JPH0322056B2 - - Google Patents
Info
- Publication number
- JPH0322056B2 JPH0322056B2 JP61311995A JP31199586A JPH0322056B2 JP H0322056 B2 JPH0322056 B2 JP H0322056B2 JP 61311995 A JP61311995 A JP 61311995A JP 31199586 A JP31199586 A JP 31199586A JP H0322056 B2 JPH0322056 B2 JP H0322056B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- chip
- support ring
- device hole
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000011888 foil Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 238000000034 method Methods 0.000 description 13
- 239000010410 layer Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61311995A JPS63168030A (ja) | 1986-12-29 | 1986-12-29 | フイルムキヤリアへのチツプ実装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61311995A JPS63168030A (ja) | 1986-12-29 | 1986-12-29 | フイルムキヤリアへのチツプ実装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63168030A JPS63168030A (ja) | 1988-07-12 |
| JPH0322056B2 true JPH0322056B2 (enrdf_load_stackoverflow) | 1991-03-26 |
Family
ID=18023938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61311995A Granted JPS63168030A (ja) | 1986-12-29 | 1986-12-29 | フイルムキヤリアへのチツプ実装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63168030A (enrdf_load_stackoverflow) |
-
1986
- 1986-12-29 JP JP61311995A patent/JPS63168030A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63168030A (ja) | 1988-07-12 |
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