JPH032357B2 - - Google Patents

Info

Publication number
JPH032357B2
JPH032357B2 JP21055184A JP21055184A JPH032357B2 JP H032357 B2 JPH032357 B2 JP H032357B2 JP 21055184 A JP21055184 A JP 21055184A JP 21055184 A JP21055184 A JP 21055184A JP H032357 B2 JPH032357 B2 JP H032357B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
cooling
pressure
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP21055184A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6189694A (ja
Inventor
Nobutoshi Tsugehara
Takaaki Koizumi
Norio Hagiwara
Masanobu Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP21055184A priority Critical patent/JPS6189694A/ja
Publication of JPS6189694A publication Critical patent/JPS6189694A/ja
Publication of JPH032357B2 publication Critical patent/JPH032357B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
JP21055184A 1984-10-09 1984-10-09 プリント基板の形状矯正方法及びその装置 Granted JPS6189694A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21055184A JPS6189694A (ja) 1984-10-09 1984-10-09 プリント基板の形状矯正方法及びその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21055184A JPS6189694A (ja) 1984-10-09 1984-10-09 プリント基板の形状矯正方法及びその装置

Publications (2)

Publication Number Publication Date
JPS6189694A JPS6189694A (ja) 1986-05-07
JPH032357B2 true JPH032357B2 (zh) 1991-01-14

Family

ID=16591193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21055184A Granted JPS6189694A (ja) 1984-10-09 1984-10-09 プリント基板の形状矯正方法及びその装置

Country Status (1)

Country Link
JP (1) JPS6189694A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2226406A1 (en) 2009-01-30 2010-09-08 Sandvik Intellectual Property AB Stainless austenitic low Ni alloy

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62259822A (ja) * 1986-05-07 1987-11-12 Matsushita Electric Works Ltd 電気用積層板の製造方法
JPH0655449B2 (ja) * 1986-12-15 1994-07-27 松下電工株式会社 ガラス基材エポキシ樹脂積層板の処理法
JPH0197643A (ja) * 1987-10-09 1989-04-17 Matsushita Electric Works Ltd プリント配線板の反り矯正方法
JP2710250B2 (ja) * 1987-10-09 1998-02-10 松下電工株式会社 プリント配線板の反り矯正装置
JP2674763B2 (ja) * 1987-10-09 1997-11-12 松下電工株式会社 プリント配線板の反り矯正装置
JPH01160080A (ja) * 1987-12-17 1989-06-22 Sumitomo Bakelite Co Ltd プリント回路板の反り直し方法
JPH0658990B2 (ja) * 1988-04-25 1994-08-03 松下電工株式会社 プリント配線板の反り矯正方法
JPH0298442A (ja) * 1988-10-05 1990-04-10 Matsushita Electric Works Ltd プリント配線板の反り矯正装置
JPH02116547A (ja) * 1988-10-26 1990-05-01 Matsushita Electric Works Ltd プリント配線板の反り矯正装置の搬送装置
JP2714423B2 (ja) * 1988-12-15 1998-02-16 松下電工株式会社 プリント配線板の反り矯正装置
JP5211831B2 (ja) * 2008-04-25 2013-06-12 トヨタ紡織株式会社 植物性繊維成形体の製造方法
JP2011169519A (ja) * 2010-02-18 2011-09-01 Nishikori:Kk 冷却装置
JP5526002B2 (ja) * 2010-11-18 2014-06-18 株式会社アルバック フィルム基板矯正装置及びフィルム基板矯正方法
CN102074624B (zh) * 2010-11-29 2012-07-18 中国科学院苏州纳米技术与纳米仿生研究所 Led外延片的制备方法及装置
JP2015019035A (ja) * 2013-06-11 2015-01-29 イビデン株式会社 配線板の製造方法、配線板の反り修正方法及び配線板の製造装置
US9818624B2 (en) * 2015-04-29 2017-11-14 Applied Materials, Inc. Methods and apparatus for correcting substrate deformity
CN109041446A (zh) * 2018-09-25 2018-12-18 上海移远通信技术股份有限公司 一种pcb板平整度不良品的矫正方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2226406A1 (en) 2009-01-30 2010-09-08 Sandvik Intellectual Property AB Stainless austenitic low Ni alloy

Also Published As

Publication number Publication date
JPS6189694A (ja) 1986-05-07

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Legal Events

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