JPH02180679A - Preparation of flexible printed wiring board - Google Patents
Preparation of flexible printed wiring boardInfo
- Publication number
- JPH02180679A JPH02180679A JP33410088A JP33410088A JPH02180679A JP H02180679 A JPH02180679 A JP H02180679A JP 33410088 A JP33410088 A JP 33410088A JP 33410088 A JP33410088 A JP 33410088A JP H02180679 A JPH02180679 A JP H02180679A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide precursor
- precursor resin
- printed wiring
- flexible printed
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims abstract description 35
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 229920001721 polyimide Polymers 0.000 claims abstract description 33
- 239000004642 Polyimide Substances 0.000 claims abstract description 30
- 239000002243 precursor Substances 0.000 claims abstract description 30
- 238000001035 drying Methods 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000007667 floating Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 239000011889 copper foil Substances 0.000 abstract description 6
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 abstract description 3
- 239000009719 polyimide resin Substances 0.000 abstract description 3
- 239000011888 foil Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229920005575 poly(amic acid) Polymers 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 23
- 239000000758 substrate Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- XFDUHJPVQKIXHO-UHFFFAOYSA-N 3-aminobenzoic acid Chemical compound NC1=CC=CC(C(O)=O)=C1 XFDUHJPVQKIXHO-UHFFFAOYSA-N 0.000 description 2
- 241000989747 Maba Species 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- YDYSEBSNAKCEQU-UHFFFAOYSA-N 2,3-diamino-n-phenylbenzamide Chemical compound NC1=CC=CC(C(=O)NC=2C=CC=CC=2)=C1N YDYSEBSNAKCEQU-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- -1 aromatic tetracarboxylic acid Chemical class 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はポリイミド樹脂を導体上に直接塗布してなるフ
レキシブルプリント配線用基板の製造方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a flexible printed wiring board by directly applying a polyimide resin onto a conductor.
銅箔等の導体上にポリイミド前駆体樹脂７容液を直接塗
布し、乾燥および硬化してフレキシブルプリント配線用
基板を製造することは特開昭６２−２１２１４０号公報
等で知られている。この方法は接着剤を使用しないため
、カール発生の低減、ｉ５を熱性の向上環の利点を有す
るが、使用するポリイミド前駆体樹脂の種類によっては
多少のカール発生、接着力の不足などの問題が生ずるこ
とがあることが認められた。そして、これらの問題点の
多くは複数のポリイミド前駆体樹脂を使用することによ
り解決できることが見出された。It is known from Japanese Patent Application Laid-Open No. 62-212140 to manufacture a flexible printed wiring board by directly applying a 7 volume solution of polyimide precursor resin onto a conductor such as copper foil, drying and curing. Since this method does not use adhesive, it has the advantage of reducing curling and improving thermal properties of i5, but depending on the type of polyimide precursor resin used, there are problems such as slight curling and insufficient adhesive strength. It was recognized that this may occur. It has been found that many of these problems can be solved by using multiple polyimide precursor resins.
Ｃ発明が解決しようとする課題〕
本発明の目的は複数のポリイミド前駆体樹脂溶液を塗布
、乾燥、硬化を行うに当たり、装置構成を少なくし、操
作を簡易にしてフレキシブルプリント配線用基板を連続
的に製造することである。C Problems to be Solved by the Invention] The purpose of the present invention is to reduce the equipment configuration and simplify the operation when applying, drying, and curing multiple polyimide precursor resin solutions to continuously form flexible printed wiring boards. It is to be manufactured in
（課題を解決するための手段〕
本発明は導体上に複数のポリイミド前駆体樹脂溶液を層
状に塗布し、乾燥および硬化させることによるフレキシ
ブルプリント配線用基板の製造方法である。(Means for Solving the Problems) The present invention is a method of manufacturing a flexible printed wiring board by applying a plurality of polyimide precursor resin solutions on a conductor in layers, drying and curing the solution.
導体は金属箔であり、好ましくは５〜１５０μｍの厚み
の銅箔である。ポリイミド前駆体樹脂は加熱硬化させる
ことによりイミド結合を生ずるものであり、代表的には
ポリアミック酸である。好ましくは、少なくとも１種の
ポリイミド前駆体樹脂が線膨張係数３Ｘ１（Ｉ’以下の
樹脂を与えるものであり、このような樹脂は前記特開昭
６２−２１２１４０号公報等に記載されているが、より
好ましくは特開昭６３−２４５９８８号公報、特開昭６
３−８４１８８号公報等に記載されたようなジアミノベ
ンズアニリド又はその誘導体を含むジアミン類と芳香族
テトラカルボン酸とを反応させて得られる樹脂である。The conductor is a metal foil, preferably a copper foil with a thickness of 5 to 150 μm. The polyimide precursor resin generates imide bonds by heating and curing, and is typically polyamic acid. Preferably, at least one polyimide precursor resin provides a resin with a linear expansion coefficient of 3X1 (I' or less), and such resins are described in the above-mentioned Japanese Patent Application Laid-Open No. 62-212140, etc. More preferably, JP-A-63-245988, JP-A-6
It is a resin obtained by reacting diamines containing diaminobenzanilide or its derivatives with an aromatic tetracarboxylic acid as described in Publication No. 3-84188 and the like.
ポリイミド前駆体樹脂はジメチルアセトアミド、Ｎ−メ
チル−２−ピロリドン等の溶媒に溶解した溶液して使用
される。そして、ポリイミド前駆体樹脂溶液は２種以上
使用し、これを層状に塗布する。なお、層状に塗布する
ためには、一定板上の粘度を有するポリイミド前駆体樹
脂溶液を使用すればよい。The polyimide precursor resin is used in the form of a solution dissolved in a solvent such as dimethylacetamide or N-methyl-2-pyrrolidone. Two or more kinds of polyimide precursor resin solutions are used and applied in a layered manner. In addition, in order to apply it in a layered manner, a polyimide precursor resin solution having a constant plate viscosity may be used.
少なくとも１種のポリイミド前駆体樹脂溶液は直接、導
体上に塗布すると共に、少なくとも１種のポリイミド前
駆体樹脂溶液は他のポリイミド前駆体樹脂溶液の上に層
を形成するように塗布する。The at least one polyimide precursor resin solution is applied directly onto the conductor, and the at least one polyimide precursor resin solution is applied to form a layer over another polyimide precursor resin solution.
この塗布は、塗布された未乾燥のポリイミド前駆体樹脂
溶液の層に逐次他のポリイミド前駆体樹脂ｉ−？ＪＩを
塗布してもよいが、好ましくは、少なくとも２種類のポ
リイミド前駆体樹脂溶液を同時に塗布する。同時に塗布
する手段としては多層ダイを用いる方法が好ましい、な
お、３層以上を塗布する場合は、少なくとも２層につい
て本発明の方法により塗布すればよいが、装置の簡易化
の点からは全層を同時に塗布することが好ましい。This application is performed by sequentially applying other polyimide precursor resin i-? JI may be applied, but preferably at least two types of polyimide precursor resin solutions are applied simultaneously. A method using a multilayer die is preferable as a means for simultaneously coating. In addition, when coating three or more layers, at least two layers may be coated by the method of the present invention, but from the viewpoint of simplifying the equipment, it is preferable to coat all layers. It is preferable to apply both at the same time.
ポリイミド前駆体樹脂溶液の層を複数層塗布したのち、
乾燥および硬化させて、ポリイミド前駆体樹脂溶液をポ
リイミド樹脂とする。乾燥は通常、１５０℃以下、好ま
しくは９０〜１３０℃で行われ、硬化はイミド化が生ず
る温度以上、通常１３０℃以上好ましくは２００〜４０
０℃、より好ましくは２５０〜３６０℃で行われる。After applying multiple layers of polyimide precursor resin solution,
The polyimide precursor resin solution is dried and cured to form a polyimide resin. Drying is usually carried out at 150°C or lower, preferably 90 to 130°C, and curing is carried out at a temperature higher than the temperature at which imidization occurs, usually 130°C or higher, preferably 200 to 40°C.
It is carried out at 0°C, more preferably at 250-360°C.
乾燥および硬化に用いる装置としては、任意のものを使
用することができるが、塗布された導体（以下、基体と
いう）が、装置に接触しないフローティング形式のもの
を使用することが好ましい。Although any device can be used for drying and curing, it is preferable to use a floating type device in which the applied conductor (hereinafter referred to as the substrate) does not come into contact with the device.
フローティング形式とは、基体を気流中に浮遊させた状
態で乾燥および硬化を行うものであり、基体を連続的に
走行させつつ、基体面に対して上又は下に配置したノズ
ルから均一に気流を基体面に向けて吹き出し、走行する
基体を浮遊させると共に、波を打つように湾曲しながら
走行させるものである。このようなフローティング形式
のものを使用することにより、よりカールの少ない製品
を得ることができる。加熱は熱風を気流として吹き出す
ことにより行うことが好ましいが、赤外線加熱、電磁誘
導加熱等を使用又は併用してもよい。The floating method is a method in which drying and curing are performed while the substrate is suspended in an airflow, and while the substrate is continuously running, airflow is uniformly applied from nozzles placed above or below the substrate surface. Air is blown toward the surface of the substrate, causing the traveling substrate to float, and to travel while curving in waves. By using such a floating type, a product with less curl can be obtained. Heating is preferably performed by blowing out hot air as an air stream, but infrared heating, electromagnetic induction heating, etc. may be used or used in combination.
乾燥および硬化は順次温度を高めるようにして行うこと
が好ましいので、複数の乾燥室および硬化室を設け、基
体の走行方向に従って順次その温度を高くすることが望
ましい。また、乾燥器と硬化器は一体の連続したもので
あっても何ら差支えない。Since drying and curing are preferably carried out by increasing the temperature sequentially, it is desirable to provide a plurality of drying chambers and curing chambers and to increase the temperature sequentially in accordance with the traveling direction of the substrate. Moreover, there is no problem even if the dryer and the hardener are integrated and continuous.
塗布するポリイミド前駆体樹脂溶液については、均一な
塗膜を得るため、および塗膜の絶縁性を向上させるため
には、溶液中に混入した異物を取り除くことが好ましく
、溶液装入ラインにフィルターを入れることがよい。Regarding the polyimide precursor resin solution to be applied, in order to obtain a uniform coating film and improve the insulation properties of the coating film, it is preferable to remove foreign substances mixed into the solution, and a filter is installed in the solution charging line. It's good to put it in.
フィルターとしてはステンレススチール製の焼結フィル
ター又は不織布が適している。フィルターはその寿命を
長くするため、２段階以上の多段階に配置することがよ
く、その場合はｊｌＩｉ次フィシフイルターを小さくす
ることがよい、孔径は１００〜１．ｕｎが好ましい。ま
た、ポリイミド前駆体樹脂溶液の装入ラインを複数設け
、並列に配置するとフィルター交換の作業性が向上する
。また、塗布するポリイミド前駆体樹脂溶液は予め脱泡
器で脱泡しておくことが好ましい。Suitable filters are sintered stainless steel filters or non-woven fabrics. In order to extend the life of the filter, it is best to arrange it in multiple stages of two or more. In that case, it is better to make the jlIi order filter small, with a pore diameter of 100 to 1. un is preferred. Furthermore, if a plurality of charging lines for the polyimide precursor resin solution are provided and arranged in parallel, the workability of filter replacement will be improved. Further, it is preferable that the polyimide precursor resin solution to be applied be defoamed in advance using a defoamer.
以下、実施例に基づいて、本発明を具体的に説明する。 The present invention will be specifically described below based on Examples.
線膨張係数は、イミド化反応が十分終了した試料を用い
、サーモメカニカルアナライザー（ＴＭＡ）を用いて、
２５０℃に昇温後に１０℃／ｍｉｎで冷却して２４０℃
から１００℃までの平均の線膨張係数を算出して求めた
。The coefficient of linear expansion is determined using a thermomechanical analyzer (TMA) using a sample that has undergone sufficient imidization reaction.
After heating to 250℃, cool at 10℃/min to 240℃
The average linear expansion coefficient from 100°C to 100°C was calculated.
接着力は、テンションテスターを用い、輻１０ｍ１１１
の銅張品の樹脂側を両面テープによりアルミ板に固定し
、銅を１８０″′方向に５ ｍｍ／ｍｉｎの速度で剥離
して求めた。Adhesive strength was measured using a tension tester with a radius of 10m111
The resin side of the copper-clad product was fixed to an aluminum plate with double-sided tape, and the copper was peeled off in the 180'' direction at a speed of 5 mm/min.
加熱収縮率は、幅１０ｍｍ、長さ２００ｍｍの導体をエ
ツチングした後のフィルムを用い、２５０℃の熱風オー
ブン中で３０分間熱処理し、その前後の寸法変化率によ
り求めた。The heat shrinkage rate was determined from the dimensional change rate before and after heat treatment using a film after etching a conductor with a width of 10 mm and a length of 200 mm in a hot air oven at 250° C. for 30 minutes.
エツチング後のフィルムのカールは、導体を塩化第二鉄
水溶液で全面エツチングした後、縦１０ｃｍＸｔＲ１０
ｃｍｘ厚さ２５μｍの大きさのフィルムを１００℃で１
０分間乾燥した後、発生したカールの曲率半径を求めて
数値化した。The curl of the film after etching is determined by etching the entire surface of the conductor with a ferric chloride aqueous solution, and then etching the film with a length of 10 cm
A film with a size of cm x 25 μm thick was heated at 100°C.
After drying for 0 minutes, the radius of curvature of the curls generated was determined and quantified.
エツチング後のフィルムの強度及び弾性率は、ＪＩＳ
Ｚ−１７０２、ＡＳＴＭ Ｄ−８８２６７に準
じて測定した。The strength and elastic modulus of the film after etching are JIS
Measured according to Z-1702 and ASTM D-88267.
なお、各側における略号は以下のとおりである。The abbreviations on each side are as follows.
ＰＭＤＡ ：ビロメリフト酸二無水物
ＢＴＤＡ：３．３′、４．４′−ベンヅフェノンテトラ
カルボン酸二無水物
ＤＤＥ ：４．４’−ジアミノジフェニルエーテル
ＭＡＢＡ ： ２ ”−メチル−４，４′−ジアミノベ
ンズアニリド
ＤＭＡＣニジメチルアセトアミド
合成例Ｉ
ＤＤＥｌ、２ｋｇをＤＭＡＣ２７ｋｇに溶解した後１０
℃に冷却し、ＢＴＤＡｌ、９ｋｇを徐々に加えて、反応
させ、粘稠なポリイミド前駆体樹脂溶液Ａを得た。PMDA: Bilomeliftic dianhydride BTDA: 3.3',4.4'-benzuphenonetetracarboxylic dianhydride DDE: 4.4'-diaminodiphenyl ether MABA: 2''-methyl-4,4'-diamino Benzanilide DMAC Nidimethylacetamide Synthesis Example I After dissolving 2 kg of DDEl in 27 kg of DMAC,
The mixture was cooled to 0.degree. C., and 9 kg of BTDAl was gradually added thereto to cause a reaction, thereby obtaining a viscous polyimide precursor resin solution A.
合成例２
ＭＡＢＡ５．２ｋｆとＤＤＥ４．０ｋｇをＤ Ｍ Ａ
Ｃ１０２ｋｇに溶解した後、１０℃に冷却し、Ｐ Ｍ
ＤＡ８．８ｋｇを徐々に加えて、反応させ、粘稠なポリ
イミド前駆体樹脂溶液Ｂを得た。Synthesis Example 2 DMA 5.2kf of MABA and 4.0kg of DDE
After dissolving in 102 kg of C, it was cooled to 10°C and P M
8.8 kg of DA was gradually added and reacted to obtain a viscous polyimide precursor resin solution B.
実施例
第１図の装置にて、銅箔１に第１層がポリイミド前駆体
樹脂溶液、第２層がポリイミド前駆体樹脂溶液Ｂ１第３
層がポリイミド前駆体樹脂溶液Ａでそれぞれのフィルム
厚さが８．１７．２μｍになるよう多層ダイ２で同時に
塗布し、その後１３０〜３６０℃まで順次温度が高めら
れ複数のフローティング形式の乾燥器３および硬化器４
を２２分かけて走行させることにより、乾燥および硬化
を行い、樹脂層の厚み２７μｍの銅張品を巻取り機５で
巻取った。得られた洞張品すなわち、フレキシブルプリ
ント配線用基板は接着力１．８ｋｔｒ１国、カールは略
平ら、加熱収縮率０． １％、熱膨張係数が１１ Ｘ
１０−’ （１／Ｋ）の良好なものであった。Example In the apparatus shown in FIG. 1, the first layer was a polyimide precursor resin solution and the second layer was a polyimide precursor resin solution B1 and a third layer were applied to the copper foil 1.
The layers are simultaneously coated with a polyimide precursor resin solution A using a multilayer die 2 so that each film has a thickness of 8.17.2 μm, and then the temperature is sequentially increased from 130 to 360° C., and a plurality of floating type dryers 3 are applied. and hardener 4
was run for 22 minutes to dry and cure, and a copper-clad product with a resin layer thickness of 27 μm was wound up with a winding machine 5. The obtained product, that is, the flexible printed wiring board, has an adhesive strength of 1.8 ktr1, a substantially flat curl, and a heat shrinkage rate of 0. 1%, thermal expansion coefficient 11
It was a good value of 10-' (1/K).
本発明の製造方法によれば、簡易な装置および節易な操
作で、カールのない、耐熱性や接着性に優れた筋品質の
フレキシブルプリント配線用基板を製造することができ
る。According to the manufacturing method of the present invention, a curl-free flexible printed wiring board with excellent heat resistance and adhesive properties and streak quality can be manufactured with a simple device and easy operation.
第１図は本発明の実施例のフローシートを示すものであ
る。
１ ・・−・−−−一−−・・・・・銅箔、２ ・・−
−−一−・・・多層グイ、３−・−−−−−−一 乾燥
器、４ ・−・−・・−・−硬化器、５ ・−−−−−
−一 巻取り機FIG. 1 shows a flow sheet of an embodiment of the present invention. 1 ・・−・−−−1−−・・・・Copper foil, 2 ・・−
−−1−・・・Multilayer gooey, 3−・−−−−−−1 Dryer, 4 ・−・−・・−・−Harder, 5 ・−−−−−
-1 Winding machine
Claims (3)
塗布し、乾燥および硬化させることを特徴とするフレキ
シブルプリント配線用基板の製造方法。1. A method for manufacturing a flexible printed wiring board, comprising applying a plurality of polyimide precursor resin solutions on a conductor in layers, drying and curing the layers.
イを用いて直接同時に、層状に塗布し、乾燥および硬化
させることを特徴とするフレキシブルプリント配線用基
板の製造方法。2. A method for manufacturing a flexible printed wiring board, which comprises directly and simultaneously applying a plurality of polyimide precursor resin solutions onto a conductor in layers using a multilayer die, drying and curing the solution.
１又は２記載のフレキシブルプリント配線用基板の製造
方法。3. 3. The method for manufacturing a flexible printed wiring board according to claim 1, wherein drying and curing are performed in a floating manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33410088A JPH02180679A (en) | 1988-12-29 | 1988-12-29 | Preparation of flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33410088A JPH02180679A (en) | 1988-12-29 | 1988-12-29 | Preparation of flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02180679A true JPH02180679A (en) | 1990-07-13 |
| JPH0479713B2 JPH0479713B2 (en) | 1992-12-16 |
Family
ID=18273526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33410088A Granted JPH02180679A (en) | 1988-12-29 | 1988-12-29 | Preparation of flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02180679A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206590A (en) * | 1990-11-30 | 1992-07-28 | Sumitomo Bakelite Co Ltd | Manufacture of flexible printed circuit board |
| JP2003080630A (en) * | 2001-09-11 | 2003-03-19 | Mitsui Chemicals Inc | Polyimide metallic foil laminate |
| WO2005087388A1 (en) * | 2004-03-17 | 2005-09-22 | Nippon Steel Chemical Co., Ltd. | Process for production of laminates for hdd suspension |
| US7060784B2 (en) | 2003-06-25 | 2006-06-13 | Shin-Etsu Chemical Co., Ltd. | Polyimide precursor resin solution composition sheet |
| US7321496B2 (en) | 2004-03-19 | 2008-01-22 | Matsushita Electric Industrial Co., Ltd. | Flexible substrate, multilayer flexible substrate and process for producing the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5804830B2 (en) * | 2011-07-29 | 2015-11-04 | 株式会社カネカ | Method for producing metal-clad laminate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5474762A (en) * | 1977-11-28 | 1979-06-15 | Fuji Photo Film Co Ltd | Production of heat-sensitive recording sheet |
| JPS6119352A (en) * | 1984-06-30 | 1986-01-28 | アクゾ・エヌ・ヴエー | Flexible multilayer laminate and manufacture thereof |
| JPH02168694A (en) * | 1988-12-22 | 1990-06-28 | Mitsui Toatsu Chem Inc | Flexible laminate and manufacture thereof |
-
1988
- 1988-12-29 JP JP33410088A patent/JPH02180679A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5474762A (en) * | 1977-11-28 | 1979-06-15 | Fuji Photo Film Co Ltd | Production of heat-sensitive recording sheet |
| JPS6119352A (en) * | 1984-06-30 | 1986-01-28 | アクゾ・エヌ・ヴエー | Flexible multilayer laminate and manufacture thereof |
| JPH02168694A (en) * | 1988-12-22 | 1990-06-28 | Mitsui Toatsu Chem Inc | Flexible laminate and manufacture thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206590A (en) * | 1990-11-30 | 1992-07-28 | Sumitomo Bakelite Co Ltd | Manufacture of flexible printed circuit board |
| JP2003080630A (en) * | 2001-09-11 | 2003-03-19 | Mitsui Chemicals Inc | Polyimide metallic foil laminate |
| JP4667675B2 (en) * | 2001-09-11 | 2011-04-13 | 三井化学株式会社 | Polyimide metal foil laminate |
| US7060784B2 (en) | 2003-06-25 | 2006-06-13 | Shin-Etsu Chemical Co., Ltd. | Polyimide precursor resin solution composition sheet |
| WO2005087388A1 (en) * | 2004-03-17 | 2005-09-22 | Nippon Steel Chemical Co., Ltd. | Process for production of laminates for hdd suspension |
| US7321496B2 (en) | 2004-03-19 | 2008-01-22 | Matsushita Electric Industrial Co., Ltd. | Flexible substrate, multilayer flexible substrate and process for producing the same |
| US7773386B2 (en) | 2004-03-19 | 2010-08-10 | Panasonic Corporation | Flexible substrate, multilayer flexible substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0479713B2 (en) | 1992-12-16 |
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