JPH0256989B2 - - Google Patents
Info
- Publication number
- JPH0256989B2 JPH0256989B2 JP59125216A JP12521684A JPH0256989B2 JP H0256989 B2 JPH0256989 B2 JP H0256989B2 JP 59125216 A JP59125216 A JP 59125216A JP 12521684 A JP12521684 A JP 12521684A JP H0256989 B2 JPH0256989 B2 JP H0256989B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- solder
- arm
- lead wires
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
- B23K3/0676—Conveyors therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12521684A JPS617063A (ja) | 1984-06-20 | 1984-06-20 | 小型電子部品の半田付け装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12521684A JPS617063A (ja) | 1984-06-20 | 1984-06-20 | 小型電子部品の半田付け装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS617063A JPS617063A (ja) | 1986-01-13 |
JPH0256989B2 true JPH0256989B2 (en, 2012) | 1990-12-03 |
Family
ID=14904738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12521684A Granted JPS617063A (ja) | 1984-06-20 | 1984-06-20 | 小型電子部品の半田付け装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS617063A (en, 2012) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5611475A (en) * | 1986-07-11 | 1997-03-18 | Sun Industrial Coatings Private Ltd. | Soldering apparatus |
WO2022014038A1 (ja) * | 2020-07-17 | 2022-01-20 | 株式会社Fuji | 塗布装置および部品装着機 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5853183U (ja) * | 1981-10-06 | 1983-04-11 | クラリオン株式会社 | 自動はんだ付け装置 |
-
1984
- 1984-06-20 JP JP12521684A patent/JPS617063A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS617063A (ja) | 1986-01-13 |
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