JPS61252160A - フレキシブル電気回路配線用基板およびその製造方法 - Google Patents
フレキシブル電気回路配線用基板およびその製造方法Info
- Publication number
- JPS61252160A JPS61252160A JP60094155A JP9415585A JPS61252160A JP S61252160 A JPS61252160 A JP S61252160A JP 60094155 A JP60094155 A JP 60094155A JP 9415585 A JP9415585 A JP 9415585A JP S61252160 A JPS61252160 A JP S61252160A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- circuit wiring
- wiring board
- board according
- release film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 title claims description 9
- 239000000853 adhesive Substances 0.000 claims description 32
- 230000001070 adhesive effect Effects 0.000 claims description 32
- 239000012790 adhesive layer Substances 0.000 claims description 26
- 239000010410 layer Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000011888 foil Substances 0.000 claims description 13
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000012815 thermoplastic material Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 50
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 239000003822 epoxy resin Substances 0.000 description 18
- 229920000647 polyepoxide Polymers 0.000 description 18
- -1 polypropylene Polymers 0.000 description 14
- 238000001723 curing Methods 0.000 description 13
- 239000004743 Polypropylene Substances 0.000 description 12
- 229920001155 polypropylene Polymers 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 6
- 239000010409 thin film Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 238000012805 post-processing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- CXENHBSYCFFKJS-OXYODPPFSA-N (Z,E)-alpha-farnesene Chemical compound CC(C)=CCC\C(C)=C\C\C=C(\C)C=C CXENHBSYCFFKJS-OXYODPPFSA-N 0.000 description 1
- 229920006266 Vinyl film Polymers 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60094155A JPS61252160A (ja) | 1985-05-01 | 1985-05-01 | フレキシブル電気回路配線用基板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60094155A JPS61252160A (ja) | 1985-05-01 | 1985-05-01 | フレキシブル電気回路配線用基板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61252160A true JPS61252160A (ja) | 1986-11-10 |
| JPH0227144B2 JPH0227144B2 (enrdf_load_stackoverflow) | 1990-06-14 |
Family
ID=14102485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60094155A Granted JPS61252160A (ja) | 1985-05-01 | 1985-05-01 | フレキシブル電気回路配線用基板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61252160A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009009952A (ja) * | 2003-07-29 | 2009-01-15 | Ind Technol Res Inst | 平面燃料電池アセンブリとその製造方法 |
| JP2009111432A (ja) * | 2009-02-16 | 2009-05-21 | Panasonic Electric Works Co Ltd | 片面板の製造方法及びプリント配線板の製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4759896B2 (ja) * | 2001-09-25 | 2011-08-31 | パナソニック電工株式会社 | プリント配線板製造用材料の製造方法 |
-
1985
- 1985-05-01 JP JP60094155A patent/JPS61252160A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009009952A (ja) * | 2003-07-29 | 2009-01-15 | Ind Technol Res Inst | 平面燃料電池アセンブリとその製造方法 |
| JP2009111432A (ja) * | 2009-02-16 | 2009-05-21 | Panasonic Electric Works Co Ltd | 片面板の製造方法及びプリント配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0227144B2 (enrdf_load_stackoverflow) | 1990-06-14 |
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