JPH0319697B2 - - Google Patents
Info
- Publication number
- JPH0319697B2 JPH0319697B2 JP16878887A JP16878887A JPH0319697B2 JP H0319697 B2 JPH0319697 B2 JP H0319697B2 JP 16878887 A JP16878887 A JP 16878887A JP 16878887 A JP16878887 A JP 16878887A JP H0319697 B2 JPH0319697 B2 JP H0319697B2
- Authority
- JP
- Japan
- Prior art keywords
- photoresist
- positive photoresist
- positive
- thin film
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920002120 photoresistant polymer Polymers 0.000 claims description 44
- 238000005530 etching Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 239000005011 phenolic resin Substances 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 239000003849 aromatic solvent Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000010408 film Substances 0.000 description 12
- 239000010955 niobium Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 229910052758 niobium Inorganic materials 0.000 description 5
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16878887A JPS6413731A (en) | 1987-07-08 | 1987-07-08 | Lift-off flatting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16878887A JPS6413731A (en) | 1987-07-08 | 1987-07-08 | Lift-off flatting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6413731A JPS6413731A (en) | 1989-01-18 |
| JPH0319697B2 true JPH0319697B2 (enrdf_load_stackoverflow) | 1991-03-15 |
Family
ID=15874481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16878887A Granted JPS6413731A (en) | 1987-07-08 | 1987-07-08 | Lift-off flatting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413731A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003032092A1 (en) * | 2001-10-05 | 2003-04-17 | The Regents Of The University Of Michigan | Planarizing recess etch |
-
1987
- 1987-07-08 JP JP16878887A patent/JPS6413731A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6413731A (en) | 1989-01-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |