JPH0245334B2 - - Google Patents
Info
- Publication number
- JPH0245334B2 JPH0245334B2 JP57031996A JP3199682A JPH0245334B2 JP H0245334 B2 JPH0245334 B2 JP H0245334B2 JP 57031996 A JP57031996 A JP 57031996A JP 3199682 A JP3199682 A JP 3199682A JP H0245334 B2 JPH0245334 B2 JP H0245334B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- gate
- main
- contact
- thyristor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thyristors (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3199682A JPS58148433A (ja) | 1982-02-26 | 1982-02-26 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3199682A JPS58148433A (ja) | 1982-02-26 | 1982-02-26 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58148433A JPS58148433A (ja) | 1983-09-03 |
JPH0245334B2 true JPH0245334B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-10-09 |
Family
ID=12346514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3199682A Granted JPS58148433A (ja) | 1982-02-26 | 1982-02-26 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58148433A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6055633A (ja) * | 1983-09-07 | 1985-03-30 | Hitachi Ltd | 半導体装置 |
JPS6063945U (ja) * | 1983-10-05 | 1985-05-07 | 日本インター株式会社 | 加圧接触型半導体装置 |
JPS60113635U (ja) * | 1984-01-10 | 1985-08-01 | 東洋電機製造株式会社 | 圧接型半導体装置 |
JPS60194565A (ja) * | 1984-03-15 | 1985-10-03 | Mitsubishi Electric Corp | 半導体装置 |
JPS61113249A (ja) * | 1984-11-08 | 1986-05-31 | Mitsubishi Electric Corp | 半導体装置 |
JPS61212065A (ja) * | 1985-03-18 | 1986-09-20 | Hitachi Ltd | 半導体スイツチング装置 |
EP0287770B1 (de) * | 1987-03-25 | 1993-05-05 | BBC Brown Boveri AG | Halbleiterbauelement mit einer Steuerelektrode |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56125872A (en) * | 1980-03-10 | 1981-10-02 | Hitachi Ltd | Semiconductor switchgear and its manufacture |
JPS56130969A (en) * | 1980-03-18 | 1981-10-14 | Hitachi Ltd | Semiconductor device |
-
1982
- 1982-02-26 JP JP3199682A patent/JPS58148433A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58148433A (ja) | 1983-09-03 |