JPS6341215B2 - - Google Patents

Info

Publication number
JPS6341215B2
JPS6341215B2 JP54049027A JP4902779A JPS6341215B2 JP S6341215 B2 JPS6341215 B2 JP S6341215B2 JP 54049027 A JP54049027 A JP 54049027A JP 4902779 A JP4902779 A JP 4902779A JP S6341215 B2 JPS6341215 B2 JP S6341215B2
Authority
JP
Japan
Prior art keywords
wedge
bonding
wire
speed
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54049027A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55141736A (en
Inventor
Kazuhisa Takashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4902779A priority Critical patent/JPS55141736A/ja
Priority to GB8013084A priority patent/GB2047596A/en
Priority to DE19803015683 priority patent/DE3015683A1/de
Publication of JPS55141736A publication Critical patent/JPS55141736A/ja
Publication of JPS6341215B2 publication Critical patent/JPS6341215B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP4902779A 1979-04-23 1979-04-23 Method for wirebonding and wirebonder Granted JPS55141736A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP4902779A JPS55141736A (en) 1979-04-23 1979-04-23 Method for wirebonding and wirebonder
GB8013084A GB2047596A (en) 1979-04-23 1980-04-21 Method of wire-bonding and wire-bonder
DE19803015683 DE3015683A1 (de) 1979-04-23 1980-04-23 Mikroschweissverfahren und -vorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4902779A JPS55141736A (en) 1979-04-23 1979-04-23 Method for wirebonding and wirebonder

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP60212495A Division JPS6193638A (ja) 1985-09-27 1985-09-27 ワイヤホンダ

Publications (2)

Publication Number Publication Date
JPS55141736A JPS55141736A (en) 1980-11-05
JPS6341215B2 true JPS6341215B2 (enExample) 1988-08-16

Family

ID=12819608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4902779A Granted JPS55141736A (en) 1979-04-23 1979-04-23 Method for wirebonding and wirebonder

Country Status (3)

Country Link
JP (1) JPS55141736A (enExample)
DE (1) DE3015683A1 (enExample)
GB (1) GB2047596A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
GB2125720B (en) * 1982-08-24 1986-11-05 Asm Assembly Automation Ltd Wire bonding apparatus
KR880701152A (ko) * 1986-05-16 1988-07-25 파라사트 파하드 수동와이어 본딩장치
JP2755667B2 (ja) * 1989-03-27 1998-05-20 株式会社東芝 モータ駆動回路及びワイヤボンディング装置
JP2549191B2 (ja) * 1990-09-10 1996-10-30 株式会社日立製作所 ワイヤボンディング方法、およびその装置
US5443200A (en) * 1993-10-13 1995-08-22 Matsushita Electric Industrial Co., Ltd. Bonding apparatus and bonding method
DE102020007235A1 (de) * 2020-11-26 2022-06-02 Mühlbauer Gmbh & Co. Kg Thermokompressionsvorrichtung und Verfahren zum Verbinden von elektrischen Bauteilen mit einem Substrat

Also Published As

Publication number Publication date
JPS55141736A (en) 1980-11-05
DE3015683A1 (de) 1980-11-13
GB2047596A (en) 1980-12-03

Similar Documents

Publication Publication Date Title
KR950009619B1 (ko) 반도체장치의 와이어 본딩방법
EP0154579A3 (en) Lead wire bonding with increased bonding surface area
JP3329623B2 (ja) ワイヤボンディング装置およびワイヤボンディング方法
JPS6341215B2 (enExample)
JP2506958B2 (ja) ワイヤボンディング装置
JPS6224942B2 (enExample)
KR850000989B1 (ko) 와이어 본딩(Bonding) 방법
JP2676446B2 (ja) ワイヤボンディング方法
JP3221191B2 (ja) ボンディング装置及びボンディング方法
JPS6313344B2 (enExample)
JPH0124931Y2 (enExample)
JP2524363B2 (ja) ワイヤボンディング装置
JP2002076049A (ja) ワイヤボンディング装置及び電気部品の製造方法
JPS6246979B2 (enExample)
JPS61105852A (ja) ワイヤボンダ
JPS63211640A (ja) ワイヤボンデイング方法およびワイヤボンデイング装置ならびにワイヤボンデイング装置を使用した半導体装置の製造方法
JPH07201903A (ja) ワイヤボンディング方法
KR101133131B1 (ko) 와이어본딩 방법
JPH01184842A (ja) ワイヤボンディング装置
JPH08236573A (ja) ワイヤボンディング装置
JP3026303B2 (ja) 半導体パッケージのワイヤボンディング方法及びそのワイヤボンディング装置
JPH0153505B2 (enExample)
JPS6120342A (ja) 半導体装置の製造方法
JPS6256658B2 (enExample)
JPS58210629A (ja) ボンデイング方法及びその装置