JPS61177762A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS61177762A
JPS61177762A JP60017823A JP1782385A JPS61177762A JP S61177762 A JPS61177762 A JP S61177762A JP 60017823 A JP60017823 A JP 60017823A JP 1782385 A JP1782385 A JP 1782385A JP S61177762 A JPS61177762 A JP S61177762A
Authority
JP
Japan
Prior art keywords
corners
pad
pads
rounded
insulating plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60017823A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0418694B2 (enExample
Inventor
Shinjiro Kojima
小島　伸次郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60017823A priority Critical patent/JPS61177762A/ja
Publication of JPS61177762A publication Critical patent/JPS61177762A/ja
Publication of JPH0418694B2 publication Critical patent/JPH0418694B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP60017823A 1985-02-01 1985-02-01 半導体装置 Granted JPS61177762A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60017823A JPS61177762A (ja) 1985-02-01 1985-02-01 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60017823A JPS61177762A (ja) 1985-02-01 1985-02-01 半導体装置

Publications (2)

Publication Number Publication Date
JPS61177762A true JPS61177762A (ja) 1986-08-09
JPH0418694B2 JPH0418694B2 (enExample) 1992-03-27

Family

ID=11954445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60017823A Granted JPS61177762A (ja) 1985-02-01 1985-02-01 半導体装置

Country Status (1)

Country Link
JP (1) JPS61177762A (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5727727A (en) * 1995-02-02 1998-03-17 Vlt Corporation Flowing solder in a gap
US5808358A (en) * 1994-11-10 1998-09-15 Vlt Corporation Packaging electrical circuits
US5876859A (en) * 1994-11-10 1999-03-02 Vlt Corporation Direct metal bonding
US5945130A (en) * 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
EP1814153A3 (en) * 1996-09-12 2008-09-24 Ibiden Co., Ltd. Circuit board for mounting electronic parts
USRE44251E1 (en) 1996-09-12 2013-06-04 Ibiden Co., Ltd. Circuit board for mounting electronic parts
JP2017130633A (ja) * 2016-01-22 2017-07-27 豊田合成株式会社 発光装置
JP2018032742A (ja) * 2016-08-24 2018-03-01 トヨタ自動車株式会社 半導体装置
JP2021125617A (ja) * 2020-02-07 2021-08-30 富士電機株式会社 半導体装置
DE102019217679B4 (de) 2018-11-19 2023-11-02 Skyworks Solutions, Inc. Elektronisches vorrichtungsgehäuse und hochfrequenzfilter mit hochbelastbaren lötanschlussstellen

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6159772A (en) * 1994-11-10 2000-12-12 Vlt Corporation Packaging electrical circuits
US6119923A (en) * 1994-11-10 2000-09-19 Vlt Corporation Packaging electrical circuits
US5876859A (en) * 1994-11-10 1999-03-02 Vlt Corporation Direct metal bonding
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
US5938104A (en) * 1994-11-10 1999-08-17 Vlt Corporation Direct metal bonding
US5808358A (en) * 1994-11-10 1998-09-15 Vlt Corporation Packaging electrical circuits
US6096981A (en) * 1994-11-10 2000-08-01 Vlt Corporation Packaging electrical circuits
US6710257B2 (en) 1994-11-15 2004-03-23 Vlt Corporation Circuit encapsulation
US5945130A (en) * 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
US6403009B1 (en) * 1994-11-15 2002-06-11 Vlt Corporation Circuit encapsulation
US5727727A (en) * 1995-02-02 1998-03-17 Vlt Corporation Flowing solder in a gap
EP1814153A3 (en) * 1996-09-12 2008-09-24 Ibiden Co., Ltd. Circuit board for mounting electronic parts
USRE44251E1 (en) 1996-09-12 2013-06-04 Ibiden Co., Ltd. Circuit board for mounting electronic parts
JP2017130633A (ja) * 2016-01-22 2017-07-27 豊田合成株式会社 発光装置
JP2018032742A (ja) * 2016-08-24 2018-03-01 トヨタ自動車株式会社 半導体装置
DE102019217679B4 (de) 2018-11-19 2023-11-02 Skyworks Solutions, Inc. Elektronisches vorrichtungsgehäuse und hochfrequenzfilter mit hochbelastbaren lötanschlussstellen
US12356545B2 (en) 2018-11-19 2025-07-08 Skyworks Solutions, Inc. High durability solder terminals
JP2021125617A (ja) * 2020-02-07 2021-08-30 富士電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPH0418694B2 (enExample) 1992-03-27

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term