JPH0318344B2 - - Google Patents
Info
- Publication number
- JPH0318344B2 JPH0318344B2 JP58011162A JP1116283A JPH0318344B2 JP H0318344 B2 JPH0318344 B2 JP H0318344B2 JP 58011162 A JP58011162 A JP 58011162A JP 1116283 A JP1116283 A JP 1116283A JP H0318344 B2 JPH0318344 B2 JP H0318344B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- insulating substrate
- emitter
- chip
- collector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W90/00—
-
- H10W72/07554—
-
- H10W72/50—
-
- H10W72/5445—
-
- H10W72/5473—
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- H10W72/5475—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58011162A JPS59135752A (ja) | 1983-01-24 | 1983-01-24 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58011162A JPS59135752A (ja) | 1983-01-24 | 1983-01-24 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59135752A JPS59135752A (ja) | 1984-08-04 |
| JPH0318344B2 true JPH0318344B2 (enExample) | 1991-03-12 |
Family
ID=11770338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58011162A Granted JPS59135752A (ja) | 1983-01-24 | 1983-01-24 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59135752A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6393126A (ja) * | 1986-10-08 | 1988-04-23 | Fuji Electric Co Ltd | 半導体装置 |
| JP2580803B2 (ja) * | 1989-10-31 | 1997-02-12 | 富士電機株式会社 | 電力変換装置用トランジスタモジュール |
| US6455925B1 (en) * | 2001-03-27 | 2002-09-24 | Ericsson Inc. | Power transistor package with integrated flange for surface mount heat removal |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5021456U (enExample) * | 1973-06-20 | 1975-03-11 | ||
| JPS6112690Y2 (enExample) * | 1979-11-20 | 1986-04-19 |
-
1983
- 1983-01-24 JP JP58011162A patent/JPS59135752A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59135752A (ja) | 1984-08-04 |
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