JPH0328826B2 - - Google Patents

Info

Publication number
JPH0328826B2
JPH0328826B2 JP56166756A JP16675681A JPH0328826B2 JP H0328826 B2 JPH0328826 B2 JP H0328826B2 JP 56166756 A JP56166756 A JP 56166756A JP 16675681 A JP16675681 A JP 16675681A JP H0328826 B2 JPH0328826 B2 JP H0328826B2
Authority
JP
Japan
Prior art keywords
semiconductor device
pair
lead frame
pellet
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56166756A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5867054A (ja
Inventor
Shigeki Takeo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56166756A priority Critical patent/JPS5867054A/ja
Publication of JPS5867054A publication Critical patent/JPS5867054A/ja
Publication of JPH0328826B2 publication Critical patent/JPH0328826B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56166756A 1981-10-19 1981-10-19 半導体装置用リ−ドフレ−ム Granted JPS5867054A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56166756A JPS5867054A (ja) 1981-10-19 1981-10-19 半導体装置用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56166756A JPS5867054A (ja) 1981-10-19 1981-10-19 半導体装置用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS5867054A JPS5867054A (ja) 1983-04-21
JPH0328826B2 true JPH0328826B2 (oth) 1991-04-22

Family

ID=15837141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56166756A Granted JPS5867054A (ja) 1981-10-19 1981-10-19 半導体装置用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS5867054A (oth)

Also Published As

Publication number Publication date
JPS5867054A (ja) 1983-04-21

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