JPH0227144B2 - - Google Patents
Info
- Publication number
- JPH0227144B2 JPH0227144B2 JP60094155A JP9415585A JPH0227144B2 JP H0227144 B2 JPH0227144 B2 JP H0227144B2 JP 60094155 A JP60094155 A JP 60094155A JP 9415585 A JP9415585 A JP 9415585A JP H0227144 B2 JPH0227144 B2 JP H0227144B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- wiring board
- circuit wiring
- release film
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 32
- 230000001070 adhesive effect Effects 0.000 claims description 32
- 239000012790 adhesive layer Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 23
- 239000010410 layer Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000011888 foil Substances 0.000 claims description 12
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000012815 thermoplastic material Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 50
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 239000003822 epoxy resin Substances 0.000 description 16
- 229920000647 polyepoxide Polymers 0.000 description 16
- -1 Polypropylene Polymers 0.000 description 13
- 238000001723 curing Methods 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000004743 Polypropylene Substances 0.000 description 11
- 229920001155 polypropylene Polymers 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 239000004677 Nylon Substances 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 238000012805 post-processing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60094155A JPS61252160A (ja) | 1985-05-01 | 1985-05-01 | フレキシブル電気回路配線用基板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60094155A JPS61252160A (ja) | 1985-05-01 | 1985-05-01 | フレキシブル電気回路配線用基板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61252160A JPS61252160A (ja) | 1986-11-10 |
| JPH0227144B2 true JPH0227144B2 (enrdf_load_stackoverflow) | 1990-06-14 |
Family
ID=14102485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60094155A Granted JPS61252160A (ja) | 1985-05-01 | 1985-05-01 | フレキシブル電気回路配線用基板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61252160A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003094571A (ja) * | 2001-09-25 | 2003-04-03 | Matsushita Electric Works Ltd | プリント配線板製造用材料及びその製造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI251954B (en) * | 2003-07-29 | 2006-03-21 | Ind Tech Res Inst | Flat fuel cell assembly and fabrication thereof |
| JP5033153B2 (ja) * | 2009-02-16 | 2012-09-26 | パナソニック株式会社 | 片面板の製造方法及びプリント配線板の製造方法 |
-
1985
- 1985-05-01 JP JP60094155A patent/JPS61252160A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003094571A (ja) * | 2001-09-25 | 2003-04-03 | Matsushita Electric Works Ltd | プリント配線板製造用材料及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61252160A (ja) | 1986-11-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH09504139A (ja) | 可撓性多層プリント回路ボード及びその製造方法 | |
| JPH0240230B2 (enrdf_load_stackoverflow) | ||
| JPH0494186A (ja) | 多層回路基板の製造方法 | |
| JPH03283493A (ja) | 多層配線基板及びその製造方法 | |
| JPH0227144B2 (enrdf_load_stackoverflow) | ||
| JPH0644668B2 (ja) | シ−ルド付可撓性プリント回路基板 | |
| JP3738536B2 (ja) | プリント配線基板の製造方法 | |
| JP3705370B2 (ja) | 多層プリント配線板の製造方法 | |
| JPH0464307B2 (enrdf_load_stackoverflow) | ||
| JPS61183998A (ja) | フレキシブル印刷配線基板の製造方法 | |
| JPS58153390A (ja) | プリント回路用基材及びその製造方法 | |
| JPS62277794A (ja) | 内層回路板の製造方法 | |
| JP3605883B2 (ja) | 多層プリント配線板 | |
| JPH03209792A (ja) | 両面金属張りフレキシブル印刷配線基板およびその製造方法 | |
| JPH0199289A (ja) | 配線板及びその製造法 | |
| JPS58215094A (ja) | 多層印刷配線板製造方法 | |
| JPH0119414Y2 (enrdf_load_stackoverflow) | ||
| JPS63246897A (ja) | 金属ベ−ス２層配線板の製造法 | |
| JPS593879B2 (ja) | 印刷配線板の製造法 | |
| JP2001144445A (ja) | 多層プリント配線板の製造方法 | |
| JPS617696A (ja) | 多層印刷配線板 | |
| JPS627190A (ja) | フレキシブル配線用基板およびその製造方法 | |
| JP3266825B2 (ja) | 多層配線板製造用絶縁層付き金属箔 | |
| JPS60262638A (ja) | 金属ベ−ス積層板 | |
| JP2776202B2 (ja) | 超多層積層板の製造方法 |