JPS5928352A - 位置決め装置 - Google Patents
位置決め装置Info
- Publication number
- JPS5928352A JPS5928352A JP57137268A JP13726882A JPS5928352A JP S5928352 A JPS5928352 A JP S5928352A JP 57137268 A JP57137268 A JP 57137268A JP 13726882 A JP13726882 A JP 13726882A JP S5928352 A JPS5928352 A JP S5928352A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- signals
- acceleration
- wire bonder
- positioning device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57137268A JPS5928352A (ja) | 1982-08-09 | 1982-08-09 | 位置決め装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57137268A JPS5928352A (ja) | 1982-08-09 | 1982-08-09 | 位置決め装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5928352A true JPS5928352A (ja) | 1984-02-15 |
| JPH0231861B2 JPH0231861B2 (enExample) | 1990-07-17 |
Family
ID=15194697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57137268A Granted JPS5928352A (ja) | 1982-08-09 | 1982-08-09 | 位置決め装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5928352A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0532164A3 (en) * | 1991-07-12 | 1994-07-20 | Matsushita Electric Industrial Co Ltd | Parabolic signal generator |
| KR100604307B1 (ko) * | 2000-05-27 | 2006-07-24 | 삼성테크윈 주식회사 | 와이어 본딩 시스템의 속도 프로파일 설계 방법 |
-
1982
- 1982-08-09 JP JP57137268A patent/JPS5928352A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0532164A3 (en) * | 1991-07-12 | 1994-07-20 | Matsushita Electric Industrial Co Ltd | Parabolic signal generator |
| KR100604307B1 (ko) * | 2000-05-27 | 2006-07-24 | 삼성테크윈 주식회사 | 와이어 본딩 시스템의 속도 프로파일 설계 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231861B2 (enExample) | 1990-07-17 |
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