JPH0314907B2 - - Google Patents

Info

Publication number
JPH0314907B2
JPH0314907B2 JP56123278A JP12327881A JPH0314907B2 JP H0314907 B2 JPH0314907 B2 JP H0314907B2 JP 56123278 A JP56123278 A JP 56123278A JP 12327881 A JP12327881 A JP 12327881A JP H0314907 B2 JPH0314907 B2 JP H0314907B2
Authority
JP
Japan
Prior art keywords
substrate electrode
sputtering
electrode
substrate
magnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56123278A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5825475A (ja
Inventor
Nobuyuki Hayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP12327881A priority Critical patent/JPS5825475A/ja
Publication of JPS5825475A publication Critical patent/JPS5825475A/ja
Publication of JPH0314907B2 publication Critical patent/JPH0314907B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP12327881A 1981-08-05 1981-08-05 スパツタ装置 Granted JPS5825475A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12327881A JPS5825475A (ja) 1981-08-05 1981-08-05 スパツタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12327881A JPS5825475A (ja) 1981-08-05 1981-08-05 スパツタ装置

Publications (2)

Publication Number Publication Date
JPS5825475A JPS5825475A (ja) 1983-02-15
JPH0314907B2 true JPH0314907B2 (enrdf_load_stackoverflow) 1991-02-27

Family

ID=14856602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12327881A Granted JPS5825475A (ja) 1981-08-05 1981-08-05 スパツタ装置

Country Status (1)

Country Link
JP (1) JPS5825475A (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59170270A (ja) * 1983-03-15 1984-09-26 Toshiba Corp 膜形成装置
JPS60136230A (ja) * 1983-12-24 1985-07-19 Ulvac Corp 基板表面の整形装置
JPS6187868A (ja) * 1984-10-05 1986-05-06 Nippon Telegr & Teleph Corp <Ntt> 薄膜形成方法および装置
JPS61137326A (ja) * 1984-12-10 1986-06-25 Ulvac Corp 基板表面の整形装置
JPS62107064A (ja) * 1985-11-05 1987-05-18 Anelva Corp バイアススパツタ装置
JPS63265493A (ja) * 1987-04-23 1988-11-01 Fujitsu Ltd 多層セラミツク基板
US4812217A (en) * 1987-04-27 1989-03-14 American Telephone And Telegraph Company, At&T Bell Laboratories Method and apparatus for feeding and coating articles in a controlled atmosphere
JP2000315598A (ja) * 1999-03-03 2000-11-14 Anelva Corp プラズマ処理装置
JP2004501302A (ja) * 2000-06-19 2004-01-15 日本板硝子株式会社 車両用窓ガラスの保持装置
US6677711B2 (en) * 2001-06-07 2004-01-13 Lam Research Corporation Plasma processor method and apparatus
JP4643387B2 (ja) * 2005-08-10 2011-03-02 シャープ株式会社 プラズマ処理装置
JP4876641B2 (ja) * 2006-03-09 2012-02-15 東京エレクトロン株式会社 プラズマ処理装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57207177A (en) * 1981-06-17 1982-12-18 Hitachi Ltd Dc sputtering device

Also Published As

Publication number Publication date
JPS5825475A (ja) 1983-02-15

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