JPH0222556B2 - - Google Patents

Info

Publication number
JPH0222556B2
JPH0222556B2 JP24123084A JP24123084A JPH0222556B2 JP H0222556 B2 JPH0222556 B2 JP H0222556B2 JP 24123084 A JP24123084 A JP 24123084A JP 24123084 A JP24123084 A JP 24123084A JP H0222556 B2 JPH0222556 B2 JP H0222556B2
Authority
JP
Japan
Prior art keywords
wiring conductor
conductor layer
layer
wiring
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP24123084A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61119096A (ja
Inventor
Takeji Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP24123084A priority Critical patent/JPS61119096A/ja
Publication of JPS61119096A publication Critical patent/JPS61119096A/ja
Publication of JPH0222556B2 publication Critical patent/JPH0222556B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP24123084A 1984-11-15 1984-11-15 多層配線基板の製造方法 Granted JPS61119096A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24123084A JPS61119096A (ja) 1984-11-15 1984-11-15 多層配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24123084A JPS61119096A (ja) 1984-11-15 1984-11-15 多層配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS61119096A JPS61119096A (ja) 1986-06-06
JPH0222556B2 true JPH0222556B2 (zh) 1990-05-18

Family

ID=17071136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24123084A Granted JPS61119096A (ja) 1984-11-15 1984-11-15 多層配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS61119096A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6374163B2 (ja) * 2013-12-27 2018-08-15 京セラ株式会社 圧電発振器
JP6347605B2 (ja) * 2013-12-27 2018-06-27 京セラ株式会社 圧電発振器
JP6396019B2 (ja) * 2013-12-27 2018-09-26 京セラ株式会社 圧電発振器の製造方法

Also Published As

Publication number Publication date
JPS61119096A (ja) 1986-06-06

Similar Documents

Publication Publication Date Title
JPH0222556B2 (zh)
JPS6216546B2 (zh)
KR970063036A (ko) 서멀헤드 및 그 제조방법
JP2007027501A (ja) チップ抵抗器
JPS63141388A (ja) 厚膜回路基板の製造方法
JPH02110992A (ja) パターン接続方法
JPS6165465A (ja) 厚膜多層基板における膜抵抗体の製造方法
JPH0346518Y2 (zh)
JP2734404B2 (ja) セラミック配線基板およびその製造方法
JPH0770378B2 (ja) 回路基板
JPS60219758A (ja) 多層厚膜基板の製造方法
JPH0922816A (ja) 抵抗器の製造方法
JPH0751806Y2 (ja) 厚膜回路装置
JPH04237172A (ja) 電歪効果素子
JPS60219707A (ja) 膜抵抗体の製造方法
JPS63283104A (ja) AlN基板上への抵抗体の形成方法
JPH0818240A (ja) 厚膜回路基板
JPH0426182A (ja) 厚膜印刷基板
JPH04221886A (ja) 厚膜多層回路基板及びその製造方法
JPH05144553A (ja) ヒータおよびヒータの製造方法
JPS5773959A (en) Manufacture of thick film hybrid integrated circuit board
JPS6045095A (ja) 厚膜多層基板の製造方法
JPS63281499A (ja) 多層配線基板
JPH09135078A (ja) 厚膜多層基板およびその製造方法
JPH05267813A (ja) 厚膜回路基板、その製造方法および厚膜回路基板製造用基板