JPH0329171B2 - - Google Patents
Info
- Publication number
- JPH0329171B2 JPH0329171B2 JP58044143A JP4414383A JPH0329171B2 JP H0329171 B2 JPH0329171 B2 JP H0329171B2 JP 58044143 A JP58044143 A JP 58044143A JP 4414383 A JP4414383 A JP 4414383A JP H0329171 B2 JPH0329171 B2 JP H0329171B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- air
- vacuum
- shunter
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4414383A JPS59171123A (ja) | 1983-03-18 | 1983-03-18 | 真空処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4414383A JPS59171123A (ja) | 1983-03-18 | 1983-03-18 | 真空処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59171123A JPS59171123A (ja) | 1984-09-27 |
| JPH0329171B2 true JPH0329171B2 (enrdf_load_stackoverflow) | 1991-04-23 |
Family
ID=12683413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4414383A Granted JPS59171123A (ja) | 1983-03-18 | 1983-03-18 | 真空処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59171123A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02295149A (ja) * | 1989-05-10 | 1990-12-06 | Fujitsu Ltd | 基板搬送装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59119846A (ja) * | 1982-12-27 | 1984-07-11 | Fujitsu Ltd | 真空処理装置 |
-
1983
- 1983-03-18 JP JP4414383A patent/JPS59171123A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59171123A (ja) | 1984-09-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH04229633A (ja) | 真空ウェハ搬送処理装置及び方法 | |
| US5664925A (en) | Batchloader for load lock | |
| US5607276A (en) | Batchloader for substrate carrier on load lock | |
| JP2005039185A5 (enrdf_load_stackoverflow) | ||
| KR20180045316A (ko) | 설비 전방 단부 모듈 및 이를 포함하는 반도체 제조 장치 | |
| JP2005527120A (ja) | 半導体処理ツール内チャンバ間の相互汚染の減少 | |
| JP3486462B2 (ja) | 減圧・常圧処理装置 | |
| WO2004030085A1 (ja) | 被処理体の搬送方法 | |
| JP2018170347A (ja) | ウェハー搬送装置及びウェハー搬送方法 | |
| JP2020004839A (ja) | 半導体ワーク搬送装置 | |
| JP2007149948A (ja) | 真空処理装置 | |
| JP2006228808A (ja) | 基板搬送装置、基板搬送方法及び半導体製造装置 | |
| JP2001118904A5 (enrdf_load_stackoverflow) | ||
| JP2006310561A (ja) | 真空処理装置および真空処理方法 | |
| JPH0329171B2 (enrdf_load_stackoverflow) | ||
| JP2772835B2 (ja) | 基板処理装置及び真空処理方法 | |
| JPH0344058A (ja) | 半導体装置の製造方法および製造装置 | |
| JPH1079412A (ja) | 半導体製造装置 | |
| JP2003059997A (ja) | 処理装置および処理方法 | |
| JPH04271139A (ja) | 半導体製造装置 | |
| JPH02184333A (ja) | ロードロック装置を備えた処理装置 | |
| JP2887079B2 (ja) | アッシング装置 | |
| JPH0237742A (ja) | 半導体装置の製造装置 | |
| JPH0265252A (ja) | 半導体製造装置 | |
| JP4227137B2 (ja) | 基板収納容器 |