JPH0342496B2 - - Google Patents

Info

Publication number
JPH0342496B2
JPH0342496B2 JP58143821A JP14382183A JPH0342496B2 JP H0342496 B2 JPH0342496 B2 JP H0342496B2 JP 58143821 A JP58143821 A JP 58143821A JP 14382183 A JP14382183 A JP 14382183A JP H0342496 B2 JPH0342496 B2 JP H0342496B2
Authority
JP
Japan
Prior art keywords
bonding
row
bonding pad
pad
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58143821A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6035524A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP58143821A priority Critical patent/JPS6035524A/ja
Publication of JPS6035524A publication Critical patent/JPS6035524A/ja
Publication of JPH0342496B2 publication Critical patent/JPH0342496B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W70/682—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/07554—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/547—
    • H10W72/59—
    • H10W72/932—
    • H10W72/9445—
    • H10W72/983—
    • H10W74/00—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP58143821A 1983-08-08 1983-08-08 半導体装置 Granted JPS6035524A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58143821A JPS6035524A (ja) 1983-08-08 1983-08-08 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58143821A JPS6035524A (ja) 1983-08-08 1983-08-08 半導体装置

Publications (2)

Publication Number Publication Date
JPS6035524A JPS6035524A (ja) 1985-02-23
JPH0342496B2 true JPH0342496B2 (cg-RX-API-DMAC10.html) 1991-06-27

Family

ID=15347737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58143821A Granted JPS6035524A (ja) 1983-08-08 1983-08-08 半導体装置

Country Status (1)

Country Link
JP (1) JPS6035524A (cg-RX-API-DMAC10.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6444633U (cg-RX-API-DMAC10.html) * 1987-09-10 1989-03-16
JPH01107549A (ja) * 1987-10-20 1989-04-25 Mitsubishi Electric Corp 半導体集積回路装置
JPH0634115Y2 (ja) * 1992-08-24 1994-09-07 ローム株式会社 ボンディングパッドの配置構造
WO1995028005A2 (en) * 1994-04-07 1995-10-19 Vlsi Technology, Inc. Staggered pad array
TW276356B (cg-RX-API-DMAC10.html) * 1994-06-24 1996-05-21 Ibm
US5818114A (en) * 1995-05-26 1998-10-06 Hewlett-Packard Company Radially staggered bond pad arrangements for integrated circuit pad circuitry
JPH08109U (ja) * 1995-07-28 1996-01-23 ローム株式会社 熱印字ヘッド
KR100269947B1 (ko) * 1997-09-13 2000-10-16 윤종용 인쇄회로기판및이를이용한엘씨디모듈
JP2002170844A (ja) * 2000-12-04 2002-06-14 Oki Electric Ind Co Ltd 半導体装置
KR20040007186A (ko) * 2002-07-11 2004-01-24 주식회사 파이컴 전자소자의 패드, 이의 배열구조 및 이의 제조방법
JP5853379B2 (ja) * 2011-03-07 2016-02-09 株式会社リコー 液滴吐出ヘッド及び液滴吐出装置
JP2015088548A (ja) * 2013-10-29 2015-05-07 株式会社リコー 面発光レーザアレイ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5745938A (en) * 1980-09-03 1982-03-16 Hitachi Ltd Semiconductor device
JPS57199228A (en) * 1981-06-02 1982-12-07 Toshiba Corp Wire bonding pad device

Also Published As

Publication number Publication date
JPS6035524A (ja) 1985-02-23

Similar Documents

Publication Publication Date Title
US5508556A (en) Leaded semiconductor device having accessible power supply pad terminals
US6297547B1 (en) Mounting multiple semiconductor dies in a package
US6175149B1 (en) Mounting multiple semiconductor dies in a package
US7115441B2 (en) Semiconductor package with semiconductor chips stacked therein and method of making the package
US8710647B2 (en) Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring board
KR100477020B1 (ko) 멀티 칩 패키지
CN100414696C (zh) 引线框及制造方法以及树脂密封型半导体器件及制造方法
JP2002222889A (ja) 半導体装置及びその製造方法
JPH0342496B2 (cg-RX-API-DMAC10.html)
JPS6132452A (ja) リ−ドフレ−ムとそれを用いた電子装置
US6791166B1 (en) Stackable lead frame package using exposed internal lead traces
JP2001156251A (ja) 半導体装置
JPH0645504A (ja) 半導体装置
CN101290929A (zh) 堆栈式芯片封装结构
JPH0582582A (ja) 半導体装置
KR20010068513A (ko) 윈도우가 구비된 회로기판을 포함하는 적층 칩 패키지
KR100447894B1 (ko) 듀얼 적층패키지 및 그 제조방법
US20050161792A1 (en) Junction member and multichip package using same
JP2522182B2 (ja) 半導体装置
US20070267756A1 (en) Integrated circuit package and multi-layer lead frame utilized
JP2913858B2 (ja) 混成集積回路
KR100352115B1 (ko) 반도체패키지
JP2000068405A (ja) 半導体装置およびその製造方法
JP2629461B2 (ja) 樹脂封止形半導体装置
JPS59231826A (ja) 半導体装置