JPH0231861B2 - - Google Patents

Info

Publication number
JPH0231861B2
JPH0231861B2 JP57137268A JP13726882A JPH0231861B2 JP H0231861 B2 JPH0231861 B2 JP H0231861B2 JP 57137268 A JP57137268 A JP 57137268A JP 13726882 A JP13726882 A JP 13726882A JP H0231861 B2 JPH0231861 B2 JP H0231861B2
Authority
JP
Japan
Prior art keywords
output
bonding
power source
positioning device
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57137268A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5928352A (ja
Inventor
Ryuichi Kyomasu
Nobuhiro Takasugi
Toshihiro Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP57137268A priority Critical patent/JPS5928352A/ja
Publication of JPS5928352A publication Critical patent/JPS5928352A/ja
Publication of JPH0231861B2 publication Critical patent/JPH0231861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP57137268A 1982-08-09 1982-08-09 位置決め装置 Granted JPS5928352A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57137268A JPS5928352A (ja) 1982-08-09 1982-08-09 位置決め装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57137268A JPS5928352A (ja) 1982-08-09 1982-08-09 位置決め装置

Publications (2)

Publication Number Publication Date
JPS5928352A JPS5928352A (ja) 1984-02-15
JPH0231861B2 true JPH0231861B2 (enExample) 1990-07-17

Family

ID=15194697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57137268A Granted JPS5928352A (ja) 1982-08-09 1982-08-09 位置決め装置

Country Status (1)

Country Link
JP (1) JPS5928352A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3318932B2 (ja) * 1991-07-12 2002-08-26 松下電器産業株式会社 パラボラ信号発生装置
KR100604307B1 (ko) * 2000-05-27 2006-07-24 삼성테크윈 주식회사 와이어 본딩 시스템의 속도 프로파일 설계 방법

Also Published As

Publication number Publication date
JPS5928352A (ja) 1984-02-15

Similar Documents

Publication Publication Date Title
US5556022A (en) Polar bond head
JP3329623B2 (ja) ワイヤボンディング装置およびワイヤボンディング方法
JPH0231861B2 (enExample)
JP3022613B2 (ja) ワイヤボンディング装置
JPS6228810A (ja) ロボツトの制御装置
JP2648141B2 (ja) サーボ制御回路
JPS6341215B2 (enExample)
JP3221191B2 (ja) ボンディング装置及びボンディング方法
JPH0513517A (ja) ワイヤボンデイング装置及びワイヤボンデイング方法
JPS6221234A (ja) ワイヤボンダ
JPS596781A (ja) 電動機用可変電圧制御装置
JPS6139885A (ja) 同期型交流サ−ボモ−タの駆動方式
JP3171012B2 (ja) ワイヤボンディング方法及びワイヤボンディング装置
JPS5966114A (ja) 速度指令発生回路
JPH0661294A (ja) ワイヤボンデイング装置のモータ制御回路
JP2940259B2 (ja) ボンディング方法
JPS6158484A (ja) モ−タ制御装置
CN114953474A (zh) 一种用于超声波塑料焊接机的整合控制单元
JPH0447558B2 (enExample)
JPS6395640A (ja) ワイヤボンダ装置
CN101505904A (zh) 用于引线接合机的改进的z轴运动系统
JPH0361201B2 (enExample)
JPH04107937A (ja) ワイヤボンダーにおけるボンディングツール駆動用モータの制御装置
JPS61159744A (ja) ワイヤボンデイング装置
JP2001168136A (ja) ワイヤボンディング方法