H10W72/59—
    • H10W72/932—
    • H10W72/952—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP59259573A 1984-12-07 1984-12-07 半導体装置 Granted JPS61137334A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59259573A JPS61137334A (ja) 1984-12-07 1984-12-07 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59259573A JPS61137334A (ja) 1984-12-07 1984-12-07 半導体装置

Publications (2)

Publication Number Publication Date
JPS61137334A JPS61137334A (ja) 1986-06-25
JPH0334854B2 true JPH0334854B2 (enExample) 1991-05-24

Family

ID=17335997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59259573A Granted JPS61137334A (ja) 1984-12-07 1984-12-07 半導体装置

Country Status (1)

Country Link
JP (1) JPS61137334A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3011510B2 (ja) * 1990-12-20 2000-02-21 株式会社東芝 相互連結回路基板を有する半導体装置およびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54141565A (en) * 1978-04-26 1979-11-02 Nec Corp Semiconductor device
JPS58169949A (ja) * 1982-03-30 1983-10-06 Matsushita Electronics Corp 半導体装置

Also Published As

Publication number Publication date
JPS61137334A (ja) 1986-06-25

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