JPH0219627B2 - - Google Patents

Info

Publication number
JPH0219627B2
JPH0219627B2 JP59192506A JP19250684A JPH0219627B2 JP H0219627 B2 JPH0219627 B2 JP H0219627B2 JP 59192506 A JP59192506 A JP 59192506A JP 19250684 A JP19250684 A JP 19250684A JP H0219627 B2 JPH0219627 B2 JP H0219627B2
Authority
JP
Japan
Prior art keywords
lead frame
resin
tab
mold
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59192506A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6084852A (ja
Inventor
Yoshiaki Wakashima
Hideo Inayoshi
Kunihiko Nishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP19250684A priority Critical patent/JPS6084852A/ja
Publication of JPS6084852A publication Critical patent/JPS6084852A/ja
Publication of JPH0219627B2 publication Critical patent/JPH0219627B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP19250684A 1984-09-17 1984-09-17 レジンモールドｉｃの製造方法 Granted JPS6084852A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19250684A JPS6084852A (ja) 1984-09-17 1984-09-17 レジンモールドｉｃの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19250684A JPS6084852A (ja) 1984-09-17 1984-09-17 レジンモールドｉｃの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP57097668A Division JPS6034268B2 (ja) 1982-06-09 1982-06-09 Ｉｃ用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS6084852A JPS6084852A (ja) 1985-05-14
JPH0219627B2 true JPH0219627B2 (enrdf_load_stackoverflow) 1990-05-02

Family

ID=16292422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19250684A Granted JPS6084852A (ja) 1984-09-17 1984-09-17 レジンモールドｉｃの製造方法

Country Status (1)

Country Link
JP (1) JPS6084852A (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797668A (en) * 1980-12-10 1982-06-17 Mitsubishi Electric Corp Semiconductor device
JPS6034268B2 (ja) * 1982-06-09 1985-08-07 株式会社日立製作所 Ｉｃ用リ−ドフレ−ム

Also Published As

Publication number Publication date
JPS6084852A (ja) 1985-05-14

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