JPH0418694B2 - - Google Patents

Info

Publication number
JPH0418694B2
JPH0418694B2 JP1782385A JP1782385A JPH0418694B2 JP H0418694 B2 JPH0418694 B2 JP H0418694B2 JP 1782385 A JP1782385 A JP 1782385A JP 1782385 A JP1782385 A JP 1782385A JP H0418694 B2 JPH0418694 B2 JP H0418694B2
Authority
JP
Japan
Prior art keywords
corners
pad
rounded
pads
insulating plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1782385A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61177762A (ja
Inventor
Shinjiro Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP60017823A priority Critical patent/JPS61177762A/ja
Publication of JPS61177762A publication Critical patent/JPS61177762A/ja
Publication of JPH0418694B2 publication Critical patent/JPH0418694B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/65—
    • H10W70/6875—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/5475—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP60017823A 1985-02-01 1985-02-01 半導体装置 Granted JPS61177762A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60017823A JPS61177762A (ja) 1985-02-01 1985-02-01 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60017823A JPS61177762A (ja) 1985-02-01 1985-02-01 半導体装置

Publications (2)

Publication Number Publication Date
JPS61177762A JPS61177762A (ja) 1986-08-09
JPH0418694B2 true JPH0418694B2 (enExample) 1992-03-27

Family

ID=11954445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60017823A Granted JPS61177762A (ja) 1985-02-01 1985-02-01 半導体装置

Country Status (1)

Country Link
JP (1) JPS61177762A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
US5876859A (en) * 1994-11-10 1999-03-02 Vlt Corporation Direct metal bonding
US5945130A (en) 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
JP2732823B2 (ja) * 1995-02-02 1998-03-30 ヴィエルティー コーポレーション はんだ付け方法
WO1998011605A1 (en) 1995-06-19 1998-03-19 Ibiden Co., Ltd. Circuit board for mounting electronic parts
EP1814153A3 (en) * 1996-09-12 2008-09-24 Ibiden Co., Ltd. Circuit board for mounting electronic parts
JP2017130633A (ja) * 2016-01-22 2017-07-27 豊田合成株式会社 発光装置
JP6673100B2 (ja) * 2016-08-24 2020-03-25 トヨタ自動車株式会社 半導体装置
US11470719B2 (en) 2018-11-19 2022-10-11 Skyworks Solutions, Inc. High durability solder terminals
JP7459539B2 (ja) * 2020-02-07 2024-04-02 富士電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPS61177762A (ja) 1986-08-09

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term