JPH0325380B2 - - Google Patents

Info

Publication number
JPH0325380B2
JPH0325380B2 JP58090153A JP9015383A JPH0325380B2 JP H0325380 B2 JPH0325380 B2 JP H0325380B2 JP 58090153 A JP58090153 A JP 58090153A JP 9015383 A JP9015383 A JP 9015383A JP H0325380 B2 JPH0325380 B2 JP H0325380B2
Authority
JP
Japan
Prior art keywords
disc
cassette
arm
shaped object
cassettes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58090153A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58216835A (ja
Inventor
Yakobii Hansuudeiiteru
Shumitsuto Peeteru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UIRUTO RAITSU GmbH
Original Assignee
UIRUTO RAITSU GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UIRUTO RAITSU GmbH filed Critical UIRUTO RAITSU GmbH
Publication of JPS58216835A publication Critical patent/JPS58216835A/ja
Publication of JPH0325380B2 publication Critical patent/JPH0325380B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
JP58090153A 1982-05-25 1983-05-24 円板状物体の自動搬送装置 Granted JPS58216835A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3219502A DE3219502C2 (de) 1982-05-25 1982-05-25 Vorrichtung zum automatischen Transport scheibenförmiger Objekte
DE3219502.8 1982-05-25

Publications (2)

Publication Number Publication Date
JPS58216835A JPS58216835A (ja) 1983-12-16
JPH0325380B2 true JPH0325380B2 (enrdf_load_html_response) 1991-04-05

Family

ID=6164375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58090153A Granted JPS58216835A (ja) 1982-05-25 1983-05-24 円板状物体の自動搬送装置

Country Status (3)

Country Link
US (2) US4501527A (enrdf_load_html_response)
JP (1) JPS58216835A (enrdf_load_html_response)
DE (1) DE3219502C2 (enrdf_load_html_response)

Families Citing this family (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4582191A (en) * 1982-06-17 1986-04-15 Weigand Robert E Article handling apparatus and method
US4861222A (en) * 1984-03-09 1989-08-29 Tegal Corporation Cassette elevator for use in a modular article processing machine
US4699556A (en) * 1984-05-17 1987-10-13 Proconics International, Inc. Object handling apparatus
US4597708A (en) * 1984-06-04 1986-07-01 Tencor Instruments Wafer handling apparatus
US4609320A (en) * 1984-06-20 1986-09-02 Rubin Richard H Flexible workpiece transporter and roller assembly therefor
USRE34311E (en) * 1984-08-30 1993-07-13 Texas Instruments Incorporated Semiconductor slice cassette transport unit
US4673076B1 (en) * 1984-09-04 2000-02-01 Kearney & Trecker Corp Rotary shuttle for machine tools
JPH0620922B2 (ja) * 1984-10-19 1994-03-23 株式会社東芝 被検物の搬送装置
JPH0620091B2 (ja) * 1985-01-31 1994-03-16 株式会社ニコン 基板の搬送装置
JPS61188331A (ja) * 1985-02-15 1986-08-22 Nippon Texas Instr Kk 物体取出装置
US4818169A (en) * 1985-05-17 1989-04-04 Schram Richard R Automated wafer inspection system
US4789294A (en) * 1985-08-30 1988-12-06 Canon Kabushiki Kaisha Wafer handling apparatus and method
US4687542A (en) * 1985-10-24 1987-08-18 Texas Instruments Incorporated Vacuum processing system
EP0555891B1 (en) * 1985-10-24 1999-01-20 Texas Instruments Incorporated Vacuum processing system and method
US4754445A (en) * 1985-10-28 1988-06-28 Litton Industrial Automation Systems, Inc. Optical disc auto-changer
JPH0691150B2 (ja) * 1985-10-29 1994-11-14 キヤノン株式会社 基板処理方法
US4740135A (en) * 1986-01-08 1988-04-26 Scss Instruments Wafer transfer arm mechanism
DE3603534A1 (de) * 1986-02-05 1987-08-06 Fraunhofer Ges Forschung Reinraum mit foerdereinrichtung
US4746256A (en) * 1986-03-13 1988-05-24 Roboptek, Inc. Apparatus for handling sensitive material such as semiconductor wafers
US4909695A (en) * 1986-04-04 1990-03-20 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US4915564A (en) * 1986-04-04 1990-04-10 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
CA1300357C (en) * 1986-04-04 1992-05-12 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US4836733A (en) * 1986-04-28 1989-06-06 Varian Associates, Inc. Wafer transfer system
US5096364A (en) * 1986-04-28 1992-03-17 Varian Associates, Inc. Wafer arm handler mechanism
EP0556865B1 (en) * 1986-04-28 1998-11-18 Varian Associates, Inc. Wafer transfer system
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
DE3745134C2 (de) * 1986-05-16 1999-03-04 Silicon Valley Group Verfahren und Einrichtung zur Übertragung eines Wafers von einer Quelle zu einem Zielort
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
US4722298A (en) * 1986-05-19 1988-02-02 Machine Technology, Inc. Modular processing apparatus for processing semiconductor wafers
US4999671A (en) * 1986-07-11 1991-03-12 Canon Kabushiki Kaisha Reticle conveying device
US4808059A (en) * 1986-07-15 1989-02-28 Peak Systems, Inc. Apparatus and method for transferring workpieces
US4728252A (en) * 1986-08-22 1988-03-01 Lam Research Corporation Wafer transport mechanism
DE3632403A1 (de) * 1986-09-24 1988-04-07 Heidelberg Instr Gmbh Verstelleinrichtung
US5882165A (en) * 1986-12-19 1999-03-16 Applied Materials, Inc. Multiple chamber integrated process system
US5292393A (en) * 1986-12-19 1994-03-08 Applied Materials, Inc. Multichamber integrated process system
US4951601A (en) * 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
GB8702618D0 (en) * 1987-02-05 1987-03-11 Dynapert Precima Ltd Suction pick-up apparatus
GB8702617D0 (en) * 1987-02-05 1987-03-11 Dynapert Precima Ltd Handling electrical/electronic components
US4846626A (en) * 1987-02-09 1989-07-11 The Perkin-Elmer Corporation Wafer handling system
US5085558A (en) * 1987-02-09 1992-02-04 Svg Lithography Systems, Inc. Wafer handling system
US4973217A (en) * 1987-02-09 1990-11-27 Svg Lithography Systems, Inc. Wafer handling system
US4984953A (en) * 1987-02-20 1991-01-15 Canon Kabushiki Kaisha Plate-like article conveying system
JPS63208452A (ja) * 1987-02-20 1988-08-29 Canon Inc 基板搬送装置
US4801234A (en) * 1987-05-15 1989-01-31 Daymarc Corporation Vacuum pick and place mechanism for integrated circuit test handler
DE3716549A1 (de) * 1987-05-17 1988-12-08 Leitz Ernst Gmbh Handhabungsautomat fuer plattenfoermige objekte
EP0302542B1 (en) * 1987-07-14 1994-01-26 Koninklijke Philips Electronics N.V. Apparatus for the transport of carriers from and to a positioning device, and selection device for use in such an apparatus
JPH0622258B2 (ja) * 1987-07-24 1994-03-23 日立電子エンジニアリング株式会社 ウエハ表面検査装置
DE3827343A1 (de) * 1988-08-12 1990-02-15 Leybold Ag Vorrichtung nach dem karussel-prinzip zum beschichten von substraten
GB2210996A (en) * 1987-10-09 1989-06-21 Plessey Co Plc Contents verification apparatus
US5020475A (en) * 1987-10-15 1991-06-04 Epsilon Technology, Inc. Substrate handling and transporting apparatus
US5435682A (en) * 1987-10-15 1995-07-25 Advanced Semiconductor Materials America, Inc. Chemical vapor desposition system
US4881863A (en) * 1987-12-17 1989-11-21 Primary Systems Corporation Apparatus for inspecting wafers
US4907931A (en) * 1988-05-18 1990-03-13 Prometrix Corporation Apparatus for handling semiconductor wafers
US4900214A (en) * 1988-05-25 1990-02-13 American Telephone And Telegraph Company Method and apparatus for transporting semiconductor wafers
US5024570A (en) * 1988-09-14 1991-06-18 Fujitsu Limited Continuous semiconductor substrate processing system
US5395446A (en) * 1988-11-21 1995-03-07 Kabushiki Kaisha Toshiba Semiconductor treatment apparatus
JP2683933B2 (ja) * 1989-01-20 1997-12-03 信越半導体株式会社 半導体ウエーハの表裏および方位判定検査装置
US5007784A (en) * 1989-01-20 1991-04-16 Genmark Automation Dual end effector robotic arm
DE3903607A1 (de) * 1989-02-08 1990-08-09 Leybold Ag Vorrichtung zum reinigen, pruefen und einordnen von werkstuecken
US5102280A (en) * 1989-03-07 1992-04-07 Ade Corporation Robot prealigner
US5112205A (en) * 1989-05-15 1992-05-12 Sony Corporation Optical-disk manufacturing apparatus
US5391047A (en) * 1989-10-03 1995-02-21 Globe Products Inc. Apparatus for loading and unloading workpieces
JPH0736417B2 (ja) * 1989-10-24 1995-04-19 株式会社メツクス ウエハーの位置決め装置
DE69113553T2 (de) * 1990-07-23 1996-06-20 Dainippon Screen Mfg Schnittstellenvorrichtung zum Transportieren von Substraten zwischen Verarbeitungsgeräten.
US5191694A (en) * 1991-07-03 1993-03-09 Shape Inc. Cassette assembly line
JP2751975B2 (ja) * 1991-12-20 1998-05-18 株式会社日立製作所 半導体処理装置のロードロック室
JP2867194B2 (ja) * 1992-02-05 1999-03-08 東京エレクトロン株式会社 処理装置及び処理方法
US6473157B2 (en) * 1992-02-07 2002-10-29 Nikon Corporation Method of manufacturing exposure apparatus and method for exposing a pattern on a mask onto a substrate
US5498118A (en) * 1992-02-07 1996-03-12 Nikon Corporation Apparatus for and method of carrying a substrate
DE4304301A1 (de) * 1993-02-12 1994-08-18 Suess Kg Karl Transportsystem und -verfahren für zueinander auszurichtende Objekte
US5344365A (en) * 1993-09-14 1994-09-06 Sematech, Inc. Integrated building and conveying structure for manufacturing under ultraclean conditions
DE4342901A1 (de) * 1993-12-16 1995-06-22 Itt Ind Gmbh Deutsche Saugpinzettenkopf
DE4408537A1 (de) * 1994-03-14 1995-09-21 Leybold Ag Vorrichtung für den Transport von Substraten
US5486080A (en) * 1994-06-30 1996-01-23 Diamond Semiconductor Group, Inc. High speed movement of workpieces in vacuum processing
US5677758A (en) * 1995-02-09 1997-10-14 Mrs Technology, Inc. Lithography System using dual substrate stages
DE19510230C2 (de) * 1995-03-24 1999-08-05 Michael Geringer Transfervorrichtung für elektrische Bauelemente, insbesondere Chips
DE19514037C2 (de) * 1995-04-13 1997-09-04 Leybold Ag Transportvorrichtung
US5830272A (en) * 1995-11-07 1998-11-03 Sputtered Films, Inc. System for and method of providing a controlled deposition on wafers
US5789890A (en) * 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
US6121743A (en) * 1996-03-22 2000-09-19 Genmark Automation, Inc. Dual robotic arm end effectors having independent yaw motion
JPH10112490A (ja) * 1996-10-03 1998-04-28 Nidek Co Ltd 半導体ウェハ搬送装置
US6213708B1 (en) * 1997-03-12 2001-04-10 Advanced Micro Devices, Inc. System for sorting multiple semiconductor wafers
US6354791B1 (en) * 1997-04-11 2002-03-12 Applied Materials, Inc. Water lift mechanism with electrostatic pickup and method for transferring a workpiece
US6114705A (en) * 1997-09-10 2000-09-05 Varian Semiconductor Equipment Associates, Inc. System for correcting eccentricity and rotational error of a workpiece
US6878895B1 (en) * 1998-06-30 2005-04-12 Advance Micro Devices, Inc. Reticle sorter
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US6489741B1 (en) 1998-08-25 2002-12-03 Genmark Automation, Inc. Robot motion compensation system
NL1010317C2 (nl) 1998-10-14 2000-05-01 Asm Int Sorteer/opslaginrichting voor wafers en werkwijze voor het hanteren daarvan.
WO2000042650A1 (en) * 1999-01-12 2000-07-20 Tokyo Electron Limited Vacuum treatment device
WO2000058188A1 (en) * 1999-03-25 2000-10-05 N & K Technology, Inc. Wafer handling robot having x-y stage for wafer handling and positioning
US6190103B1 (en) * 1999-03-31 2001-02-20 Gasonics International Corporation Wafer transfer device and method
US6350097B1 (en) * 1999-04-19 2002-02-26 Applied Materials, Inc. Method and apparatus for processing wafers
US6429139B1 (en) * 1999-12-17 2002-08-06 Eaton Corporation Serial wafer handling mechanism
US6420864B1 (en) 2000-04-13 2002-07-16 Nanophotonics Ag Modular substrate measurement system
DE10061628B4 (de) * 2000-12-11 2006-06-08 Leica Microsystems Wetzlar Gmbh Vorrichtung und Verfahren zum Ergreifen und Transportieren von Wafern
US6478136B2 (en) 2001-01-08 2002-11-12 Nikon Corporation Method and apparatus for automatically transporting and precisely positioning work pieces at processing stations
DE10121115A1 (de) * 2001-04-28 2002-10-31 Leica Microsystems Haltevorrichtung für Wafer
WO2004001817A1 (en) * 2002-06-21 2003-12-31 Applied Materials, Inc. Transfer chamber for vacuum processing system
US7114903B2 (en) * 2002-07-16 2006-10-03 Semitool, Inc. Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
US6748293B1 (en) 2003-03-24 2004-06-08 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for high speed object handling
CN101866828B (zh) * 2004-06-02 2013-03-20 应用材料公司 电子装置制造室及其形成方法
US20060201074A1 (en) * 2004-06-02 2006-09-14 Shinichi Kurita Electronic device manufacturing chamber and methods of forming the same
US7784164B2 (en) * 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
JP2006237559A (ja) * 2005-01-28 2006-09-07 Dainippon Screen Mfg Co Ltd 基板処理装置
US9339900B2 (en) * 2005-08-18 2016-05-17 Futrfab, Inc. Apparatus to support a cleanspace fabricator
US7513822B2 (en) 2005-06-18 2009-04-07 Flitsch Frederick A Method and apparatus for a cleanspace fabricator
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US10651063B2 (en) 2005-06-18 2020-05-12 Frederick A. Flitsch Methods of prototyping and manufacturing with cleanspace fabricators
US9159592B2 (en) 2005-06-18 2015-10-13 Futrfab, Inc. Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator
US11024527B2 (en) 2005-06-18 2021-06-01 Frederick A. Flitsch Methods and apparatus for novel fabricators with Cleanspace
US9059227B2 (en) 2005-06-18 2015-06-16 Futrfab, Inc. Methods and apparatus for vertically orienting substrate processing tools in a clean space
US10627809B2 (en) 2005-06-18 2020-04-21 Frederick A. Flitsch Multilevel fabricators
US7467024B2 (en) * 2005-08-26 2008-12-16 Flitsch Frederick A Method and apparatus for an elevator system for a multilevel cleanspace fabricator
CN105304529B (zh) 2005-09-18 2019-03-15 弗雷德里克·A·弗里奇 用于在洁净空间中垂直定位基片处理设备的方法和装置
JP5563397B2 (ja) * 2010-07-21 2014-07-30 大塚電子株式会社 被搬送物回転装置
US12189828B2 (en) 2013-01-05 2025-01-07 Frederick A. Flitsch Customized smart devices and touchscreen devices and cleanspace manufacturing methods to make them
KR102075528B1 (ko) * 2013-05-16 2020-03-03 삼성디스플레이 주식회사 증착장치, 유기발광 디스플레이 장치 제조방법 및 유기발광 디스플레이 장치
DE102013018291B4 (de) * 2013-10-31 2021-06-10 Asys Automatic Systems Gmbh & Co. Kg Arbeitseinheit für eine Reinraumanlage, sowie Arbeitsverbund hierzu
CN115180400B (zh) * 2022-08-17 2024-06-04 深圳市诺泰芯装备有限公司 一种高温转盘储料装置及方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2711817A (en) * 1954-06-02 1955-06-28 Llewellyn A Hautau Mechanical loader and unloader for production machines
US3466514A (en) * 1967-06-26 1969-09-09 Ibm Method and apparatus for positioning objects in preselected orientations
US3645581A (en) * 1968-11-26 1972-02-29 Ind Modular Systems Corp Apparatus and method for handling and treating articles
US3823836A (en) * 1973-05-22 1974-07-16 Plat General Inc Vacuum apparatus for handling sheets
US3968885A (en) * 1973-06-29 1976-07-13 International Business Machines Corporation Method and apparatus for handling workpieces
GB1513444A (en) * 1974-09-06 1978-06-07 Chemical Reactor Equip As Pick-up devices for lifting and moving semiconductor wafers
US3960277A (en) * 1974-09-30 1976-06-01 Flint Alan G Mask plate handling apparatus
US4062463A (en) * 1976-05-11 1977-12-13 Machine Technology, Inc. Automated single cassette load mechanism for scrubber
JPS5456356A (en) * 1977-10-14 1979-05-07 Hitachi Ltd Dicing device
JPS5485679A (en) * 1977-12-20 1979-07-07 Canon Inc Wafer aligning unit
DE2825206C2 (de) * 1978-06-08 1981-10-01 Maschinenfabrik J. Dieffenbacher Gmbh & Co, 7519 Eppingen Vorrichtung zum Einbringen, Verpressen und Ausbringen eines Schichtpaketes in eine Heißpresse bzw. aus einer Heißpresse
JPS5643158U (enrdf_load_html_response) * 1979-09-11 1981-04-20
US4373840A (en) * 1980-03-28 1983-02-15 Giddings & Lewis, Inc. Pallet transfer system
US4427332A (en) * 1982-02-26 1984-01-24 Nanometrics, Incorporated Integrated circuit wafer transport mechanism

Also Published As

Publication number Publication date
US4501527A (en) 1985-02-26
DE3219502C2 (de) 1990-04-19
JPS58216835A (ja) 1983-12-16
DE3219502A1 (de) 1983-12-01
US4695215A (en) 1987-09-22

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