JPH0221139B2 - - Google Patents

Info

Publication number
JPH0221139B2
JPH0221139B2 JP59181908A JP18190884A JPH0221139B2 JP H0221139 B2 JPH0221139 B2 JP H0221139B2 JP 59181908 A JP59181908 A JP 59181908A JP 18190884 A JP18190884 A JP 18190884A JP H0221139 B2 JPH0221139 B2 JP H0221139B2
Authority
JP
Japan
Prior art keywords
package
module
chip
electrodes
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59181908A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6159860A (ja
Inventor
Nobuhiko Aneha
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59181908A priority Critical patent/JPS6159860A/ja
Publication of JPS6159860A publication Critical patent/JPS6159860A/ja
Publication of JPH0221139B2 publication Critical patent/JPH0221139B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/161—
    • H10W70/68—
    • H10W72/07551—
    • H10W72/07554—
    • H10W72/50—
    • H10W72/932—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP59181908A 1984-08-31 1984-08-31 半導体集積回路装置の製造方法 Granted JPS6159860A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59181908A JPS6159860A (ja) 1984-08-31 1984-08-31 半導体集積回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59181908A JPS6159860A (ja) 1984-08-31 1984-08-31 半導体集積回路装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6159860A JPS6159860A (ja) 1986-03-27
JPH0221139B2 true JPH0221139B2 (cg-RX-API-DMAC10.html) 1990-05-11

Family

ID=16108994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59181908A Granted JPS6159860A (ja) 1984-08-31 1984-08-31 半導体集積回路装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6159860A (cg-RX-API-DMAC10.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3911711A1 (de) * 1989-04-10 1990-10-11 Ibm Modul-aufbau mit integriertem halbleiterchip und chiptraeger
US5148265A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5313096A (en) * 1992-03-16 1994-05-17 Dense-Pac Microsystems, Inc. IC chip package having chip attached to and wire bonded within an overlying substrate
JP3151655B2 (ja) * 1996-02-19 2001-04-03 オークマ株式会社 工作機械の熱変位推定方法
JP2008142844A (ja) 2006-12-11 2008-06-26 Okuma Corp 工作機械における温度センサの異常検知方法
JP5336042B2 (ja) 2006-12-18 2013-11-06 オークマ株式会社 工作機械における温度センサの異常検知方法
JP6558818B1 (ja) 2018-10-19 2019-08-14 株式会社ソディック 放電加工装置
IT201900009660A1 (it) 2019-06-20 2020-12-20 St Microelectronics Srl Dispositivo integrato a semiconduttore e procedimento per la fabbricazione di un dispositivo integrato a semiconduttore
GB2600918B (en) * 2020-10-30 2022-11-23 Npl Management Ltd Ion microtrap assembly and method of making of making such an assembly

Also Published As

Publication number Publication date
JPS6159860A (ja) 1986-03-27

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