JPH0464307B2 - - Google Patents
Info
- Publication number
- JPH0464307B2 JPH0464307B2 JP60077247A JP7724785A JPH0464307B2 JP H0464307 B2 JPH0464307 B2 JP H0464307B2 JP 60077247 A JP60077247 A JP 60077247A JP 7724785 A JP7724785 A JP 7724785A JP H0464307 B2 JPH0464307 B2 JP H0464307B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- film
- metal foil
- adhesive layer
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010410 layer Substances 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- 239000012790 adhesive layer Substances 0.000 claims description 29
- 239000000853 adhesive Substances 0.000 claims description 27
- 230000001070 adhesive effect Effects 0.000 claims description 27
- 239000011888 foil Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 3
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 2
- 239000002313 adhesive film Substances 0.000 claims 5
- 239000011810 insulating material Substances 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 239000010408 film Substances 0.000 description 33
- 239000003822 epoxy resin Substances 0.000 description 32
- 229920000647 polyepoxide Polymers 0.000 description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 27
- 229920005989 resin Polymers 0.000 description 26
- 239000011347 resin Substances 0.000 description 26
- 239000011889 copper foil Substances 0.000 description 23
- 238000010438 heat treatment Methods 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 239000009719 polyimide resin Substances 0.000 description 5
- -1 polypropylene Polymers 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000004677 Nylon Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229920006266 Vinyl film Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60077247A JPS61235150A (ja) | 1985-04-11 | 1985-04-11 | 電気回路配線用基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60077247A JPS61235150A (ja) | 1985-04-11 | 1985-04-11 | 電気回路配線用基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61235150A JPS61235150A (ja) | 1986-10-20 |
| JPH0464307B2 true JPH0464307B2 (enrdf_load_stackoverflow) | 1992-10-14 |
Family
ID=13628526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60077247A Granted JPS61235150A (ja) | 1985-04-11 | 1985-04-11 | 電気回路配線用基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61235150A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI332521B (en) * | 2000-03-31 | 2010-11-01 | Hitachi Chemical Co Ltd | Adhesive films for semiconductor |
-
1985
- 1985-04-11 JP JP60077247A patent/JPS61235150A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61235150A (ja) | 1986-10-20 |
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