JPH02220838A - 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布 - Google Patents
積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布Info
- Publication number
- JPH02220838A JPH02220838A JP4285689A JP4285689A JPH02220838A JP H02220838 A JPH02220838 A JP H02220838A JP 4285689 A JP4285689 A JP 4285689A JP 4285689 A JP4285689 A JP 4285689A JP H02220838 A JPH02220838 A JP H02220838A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- polished
- foam layer
- polishing
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 71
- 238000005498 polishing Methods 0.000 title claims abstract description 66
- 239000004744 fabric Substances 0.000 title claims abstract description 28
- 239000006260 foam Substances 0.000 claims abstract description 73
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims abstract description 72
- 239000000203 mixture Substances 0.000 claims abstract description 47
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 35
- 229920000642 polymer Polymers 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000010410 layer Substances 0.000 claims description 125
- 239000012790 adhesive layer Substances 0.000 claims description 19
- 239000004094 surface-active agent Substances 0.000 claims description 14
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 10
- 238000005345 coagulation Methods 0.000 claims description 10
- 230000015271 coagulation Effects 0.000 claims description 10
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 9
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 claims description 4
- 229920001897 terpolymer Polymers 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 7
- 238000005187 foaming Methods 0.000 abstract description 5
- 238000002156 mixing Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 3
- 235000012431 wafers Nutrition 0.000 description 62
- -1 polyoxyethylene Polymers 0.000 description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 239000007788 liquid Substances 0.000 description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 description 11
- 239000005020 polyethylene terephthalate Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000012535 impurity Substances 0.000 description 9
- 238000007517 polishing process Methods 0.000 description 9
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 239000004970 Chain extender Substances 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 125000004185 ester group Chemical group 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920005862 polyol Polymers 0.000 description 3
- 150000003077 polyols Chemical class 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000001112 coagulating effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920002689 polyvinyl acetate Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- 150000003673 urethanes Chemical class 0.000 description 2
- CDOUZKKFHVEKRI-UHFFFAOYSA-N 3-bromo-n-[(prop-2-enoylamino)methyl]propanamide Chemical compound BrCCC(=O)NCNC(=O)C=C CDOUZKKFHVEKRI-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 235000019329 dioctyl sodium sulphosuccinate Nutrition 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007518 final polishing process Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000921 polyethylene adipate Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000000576 supplementary effect Effects 0.000 description 1
- 229920006027 ternary co-polymer Polymers 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Laminated Bodies (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4285689A JPH02220838A (ja) | 1989-02-22 | 1989-02-22 | 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4285689A JPH02220838A (ja) | 1989-02-22 | 1989-02-22 | 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02220838A true JPH02220838A (ja) | 1990-09-04 |
JPH0547392B2 JPH0547392B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-07-16 |
Family
ID=12647665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4285689A Granted JPH02220838A (ja) | 1989-02-22 | 1989-02-22 | 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02220838A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000343413A (ja) * | 1999-06-09 | 2000-12-12 | Toray Ind Inc | 研磨パッド |
JP2008213140A (ja) * | 2000-12-01 | 2008-09-18 | Toyo Tire & Rubber Co Ltd | 研磨パッド及びその製造方法並びに研磨パッド用クッション層 |
JP2009061524A (ja) * | 2007-09-05 | 2009-03-26 | Fujibo Holdings Inc | 保持パッド |
JP2011148082A (ja) * | 2009-12-25 | 2011-08-04 | Filwel:Kk | 研磨布 |
WO2011118010A1 (ja) * | 2010-03-25 | 2011-09-29 | 旭硝子株式会社 | ガラス基板の保持用膜体、及びガラス基板の研磨方法 |
WO2011122454A1 (ja) * | 2010-03-30 | 2011-10-06 | 旭硝子株式会社 | ガラス基板の保持用膜体、及びガラス基板の研磨方法 |
JP2013000809A (ja) * | 2011-06-13 | 2013-01-07 | Three M Innovative Properties Co | 研磨用構造体 |
CN103085402A (zh) * | 2013-02-04 | 2013-05-08 | 苏春 | 高仿真皮毛一体面料及其制备方法 |
WO2013146733A1 (ja) | 2012-03-26 | 2013-10-03 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨パッドの製造方法 |
JP2013215859A (ja) * | 2012-04-11 | 2013-10-24 | Three M Innovative Properties Co | 研磨シート、研磨材ロール及び研磨工具 |
WO2014051104A1 (ja) * | 2012-09-28 | 2014-04-03 | 富士紡ホールディングス株式会社 | 研磨パッド |
JP2014079877A (ja) * | 2012-09-28 | 2014-05-08 | Fujibo Holdings Inc | 研磨パッド |
JP2014079878A (ja) * | 2012-09-28 | 2014-05-08 | Fujibo Holdings Inc | 研磨パッド |
JP2016512795A (ja) * | 2013-03-19 | 2016-05-09 | エルジー・ケム・リミテッド | ポリウレタン支持パッドの製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5034083A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1973-07-27 | 1975-04-02 | ||
JPS5198301A (ja) * | 1975-02-25 | 1976-08-30 | Goseihikakukoseibutsu |
-
1989
- 1989-02-22 JP JP4285689A patent/JPH02220838A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5034083A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1973-07-27 | 1975-04-02 | ||
JPS5198301A (ja) * | 1975-02-25 | 1976-08-30 | Goseihikakukoseibutsu |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000343413A (ja) * | 1999-06-09 | 2000-12-12 | Toray Ind Inc | 研磨パッド |
JP2008213140A (ja) * | 2000-12-01 | 2008-09-18 | Toyo Tire & Rubber Co Ltd | 研磨パッド及びその製造方法並びに研磨パッド用クッション層 |
JP2009061524A (ja) * | 2007-09-05 | 2009-03-26 | Fujibo Holdings Inc | 保持パッド |
JP2011148082A (ja) * | 2009-12-25 | 2011-08-04 | Filwel:Kk | 研磨布 |
JP5529258B2 (ja) * | 2010-03-25 | 2014-06-25 | 旭硝子株式会社 | ガラス基板の保持用膜体、及びガラス基板の研磨方法 |
WO2011118010A1 (ja) * | 2010-03-25 | 2011-09-29 | 旭硝子株式会社 | ガラス基板の保持用膜体、及びガラス基板の研磨方法 |
JP5640076B2 (ja) * | 2010-03-30 | 2014-12-10 | 旭硝子株式会社 | ガラス基板の保持用膜体、及びガラス基板の研磨方法 |
CN102844152A (zh) * | 2010-03-30 | 2012-12-26 | 旭硝子株式会社 | 玻璃基板保持用膜体及玻璃基板的研磨方法 |
WO2011122454A1 (ja) * | 2010-03-30 | 2011-10-06 | 旭硝子株式会社 | ガラス基板の保持用膜体、及びガラス基板の研磨方法 |
JP2013000809A (ja) * | 2011-06-13 | 2013-01-07 | Three M Innovative Properties Co | 研磨用構造体 |
US10071460B2 (en) | 2012-03-26 | 2018-09-11 | Fujibo Holdings, Inc. | Polishing pad and method for producing polishing pad |
WO2013146733A1 (ja) | 2012-03-26 | 2013-10-03 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨パッドの製造方法 |
KR20140147859A (ko) | 2012-03-26 | 2014-12-30 | 후지보홀딩스가부시끼가이샤 | 연마 패드 및 연마 패드의 제조 방법 |
JP2013215859A (ja) * | 2012-04-11 | 2013-10-24 | Three M Innovative Properties Co | 研磨シート、研磨材ロール及び研磨工具 |
JP2014079878A (ja) * | 2012-09-28 | 2014-05-08 | Fujibo Holdings Inc | 研磨パッド |
JP2014079877A (ja) * | 2012-09-28 | 2014-05-08 | Fujibo Holdings Inc | 研磨パッド |
WO2014051104A1 (ja) * | 2012-09-28 | 2014-04-03 | 富士紡ホールディングス株式会社 | 研磨パッド |
JPWO2014051104A1 (ja) * | 2012-09-28 | 2016-08-25 | 富士紡ホールディングス株式会社 | 研磨パッド |
CN103085402A (zh) * | 2013-02-04 | 2013-05-08 | 苏春 | 高仿真皮毛一体面料及其制备方法 |
JP2016512795A (ja) * | 2013-03-19 | 2016-05-09 | エルジー・ケム・リミテッド | ポリウレタン支持パッドの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0547392B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0288229A (ja) | 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布 | |
US10201886B2 (en) | Polishing pad and method for manufacturing the same | |
US5981301A (en) | Regeneration method and apparatus of wafer and substrate | |
JPH02220838A (ja) | 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布 | |
US20070054600A1 (en) | Polishing pad, method of producing same and method of polishing | |
JPH09270401A (ja) | 半導体ウェーハの研磨方法 | |
JP2002057129A (ja) | ウエハ基板の再生方法 | |
WO2012077592A1 (ja) | 化学機械研磨パッドおよびそれを用いた化学機械研磨方法 | |
JP4085356B2 (ja) | 半導体ウェーハの洗浄乾燥方法 | |
JP2005007520A (ja) | 研磨パッド及びその製造方法並びに研磨方法 | |
JP5822159B2 (ja) | 研磨パッド及び研磨パッドの製造方法 | |
JP6806515B2 (ja) | 研磨パッド及びその製造方法 | |
JP2011000671A (ja) | 基板用研磨定盤 | |
JP5371661B2 (ja) | 研磨パッド | |
WO1998020987A1 (en) | Sponge roller for cleaning | |
JP2010135524A (ja) | 研削加工されたシリコン基盤の洗浄方法 | |
JP6859056B2 (ja) | 研磨パッド及びその製造方法 | |
JP2016101655A (ja) | 保持具及びその製造方法 | |
JP4912548B2 (ja) | 被研磨部材の保持材の製造方法 | |
JPH07235519A (ja) | 化合物半導体ウエハの製造方法 | |
WO2019073956A1 (ja) | 保持パッド及びその製造方法 | |
JPH06124931A (ja) | 基板貼付用接着剤及び基板の研磨方法 | |
JP2000308961A (ja) | 貼付プレートおよびその製法 | |
WO2001096065A1 (fr) | Procede de polissage de pieces | |
JP5355165B2 (ja) | 保持シート |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070716 Year of fee payment: 14 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080716 Year of fee payment: 15 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090716 Year of fee payment: 16 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090716 Year of fee payment: 16 |