JPH02180679A - フレキシブルプリント配線用基板の製造方法 - Google Patents

フレキシブルプリント配線用基板の製造方法

Info

Publication number
JPH02180679A
JPH02180679A JP33410088A JP33410088A JPH02180679A JP H02180679 A JPH02180679 A JP H02180679A JP 33410088 A JP33410088 A JP 33410088A JP 33410088 A JP33410088 A JP 33410088A JP H02180679 A JPH02180679 A JP H02180679A
Authority
JP
Japan
Prior art keywords
polyimide precursor
precursor resin
printed wiring
flexible printed
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP33410088A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0479713B2 (enrdf_load_stackoverflow
Inventor
Yoshihiro Yamaguchi
能弘 山口
Tetsushi Tanno
淡野　哲志
Takashi Watanabe
尚 渡辺
Seiji Sato
誠治 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Priority to JP33410088A priority Critical patent/JPH02180679A/ja
Publication of JPH02180679A publication Critical patent/JPH02180679A/ja
Publication of JPH0479713B2 publication Critical patent/JPH0479713B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP33410088A 1988-12-29 1988-12-29 フレキシブルプリント配線用基板の製造方法 Granted JPH02180679A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33410088A JPH02180679A (ja) 1988-12-29 1988-12-29 フレキシブルプリント配線用基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33410088A JPH02180679A (ja) 1988-12-29 1988-12-29 フレキシブルプリント配線用基板の製造方法

Publications (2)

Publication Number Publication Date
JPH02180679A true JPH02180679A (ja) 1990-07-13
JPH0479713B2 JPH0479713B2 (enrdf_load_stackoverflow) 1992-12-16

Family

ID=18273526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33410088A Granted JPH02180679A (ja) 1988-12-29 1988-12-29 フレキシブルプリント配線用基板の製造方法

Country Status (1)

Country Link
JP (1) JPH02180679A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206590A (ja) * 1990-11-30 1992-07-28 Sumitomo Bakelite Co Ltd フレキシブル印刷回路用基板の製造方法
JP2003080630A (ja) * 2001-09-11 2003-03-19 Mitsui Chemicals Inc ポリイミド金属箔積層体
WO2005087388A1 (ja) * 2004-03-17 2005-09-22 Nippon Steel Chemical Co., Ltd. Ｈｄｄサスペンション用積層体の製造方法
US7060784B2 (en) 2003-06-25 2006-06-13 Shin-Etsu Chemical Co., Ltd. Polyimide precursor resin solution composition sheet
US7321496B2 (en) 2004-03-19 2008-01-22 Matsushita Electric Industrial Co., Ltd. Flexible substrate, multilayer flexible substrate and process for producing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5804830B2 (ja) * 2011-07-29 2015-11-04 株式会社カネカ 金属張積層板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5474762A (en) * 1977-11-28 1979-06-15 Fuji Photo Film Co Ltd Production of heat-sensitive recording sheet
JPS6119352A (ja) * 1984-06-30 1986-01-28 アクゾ・エヌ・ヴエー 可撓性多層ラミネート及びその製法
JPH02168694A (ja) * 1988-12-22 1990-06-28 Mitsui Toatsu Chem Inc フレキシブル金属箔積層板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5474762A (en) * 1977-11-28 1979-06-15 Fuji Photo Film Co Ltd Production of heat-sensitive recording sheet
JPS6119352A (ja) * 1984-06-30 1986-01-28 アクゾ・エヌ・ヴエー 可撓性多層ラミネート及びその製法
JPH02168694A (ja) * 1988-12-22 1990-06-28 Mitsui Toatsu Chem Inc フレキシブル金属箔積層板の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206590A (ja) * 1990-11-30 1992-07-28 Sumitomo Bakelite Co Ltd フレキシブル印刷回路用基板の製造方法
JP2003080630A (ja) * 2001-09-11 2003-03-19 Mitsui Chemicals Inc ポリイミド金属箔積層体
US7060784B2 (en) 2003-06-25 2006-06-13 Shin-Etsu Chemical Co., Ltd. Polyimide precursor resin solution composition sheet
WO2005087388A1 (ja) * 2004-03-17 2005-09-22 Nippon Steel Chemical Co., Ltd. Ｈｄｄサスペンション用積層体の製造方法
US7321496B2 (en) 2004-03-19 2008-01-22 Matsushita Electric Industrial Co., Ltd. Flexible substrate, multilayer flexible substrate and process for producing the same
US7773386B2 (en) 2004-03-19 2010-08-10 Panasonic Corporation Flexible substrate, multilayer flexible substrate

Also Published As

Publication number Publication date
JPH0479713B2 (enrdf_load_stackoverflow) 1992-12-16

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