JPS6256658B2 - - Google Patents

Info

Publication number
JPS6256658B2
JPS6256658B2 JP56148361A JP14836181A JPS6256658B2 JP S6256658 B2 JPS6256658 B2 JP S6256658B2 JP 56148361 A JP56148361 A JP 56148361A JP 14836181 A JP14836181 A JP 14836181A JP S6256658 B2 JPS6256658 B2 JP S6256658B2
Authority
JP
Japan
Prior art keywords
amount
bonding
descent
capillary
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56148361A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5848929A (ja
Inventor
Saneyasu Hirota
Kazumichi Machida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56148361A priority Critical patent/JPS5848929A/ja
Publication of JPS5848929A publication Critical patent/JPS5848929A/ja
Publication of JPS6256658B2 publication Critical patent/JPS6256658B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711
    • H10W72/07141
    • H10W72/075
    • H10W72/07521
    • H10W72/536
    • H10W72/5363
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP56148361A 1981-09-18 1981-09-18 ワイヤボンデイング装置 Granted JPS5848929A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56148361A JPS5848929A (ja) 1981-09-18 1981-09-18 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56148361A JPS5848929A (ja) 1981-09-18 1981-09-18 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5848929A JPS5848929A (ja) 1983-03-23
JPS6256658B2 true JPS6256658B2 (enExample) 1987-11-26

Family

ID=15451036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56148361A Granted JPS5848929A (ja) 1981-09-18 1981-09-18 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS5848929A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210155053A1 (en) * 2018-07-02 2021-05-27 The Yokohama Rubber Co., Ltd. Pneumatic tire

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6397445A (ja) * 1986-10-13 1988-04-28 Suehiro Sharyo Seisakusho:Kk トレ−ラ−

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210155053A1 (en) * 2018-07-02 2021-05-27 The Yokohama Rubber Co., Ltd. Pneumatic tire

Also Published As

Publication number Publication date
JPS5848929A (ja) 1983-03-23

Similar Documents

Publication Publication Date Title
US4925083A (en) Ball bonding method and apparatus for performing the method
US6017812A (en) Bump bonding method and bump bonding apparatus
JP3276421B2 (ja) 制御システム
US5176311A (en) High yield clampless wire bonding method
JPS6256658B2 (enExample)
US3763545A (en) Method for control of welding apparatus
JPH03245544A (ja) ワイヤボンディング方法
KR20130028640A (ko) 다이 부착을 위한 본드 라인 두께 제어
US5240165A (en) Method and apparatus for controlled deformation bonding
US6305594B1 (en) Wire bonding method and apparatus
JP3230691B2 (ja) ワイヤボンディング方法
JPS5848930A (ja) ワイヤボンデイング装置
JPS6341215B2 (enExample)
JPS5826524Y2 (ja) ハンドウタイワイヤボンダソウチ
US5121870A (en) Method for reducing time to place a tool onto a workpiece
JP2949891B2 (ja) ワイヤボンディング方法
JPS6113377B2 (enExample)
JPS609664B2 (ja) 起音波ワイヤボンダ
JP7488656B2 (ja) ワイヤボンディング装置及びワイヤボンディング方法
JPH11243113A (ja) ワイヤボンディング装置
JPH0141023B2 (enExample)
JP3002022B2 (ja) ボンディング方法
JPH0831886A (ja) ワイヤボンディング方法および装置
JPS6122641A (ja) 超音波加工装置
JPH0645413A (ja) ワイヤボンディング装置及びその方法