JPH0328826B2 - - Google Patents

Info

Publication number
JPH0328826B2
JPH0328826B2 JP56166756A JP16675681A JPH0328826B2 JP H0328826 B2 JPH0328826 B2 JP H0328826B2 JP 56166756 A JP56166756 A JP 56166756A JP 16675681 A JP16675681 A JP 16675681A JP H0328826 B2 JPH0328826 B2 JP H0328826B2
Authority
JP
Japan
Prior art keywords
semiconductor device
pair
lead frame
pellet
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56166756A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5867054A (ja
Inventor
Shigeki Takeo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56166756A priority Critical patent/JPS5867054A/ja
Publication of JPS5867054A publication Critical patent/JPS5867054A/ja
Publication of JPH0328826B2 publication Critical patent/JPH0328826B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56166756A 1981-10-19 1981-10-19 半導体装置用リ−ドフレ−ム Granted JPS5867054A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56166756A JPS5867054A (ja) 1981-10-19 1981-10-19 半導体装置用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56166756A JPS5867054A (ja) 1981-10-19 1981-10-19 半導体装置用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS5867054A JPS5867054A (ja) 1983-04-21
JPH0328826B2 true JPH0328826B2 (cs) 1991-04-22

Family

ID=15837141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56166756A Granted JPS5867054A (ja) 1981-10-19 1981-10-19 半導体装置用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS5867054A (cs)

Also Published As

Publication number Publication date
JPS5867054A (ja) 1983-04-21

Similar Documents

Publication Publication Date Title
KR100252737B1 (ko) 수지봉합형 반도체 장치 및 그 제조방법
JPS63296252A (ja) 樹脂封止型半導体装置
JPS60189940A (ja) 樹脂封止型半導体装置の製法
JPH0328826B2 (cs)
JPS61141165A (ja) 半導体装置用リ−ドフレ−ム
JPH0142511B2 (cs)
JPS63187657A (ja) 半導体装置の製造方法
JP2583353B2 (ja) 半導体装置用リードフレーム
KR100296845B1 (ko) 반도체패키지및그제조방법
JPS634945B2 (cs)
JPH04103154A (ja) 半導体装置及びその製造方法及びその実装方法
JP2946775B2 (ja) 樹脂封止金型
JPH0653399A (ja) 樹脂封止型半導体装置
JPS6223094Y2 (cs)
JP2917556B2 (ja) 絶縁物封止型電子部品の製造方法
JPS6329913A (ja) 固定インダクタ
JPH0227522Y2 (cs)
JP2535035B2 (ja) 電子部品搭載パッケ―ジへの端子部品半田付け方法
JPH0815191B2 (ja) リ−ドフレ−ムの製造方法
JPH04368157A (ja) 表面実装型半導体装置およびその製造方法
JPS6050337B2 (ja) 半導体装置の製造方法
JPH04162466A (ja) 半導体装置用リードフレーム
JPS5947749A (ja) レジンパツケ−ジ型半導体装置
JPS61253840A (ja) 半導体装置
JPH0719867B2 (ja) 樹脂封止型半導体装置の外部リード成形方法