JPH0231861B2 - - Google Patents

Info

Publication number
JPH0231861B2
JPH0231861B2 JP57137268A JP13726882A JPH0231861B2 JP H0231861 B2 JPH0231861 B2 JP H0231861B2 JP 57137268 A JP57137268 A JP 57137268A JP 13726882 A JP13726882 A JP 13726882A JP H0231861 B2 JPH0231861 B2 JP H0231861B2
Authority
JP
Japan
Prior art keywords
output
bonding
power source
positioning device
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57137268A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5928352A (ja
Inventor
Ryuichi Kyomasu
Nobuhiro Takasugi
Toshihiro Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP57137268A priority Critical patent/JPS5928352A/ja
Publication of JPS5928352A publication Critical patent/JPS5928352A/ja
Publication of JPH0231861B2 publication Critical patent/JPH0231861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP57137268A 1982-08-09 1982-08-09 位置決め装置 Granted JPS5928352A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57137268A JPS5928352A (ja) 1982-08-09 1982-08-09 位置決め装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57137268A JPS5928352A (ja) 1982-08-09 1982-08-09 位置決め装置

Publications (2)

Publication Number Publication Date
JPS5928352A JPS5928352A (ja) 1984-02-15
JPH0231861B2 true JPH0231861B2 (enExample) 1990-07-17

Family

ID=15194697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57137268A Granted JPS5928352A (ja) 1982-08-09 1982-08-09 位置決め装置

Country Status (1)

Country Link
JP (1) JPS5928352A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3318932B2 (ja) * 1991-07-12 2002-08-26 松下電器産業株式会社 パラボラ信号発生装置
KR100604307B1 (ko) * 2000-05-27 2006-07-24 삼성테크윈 주식회사 와이어 본딩 시스템의 속도 프로파일 설계 방법

Also Published As

Publication number Publication date
JPS5928352A (ja) 1984-02-15

Similar Documents

Publication Publication Date Title
US5556022A (en) Polar bond head
JP3329623B2 (ja) ワイヤボンディング装置およびワイヤボンディング方法
JPH0231861B2 (enExample)
JP2648141B2 (ja) サーボ制御回路
JPS6341215B2 (enExample)
JP3221191B2 (ja) ボンディング装置及びボンディング方法
JPH0513517A (ja) ワイヤボンデイング装置及びワイヤボンデイング方法
JPS6221234A (ja) ワイヤボンダ
JPS6139885A (ja) 同期型交流サ−ボモ−タの駆動方式
JP3171012B2 (ja) ワイヤボンディング方法及びワイヤボンディング装置
JPS6214209A (ja) 産業用ロボツト
JPH0661294A (ja) ワイヤボンデイング装置のモータ制御回路
JP2940259B2 (ja) ボンディング方法
JPS5824438Y2 (ja) ワイヤボンダ
JPS6158484A (ja) モ−タ制御装置
CN114953474A (zh) 一种用于超声波塑料焊接机的整合控制单元
JPH0447558B2 (enExample)
JPH0693471B2 (ja) ワイヤボンデイング装置
JPS6395640A (ja) ワイヤボンダ装置
CN101505904A (zh) 用于引线接合机的改进的z轴运动系统
JPH0361201B2 (enExample)
JPS63216111A (ja) 駆動制御装置
JPH04107937A (ja) ワイヤボンダーにおけるボンディングツール駆動用モータの制御装置
JPS61159744A (ja) ワイヤボンデイング装置
Fadul et al. A single MSI programmable chip controller for stepper motors